초록 ▼

A through-substrate via (TSV) structure includes at least two electrically conductive via segments embedded in a substrate and separated from each other by an electrically conductive barrier layer therebetween. The length of each individual conductive via segment is typically equal to, or less than,

A through-substrate via (TSV) structure includes at least two electrically conductive via segments embedded in a substrate and separated from each other by an electrically conductive barrier layer therebetween. The length of each individual conductive via segment is typically equal to, or less than, the Blech length of the conductive material so that the stress-induced back flow force, generated by each conductive barrier layer, cancels the electromigration force in each conductive via segment. Consequently, the TSV structures are immune to electromigration, and provide reliable electrical connections among a chips stacked in 3 dimensions.

대표청구항 ▼

1. A method of forming a semiconductor structure comprising: forming at least one trench in a first substrate;filling said at least one trench with a conductive liner material and a conductive via segment material, wherein said conductive liner material constitutes a conductive liner located on side

1. A method of forming a semiconductor structure comprising: forming at least one trench in a first substrate;filling said at least one trench with a conductive liner material and a conductive via segment material, wherein said conductive liner material constitutes a conductive liner located on sidewalls of said at least one trench and said conductive via segment material completely or partially fills each cavity in said at least one trench; andperforming at least once a set of processing steps including: recessing a portion of a material that fills each upper portion of said at least one trench;depositing another conductive liner material on exposed sidewalls of each of said at least one trench; anddepositing another conductive via segment material in each of said at least one trench, whereby at least one through-substrate via (TSV) structure is formed in said first substrate. 2. The method of claim 1, wherein said at least one trench extends from a first surface located on one side of said first substrate into said first substrate, wherein said method further comprises removing a portion of said first substrate from a surface located on an opposite side of said first substrate from said first surface, whereby said at least one TSV structure is exposed on a second surface of said first substrate after removal of said portion of said first substrate, and wherein said second surface is located on an opposite side of said first surface. 3. The method of claim 2, wherein said at least one TSV structure is an array of TSV structures, and said method further comprises forming an array of conductive bonding material structures on said second surface of said first substrate, wherein each of said array of conductive bonding material structures contacts a bottom surface of a TSV structure within said array of TSV structures. 4. The method of claim 3, further comprising bonding a second substrate or a packaging substrate to said first substrate through said array of conductive bonding material, wherein said array of TSV structures and said array of conductive bonding material structures provide a plurality of electrical connections between at least one semiconductor device in said first substrate and conductive structures located within said second substrate or within said packaging substrate. 5. The method of claim 1, wherein said TSV structure extends from a first surface located on one side of said first substrate to a second surface located on an opposite side of said first substrate, each of said at least one TSV structure comprising a plurality of conductive via segments that are vertically spaced from one another by at least one conductive liner portion. 6. The method of claim 5, wherein each vertically adjacent pair of said plurality of conductive via segments is spaced from each other by a conductive liner portion among said at least one conductive liner portion, wherein a bottom surface of one of said vertically adjacent pair of conductive via segments is in contact with an upper surface of said conductive liner portion and a top surface of the other of said vertically adjacent pair of conductive via segments is in contact with a lower surface of said conductive liner portion. 7. The method of claim 5, wherein said recessing of said portion of said material is set such that each conductive via segment within one of said at least one TSV structure has a vertical length that is less than a Blech length thereof for a maximum current density that said one of said at least one TSV structure is configured to flow within said first substrate. 8. The method of claim 7, further comprising: determining a cross-sectional area per through-substrate via from a design of a semiconductor chip that is manufactured in said first substrate for each of said at least one TSV structure;determining a maximum current from said design for each of said at least one TSV structure;determining said Blech length for each of said at least one TSV structure, wherein said Blech length is determined by LBlech=ATSV×(jL)th/ITSV, wherein LBlech is said Blech length, ATSV is said cross-sectional area, (jL)th is a critical current density-length product for a material constituting said plurality of conductive via segments, and ITSV is said maximum current. 9. The method of claim 8, wherein each of said at least one trench has a substantially same depth d0, and said method further comprises setting a total number of repetitions for performing of said set of processing steps at a positive integer N, wherein said (N+1) is a smallest integer that is equal to or greater than d0/min(LBlech), wherein min(LBlech) is a minimum of all Blech lengths of said at least one TSV.