Method of producing a silicon-on-insulator article
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-021/762
H01L-027/12
H01L-029/772
H01L-021/20
H01L-021/84
H01L-029/786
출원번호
US-0356393
(2012-11-02)
등록번호
US-9142448
(2015-09-22)
국제출원번호
PCT/AU2012/001348
(2012-11-02)
국제공개번호
WO2013/063652
(2013-05-10)
발명자
/ 주소
Brawley, Andrew John
Atanackovic, Petar Branko
Black, Andrew John
Lim, Yong Cheow Gary
출원인 / 주소
THE SILANNA GROUP PTY LTD
대리인 / 주소
Nixon Peabody LLP
인용정보
피인용 횟수 :
0인용 특허 :
3
초록▼
A method of producing a silicon-on-insulator article, the method including: forming a first aluminum nitride layer thermally coupled to a first silicon substrate; forming a second aluminum nitride layer thermally coupled to a second substrate, the second substrate including at least a surface layer
A method of producing a silicon-on-insulator article, the method including: forming a first aluminum nitride layer thermally coupled to a first silicon substrate; forming a second aluminum nitride layer thermally coupled to a second substrate, the second substrate including at least a surface layer of silicon; bonding the first and second aluminum nitride layers of the first and second substrates together so that the first and second aluminum nitride layers are disposed between the first and second substrates; and removing most of the second substrate to leave a layer of silicon that is electrically insulated from but thermally coupled to the first silicon substrate by the first and second aluminum nitride layers.
대표청구항▼
1. A method of producing a silicon-on-insulator article, the method including: forming a first aluminium nitride layer thermally coupled to a first silicon substrate;forming a second aluminium nitride layer thermally coupled to a second substrate, the second substrate including at least a surface la
1. A method of producing a silicon-on-insulator article, the method including: forming a first aluminium nitride layer thermally coupled to a first silicon substrate;forming a second aluminium nitride layer thermally coupled to a second substrate, the second substrate including at least a surface layer of silicon;bonding the first and second aluminium nitride layers of the first and second substrates together so that the first and second aluminium nitride layers are disposed between the first and second substrates; andremoving a portion the second substrate to leave a layer of silicon that is electrically insulated from but thermally coupled to the first silicon substrate by the first and second aluminium nitride layers;wherein a combined thickness of the bonded aluminium nitride layers is selected to be at least 200 nm to provide electrical isolation between the first silicon substrate and CMOS devices formed in the layer of silicon, while the thermal conductivities of the first and second aluminium nitride layers nevertheless enable conduction of heat through the bonded aluminium nitride layers to mitigate self-heating of the CMOS devices formed in the layer of silicon, wherein the combined thickness of the bonded aluminium nitride layers is about 2 μm. 2. A method of producing a silicon-on-insulator article, the method including: forming a first aluminium nitride layer thermally coupled to a first silicon substrate;forming a second aluminium nitride layer thermally coupled to a second substrate, the second substrate including at least a surface layer of silicon;bonding the first and second aluminium nitride layers of the first and second substrates together so that the first and second aluminium nitride layers are disposed between the first and second substrates; andremoving a portion the second substrate to leave a layer of silicon that is electrically insulated from but thermally coupled to the first silicon substrate by the first and second aluminium nitride layers;wherein a combined thickness of the bonded aluminium nitride layers is selected to be at least 200 nm to provide electrical isolation between the first silicon substrate and CMOS devices formed in the layer of silicon, while the thermal conductivities of the first and second aluminium nitride layers nevertheless enable conduction of heat through the bonded aluminium nitride layers to mitigate self-heating of the CMOS devices formed in the layer of silicon, wherein the combined thickness of the bonded aluminium nitride layers is at least 2 μm. 3. The method of claim 2, wherein the first silicon substrate has an electrical resistivity of at least 100 Ohm-cm. 4. The method of claim 2, wherein the first silicon substrate has a (111) crystal orientation. 5. The method of claim 2, wherein the first silicon substrate has a (100) crystal orientation. 6. The method of claim 2, wherein the first aluminium nitride layer is epitaxially grown on the first silicon substrate. 7. The method of claim 2, wherein the second aluminium nitride layer is epitaxially grown on the second substrate. 8. The method of claim 2, wherein the first and second aluminium nitride layers are simultaneously epitaxially grown on the first and second substrates. 9. The method of claim 6, wherein at least the first of the aluminium nitride layers has an (002) crystal orientation. 10. The method of claim 2, wherein the layer of silicon has a (100) crystal orientation. 11. The method of claim 2, wherein the layer of silicon has an electrical resistivity of at least 100 Ohm-cm. 12. The method of claim 2, wherein the second substrate is a bulk silicon substrate. 13. The method of claim 12, wherein said removing includes splitting the bulk silicon substrate using an ion cut process. 14. The method of claim 2, wherein the second substrate is a silicon-on-insulator substrate. 15. A method of producing a silicon-on-insulator article, the method including: forming a first aluminium nitride layer thermally coupled to a first silicon substrate;forming a second aluminium nitride layer thermally coupled to a second substrate, the second substrate including at least a surface layer of silicon;bonding the first and second aluminium nitride layers of the first and second substrates together so that the first and second aluminium nitride layers are disposed between the first and second substrates;removing a portion the second substrate to leave a layer of silicon that is electrically insulated from but thermally coupled to the first silicon substrate by the first and second aluminium nitride layers;wherein a combined thickness of the bonded aluminium nitride layers is selected to be at least 200 nm to provide electrical isolation between the first silicon substrate and CMOS devices formed in the layer of silicon, while the thermal conductivities of the first and second aluminium nitride layers nevertheless enable conduction of heat through the bonded aluminium nitride layers to mitigate self-heating of the CMOS devices formed in the layer of silicon; andforming respective silicon nitride layers on the first substrate and the second substrate; wherein the first and second aluminium nitride layers are formed on the respective silicon nitride layers. 16. A method of producing a silicon-on-insulator article, the method including: forming a first aluminium nitride layer thermally coupled to a first silicon substrate;forming a second aluminium nitride layer thermally coupled to a second substrate, the second substrate including at least a surface layer of silicon;bonding the first and second aluminium nitride layers of the first and second substrates together so that the first and second aluminium nitride layers are disposed between the first and second substrates;removing a portion the second substrate to leave a layer of silicon that is electrically insulated from but thermally coupled to the first silicon substrate by the first and second aluminium nitride layers;wherein a combined thickness of the bonded aluminium nitride layers is selected to be at least 200 nm to provide electrical isolation between the first silicon substrate and CMOS devices formed in the layer of silicon, while the thermal conductivities of the first and second aluminium nitride layers nevertheless enable conduction of heat through the bonded aluminium nitride layers to mitigate self-heating of the CMOS devices formed in the layer of silicon; andforming respective first and second bonding layers on the first and second aluminium nitride layers; wherein said bonding includes bonding the first and second bonding layers of the first and second substrates together so that the first and second bonding layers are disposed between the first and second aluminium nitride layers; wherein the first and second bonding layers are silicon layers. 17. The method of claim 16, wherein the first aluminium nitride layer is epitaxially grown on the first silicon substrate. 18. The method of claim 16, wherein the second aluminium nitride layer is epitaxially grown on the second substrate. 19. The method of claim 16, wherein the first and second aluminium nitride layers are simultaneously epitaxially grown on the first and second substrates. 20. The method of claim 16, wherein at least the first of the aluminium nitride layers has an (002) crystal orientation. 21. A method of producing a silicon-on-insulator article, the method including: epitaxially growing an aluminium nitride layer on a single-crystal silicon substrate; andepitaxially growing a silicon layer on the aluminium nitride layer;wherein the silicon layer is electrically insulated from but thermally coupled to the silicon substrate by the aluminium nitride layer, a thickness of the epitaxial aluminium nitride layer being selected to be at least 200 nm to provide electrical isolation between the single-crystal silicon substrate and CMOS devices formed in the silicon layer, while the thermal conductivity of the epitaxial aluminium nitride layer nevertheless enables conduction of heat through the epitaxial aluminium nitride layer to the single-crystal silicon substrate to mitigate self-heating of the CMOS devices formed in the silicon layer. 22. A silicon-on-insulator article produced by the method of claim 2. 23. A silicon-on-insulator article, including: a first silicon layer;a silicon substrate; andaluminium nitride layers disposed between the first silicon layer and the silicon substrate; andat least one bonding layer disposed between the aluminium nitride layers; wherein the first silicon layer is electrically insulated from but thermally coupled to the silicon substrate by the aluminium nitride layers, a thickness of the aluminium nitride layers being at least 200 nm to provide substantial electrical isolation between the first silicon substrate and CMOS devices formed in the silicon layer, while the thermal conductivities of the aluminium nitride layers nevertheless enable conduction of heat through the aluminium nitride layers to the silicon substrate to mitigate self-heating of the CMOS devices formed in the first silicon layer, wherein the at least one bonding layer includes at least one second silicon layer. 24. The article of claim 23, wherein the silicon substrate has a (111) orientation. 25. The article of claim 23, wherein the silicon substrate, the first silicon layer and the aluminium nitride layer are mutually epitaxial. 26. The article of claim 23, wherein the first silicon layer has a (100) orientation. 27. The article of claim 26, wherein each of the aluminium nitride layers has a (002) orientation.
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이 특허에 인용된 특허 (3)
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