초록 ▼

Embodiments of the disclosure may include a system for cooling a computer server including a plurality of server modules. The system may include a first cooling system configured to remove heat from the plurality of server modules, the first cooling system including a first plurality of conduits for

Embodiments of the disclosure may include a system for cooling a computer server including a plurality of server modules. The system may include a first cooling system configured to remove heat from the plurality of server modules, the first cooling system including a first plurality of conduits for circulating a first cooling medium through the first cooling system, a second cooling system configured to remove heat from the first cooling system, the second cooling system including a second plurality of conduits for circulating a second cooling medium through the second cooling system, and a manifold configured to couple the first cooling system and the second cooling system, wherein the first plurality of conduits is removably connected to the manifold.

대표청구항 ▼

1. A system for cooling a computer server including one or more server modules, the system comprising: a first plurality of conduits for circulating a first cooling medium among the one or more server modules, wherein the first plurality of conduits includes at least one server cold plate dimensione

1. A system for cooling a computer server including one or more server modules, the system comprising: a first plurality of conduits for circulating a first cooling medium among the one or more server modules, wherein the first plurality of conduits includes at least one server cold plate dimensioned to thermally connect to at least one heat generating component of the one or more server modules;a second plurality of conduits for circulating a second cooling medium through a cooling device positioned at a location remote from the computer server; anda fluid distribution and collection manifold including: at least one first inlet line having a first inlet fluid connector for fluidly and removably connecting to the first plurality of conduits to collect the first cooling medium from the first plurality of conduits;at least one first outlet line having a first outlet fluid connector for fluidly and removably connecting to the first plurality of conduits to distribute the first cooling medium to the first plurality of conduits;at least one second inlet line having a second inlet fluid connector for fluidly and removably connecting to the second plurality of conduits to collect the second cooling medium from the second plurality of conduits;at least one second outlet line having a second outlet fluid connector for fluidly and removably connecting to the second plurality of conduits to distribute the second cooling medium to the second plurality of conduits;a hot plate; anda cold plate thermally coupled to the hot plate;wherein, when connected to the manifold via the first outlet and first inlet fluid connectors, the first plurality of conduits and the first inlet and first outlet lines form a first fluid loop that allows the first cooling medium to circulate between the first plurality of conduits, the first inlet and first outlet lines, and the hot plate to transfer the heat from the one or more server modules to the hot plate; andwherein, when connected to the manifold via the second outlet and second inlet fluid connectors, the second plurality of conduits and the second inlet and second outlet lines form a second fluid loop, separate from the first fluid loop, that allows the second cooling medium to circulate between the second plurality of conduits, the second inlet and second outlet lines, and the cold plate to transfer the heat from the cold plate to the cooling device at the location remote from the computer server. 2. The system of claim 1, wherein each of the one or more server modules includes at least one CPU. 3. The system of claim 1, wherein the at least one server cold plate is fluidly connected to the first plurality of conduits. 4. The system of claim 1, wherein the first fluid loop and the second fluid loop do not fluidly connect with each other. 5. The system of claim 1, wherein the cold plate is in thermal contact with the hot plate. 6. The system of claim 5, further comprising a thermal medium located between the hot plate and the cold plate to promote transfer of heat from the hot plate to the cold plate. 7. The system of claim 1, wherein the first plurality of conduits and the second plurality of conduits are arranged to connect the computer server with the cooling device, when the computer server is positioned in an enclosed room and when the cooling device is positioned outside the enclosed room, to dissipate the heat from the cold plate to a region outside of the enclosed room. 8. The system of claim 1, wherein the first inlet and first outlet fluid connectors seal the first cooling medium from leaking out of the first plurality of conduits when disconnected from the manifold. 9. The system of claim 1, wherein the second inlet and second outlet fluid connectors seal the second cooling medium from leaking out of the second plurality of conduits when disconnected from the manifold. 10. The system of claim 1, further comprising at least one pump. 11. The system of claim 1, wherein the first plurality of conduits connects a second server module for circulating the first cooling medium among the one or more server modules. 12. The system of claim 1, wherein the fluid distribution and collection manifold includes a plurality of cold plates. 13. The system of claim 1, wherein the fluid distribution and collection manifold includes a plurality of first inlet lines that join together within the manifold. 14. The system of claim 13, wherein the plurality of first inlet lines join together prior to fluidly connecting with the hot plate. 15. A method of cooling a computer server including a plurality of server modules, comprising: fluidly connecting a first plurality of conduits to a fluid distribution and collection manifold via a first plurality of fluid connectors to form a first fluid loop;fluidly connecting a second plurality of conduits to the fluid distribution and collection manifold via a second plurality of fluid connectors to form a second fluid loop, separate from the first fluid loop;circulating a first cooling medium through the first fluid loop to transfer heat from the plurality of server modules to the first cooling medium, and from the first cooling medium to a hot plate located within the fluid distribution and collection manifold;circulating a second cooling medium through the second fluid loop to transfer heat from a cold plate located within the fluid distribution and collection manifold to the second cooling medium, and from the second cooling medium to a cooling device located remotely from the plurality of server modules; andthermally connecting at least one server cold plate to at least one heat generating component of the plurality of server modules, wherein the at least one server cold plate is fluidly connected to the first plurality of conduits. 16. A system for cooling a computer server including one or more server modules, the system comprising: a first plurality of conduits for circulating a first cooling medium among the one or more server modules;a second plurality of conduits for circulating a second cooling medium through a cooling device positioned at a location remote from the computer server; anda fluid distribution and collection manifold including: at least one first inlet line having a first inlet fluid connector for fluidly and removably connecting to the first plurality of conduits to collect the first cooling medium from the first plurality of conduits;at least one first outlet line having a first outlet fluid connector for fluidly and removably connecting to the first plurality of conduits to distribute the first cooling medium to the first plurality of conduits;at least one second inlet line having a second inlet fluid connector for fluidly and removably connecting to the second plurality of conduits to collect the second cooling medium from the second plurality of conduits;at least one second outlet line having a second outlet fluid connector for fluidly and removably connecting to the second plurality of conduits to distribute the second cooling medium to the second plurality of conduits; anda heat exchanger, wherein the heat exchanger includes a plurality of cold plates;wherein, when connected to the manifold via the first outlet and first inlet fluid connectors, the first plurality of conduits and the first inlet and first outlet lines form a first fluid loop that allows the first cooling medium to circulate between the first plurality of conduits, the first inlet and first outlet lines, and the heat exchanger; andwherein, when connected to the manifold via the second outlet and second inlet fluid connectors, the second plurality of conduits and the second inlet and second outlet lines form a second fluid loop, separate from the first fluid loop, that allows the second cooling medium to circulate between the second plurality of conduits, the second inlet and second outlet lines, and the heat exchanger, and the heat exchanger thermally connects the first fluid loop and the second fluid loop without fluidly connecting the first fluid loop and the second fluid loop. 17. A system for cooling a computer server including one or more server modules, the system comprising: a first plurality of conduits for circulating a first cooling medium among the one or more server modules, wherein the first plurality of conduits connects to a second server module for circulating the first cooling medium among the one or more server modules;a second plurality of conduits for circulating a second cooling medium through a cooling device positioned at a location remote from the computer server; anda fluid distribution and collection manifold including: at least one first inlet line having a first inlet fluid connector for fluidly and removably connecting to the first plurality of conduits to collect the first cooling medium from the first plurality of conduits;at least one first outlet line having a first outlet fluid connector for fluidly and removably connecting to the first plurality of conduits to distribute the first cooling medium to the first plurality of conduits;at least one second inlet line having a second inlet fluid connector for fluidly and removably connecting to the second plurality of conduits to collect the second cooling medium from the second plurality of conduits;at least one second outlet line having a second outlet fluid connector for fluidly and removably connecting to the second plurality of conduits to distribute the second cooling medium to the second plurality of conduits;a hot plate; anda cold plate thermally coupled to the hot plate;wherein, when connected to the manifold via the first outlet and first inlet fluid connectors, the first plurality of conduits and the first inlet and first outlet lines form a first fluid loop that allows the first cooling medium to circulate between the first plurality of conduits, the first inlet and first outlet lines, and the hot plate to transfer the heat from the one or more server modules to the hot plate; andwherein, when connected to the manifold via the second outlet and second inlet fluid connectors, the second plurality of conduits and the second inlet and second outlet lines form a second fluid loop, separate from the first fluid loop, that allows the second cooling medium to circulate between the second plurality of conduits, the second inlet and second outlet lines, and the cold plate to transfer the heat from the cold plate to the cooling device at the location remote from the computer server.