초록 ▼

A heat pump includes a SAS structure with a wall defining a first open side and a second open side. The heat pump also includes an interconnect board, enclosed within the SAS structure including openings. Thermoelectric modules are mounted on the interconnect board at the locations defined by the op

A heat pump includes a SAS structure with a wall defining a first open side and a second open side. The heat pump also includes an interconnect board, enclosed within the SAS structure including openings. Thermoelectric modules are mounted on the interconnect board at the locations defined by the openings. The heat pump additionally includes a hot-side heat spreader that is in thermal contact with the first side of each thermoelectric module and a cold-side heat spreader that is in thermal contact with the second side of each thermoelectric module. The periphery of the hot-side heat spreader mechanically contacts the wall of the SAS structure at the first open side, and the periphery of the cold-side heat spreader mechanically contacts the wall of the SAS structure at the second open side such that any compression force applied to the heat pump is absorbed by the SAS structure.

대표청구항 ▼

1. A heat pump, comprising: a surround and spacer (SAS) structure comprising a wall defining a first open side and a second open side;an interconnect board enclosed within the SAS structure, the interconnect board comprising one or more openings from a first surface of the interconnect board to a se

1. A heat pump, comprising: a surround and spacer (SAS) structure comprising a wall defining a first open side and a second open side;an interconnect board enclosed within the SAS structure, the interconnect board comprising one or more openings from a first surface of the interconnect board to a second surface of the interconnect board, the one or more openings defining locations at which a plurality of thermoelectric modules are to be mounted on the interconnect board;the plurality of thermoelectric modules mounted on the interconnect board at the locations defined by the one or more openings, each thermoelectric module of the plurality of thermoelectric modules having a first side and a second side;a hot-side heat spreader that is in thermal contact with the first side of each thermoelectric module of the plurality of thermoelectric modules; anda cold-side heat spreader that is in thermal contact with the second side of each thermoelectric module of the plurality of thermoelectric modules;wherein a periphery of the hot-side heat spreader mechanically contacts the wall of the SAS structure at the first open side, and a periphery of the cold-side heat spreader mechanically contacts the wall of the SAS structure at the second open side such that a compression force applied to the heat pump is absorbed by the SAS structure. 2. The heat pump of claim 1 further comprising an environmental seal located where the periphery of the hot-side heat spreader mechanically contacts the wall of the SAS structure and where the periphery of the cold-side heat spreader mechanically contacts the wall of the SAS structure. 3. The heat pump of claim 1 wherein a thickness of the wall of the SAS structure is such that a thermal short between the hot-side heat spreader and the cold-side heat spreader is mitigated while providing sufficient strength to withstand at least a predefined amount of a compression force applied to the heat pump. 4. The heat pump of claim 1 wherein a height of the SAS structure defines a distance between the hot-side heat spreader and the cold-side heat spreader where the distance is such that a thermal short between the hot-side heat spreader and the cold-side heat spreader is mitigated while mitigating a thermal resistance of one or both of the hot-side heat spreader and the cold-side heat. 5. The heat pump of claim 1 wherein a combined area of the second sides of the plurality of thermoelectric modules is greater than fifty percent of the area of the interconnect board. 6. The heat pump of claim 5 wherein the combined area of the second sides of the plurality of thermoelectric modules is greater than seventy-five percent of the area of the interconnect board. 7. The heat pump of claim 1 further comprising insulation between the hot-side heat spreader and the cold-side heat spreader and enclosed in the SAS structure. 8. The heat pump of claim 7 wherein the insulation is preformed. 9. The heat pump of claim 7 wherein the insulation is injected. 10. The heat pump of claim 1 wherein the hot-side heat spreader and the cold-side heat spreader are attached to the SAS structure by a mechanical fastener. 11. The heat pump of claim 10 wherein the mechanical fastener is selected from the group consisting of a screw, a bolt, and a rivet. 12. The heat pump of claim 1 wherein the hot-side heat spreader and the cold-side heat spreader are attached to the SAS structure by a chemical fastener. 13. The heat pump of claim 12 wherein the chemical fastener is selected from the group consisting of a glue, an epoxy, and an acrylic adhesive. 14. The heat pump of claim 1 wherein at least one of the hot-side heat spreader and the cold-side heat spreader is attached to the SAS structure by a snap fastener. 15. The heat pump of claim 14 wherein the snap fastener includes a lip around a periphery of the SAS structure that allows the at least one of the hot-side heat spreader and the cold side heat spreader to be attached to the SAS structure by tension. 16. The heat pump of claim 1 wherein the second open side of the SAS structure is smaller than the cold-side heat spreader, and the cold-side heat spreader is within the SAS structure at the second open side of the SAS structure. 17. The heat pump of claim 16 wherein the SAS structure is tapered such that the second open side of the SAS structure is smaller than the first open side of the SAS structure. 18. The heat pump of claim 1 further comprising one or more wires electrically attached to the interconnect board and exposed through the SAS structure. 19. The heat pump of claim 18 further comprising a cap to protect the one or more wires exposed through the SAS structure. 20. The heat pump of claim 1 wherein the interconnect board further comprises one or more electrical connectors exposed through the SAS structure.