최소 단어 이상 선택하여야 합니다.
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다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
DataON 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Edison 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Kafe 바로가기국가/구분 | United States(US) Patent 등록 |
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국제특허분류(IPC7판) |
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출원번호 | US-0149373 (2014-01-07) |
등록번호 | US-9156684 (2015-10-13) |
발명자 / 주소 |
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출원인 / 주소 |
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대리인 / 주소 |
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인용정보 | 피인용 횟수 : 0 인용 특허 : 161 |
Methods for manufacturing multiple top port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and
Methods for manufacturing multiple top port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from a panel of unsingulated substrates, and each MEMS microphone die is substrate-mounted. Individual covers, each with an acoustic port, are joined to the panel of unsingulated substrates. Each individual substrate and cover pair cooperates to form an acoustic chamber for its respective MEMS microphone die, which is acoustically coupled to the acoustic port in the cover. The completed panel is singulated to form individual MEMS microphones.
1. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the microphone comprising: providing an unsingulated panel comprised of a plurality of individual rectangular substrates, each rectangular substrate comprising: a base layer com
1. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the microphone comprising: providing an unsingulated panel comprised of a plurality of individual rectangular substrates, each rectangular substrate comprising: a base layer comprised of at least one layer of non-conductive material, wherein the base layer has a planar top surface and a planar bottom surface, the top surface having an interior region and an attachment region, the attachment region disposed between the interior region and the edges of the base layer, and completely bounding the interior region;a first plurality of metal pads disposed on the top surface of the base layer;a second plurality of flat metal pads disposed on the bottom surface of the base layer, the second plurality of metal pads arranged to be within a perimeter of the bottom surface of the base layer; andone or more electrical pathways disposed completely within the base layer, wherein the pathways electrically couple one or more of the first plurality of metal pads on the top surface of the base layer to one or more of the second plurality of metal pads on the bottom surface of the base layer;mounting a MEMS microphone die to the top surface of each individual substrate in the panel of unsingulated substrates, and electrically coupling the MEMS microphone die to at least one of the first plurality of metal pads on the top surface of its respective substrate;providing a plurality of single-piece rectangular covers, wherein each individual rectangular cover is formed from a solid material and has a top portion and a sidewall portion, the sidewall portion supporting the top portion and adjoining the top portion at a substantially perpendicular angle and having a predetermined height, an exterior surface, an interior surface, an attachment surface, and an acoustic port disposed in the top portion of the rectangular cover and passing completely through the rectangular cover, wherein the acoustic port is disposed in a position offset from a centerpoint of the rectangular cover;attaching a single-piece rectangular cover to each individual substrate on the panel of unsingulated substrates, one cover to each individual substrate, wherein the attachment surface of the sidewall portion of the rectangular cover is aligned with and attached to the attachment region of the top surface of its respective individual substrate, andwherein the predetermined height and interior surface of the sidewall portion of the rectangular cover, and the interior surface of the top portion, in cooperation with the interior region of the top surface of its respective individual substrate, forms a protective enclosure for the MEMS microphone die to reduce electromagnetic interference and to define an acoustic chamber for the MEMS microphone die; andsingulating the substrate panel into individual MEMS microphones. 2. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for each individual substrate in the panel of unsingulated substrates, the method further comprises electrically coupling at least one passive electrical element between one of the first plurality of metal pads and one of the second plurality of metal pads. 3. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 2, wherein, for each individual substrate in the panel of unsingulated substrates, the at least one passive electrical element is disposed within the base layer of the individual substrate. 4. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 3, wherein, for each individual substrate in the panel of unsingulated substrates, the at least one passive electrical element comprises a dielectric or resistive material that is different from the non-conductive material in the base layer of the individual substrate. 5. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 2, wherein, for each individual substrate in the panel of unsingulated substrates, the at least one passive electrical element is configured to filter one or more of an input signal, an output signal, or input power. 6. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for each individual rectangular cover, the rectangular cover further comprises an acoustic material that substantially blocks contaminants from entering the acoustic chamber through the acoustic port. 7. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for each individual substrate in the panel of unsingulated substrates, the base layer comprises one or more layers of FR-4 printed circuit board material. 8. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for each individual microphone, the enclosure protects the MEMS microphone die from at least one of light and physical damage. 9. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for each individual microphone, a diaphragm of the MEMS microphone die defines a front volume and a back volume within the acoustic chamber, and the acoustic port disposed in the rectangular cover is acoustically coupled to the diaphragm. 10. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 9, wherein, for each individual microphone, the interface between the attachment surface of the sidewall portion of the rectangular cover and the attachment region of the top surface of the substrate is sealed to maintain acoustic pressure within the front volume. 11. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for each individual microphone, the MEMS microphone die is a pressure-equalizing MEMS microphone die. 12. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for each individual microphone, the acoustic port in the rectangular cover is a first acoustic port, and the base layer of the substrate further comprises a second acoustic port disposed in the interior region of the base layer and passing completely through the base layer, wherein the second acoustic port is disposed in a position offset from a centerpoint of the substrate, and wherein one of the second plurality of metal pads is a metal ring that completely surrounds the second acoustic port in the base layer. 13. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 12, wherein, for each individual substrate in the panel of unsingulated substrates, the second acoustic port further comprises a barrier that substantially blocks contaminants from entering the acoustic chamber through the second acoustic port. 14. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 13, wherein, for each individual substrate in the panel of unsingulated substrates, the barrier is a film of polymeric material. 15. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 13, wherein, for each individual substrate in the panel of unsingulated substrates, the barrier is a hydrophobic material. 16. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 12, for each individual MEMS microphone, wherein the MEMS microphone die is positioned over the second acoustic port in the base layer. 17. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for each individual substrate in the panel of unsingulated substrates, the base layer further comprises a recess disposed therein, and the MEMS microphone die is positioned over the recess. 18. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for each individual substrate in the panel of unsingulated substrates, the base layer further comprises an internal cavity with an aperture in the top surface of the base layer, and the MEMS microphone die is positioned over the aperture in the top surface of the base layer. 19. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the microphone comprising: providing an unsingulated patent of rectangular base portions, each individual rectangular base portion comprising: a base layer comprised of at least one layer of printed circuit board material, wherein the base layer has a substantially flat upper surface and a substantially flat lower surface, the upper surface having an inner area and a coupling area, the coupling area located between the inner area and the edges of the base layer, and completely surrounding the inner area;a plurality of metal pads located on the upper surface of the base layer;a plurality of flat solder pads located on the lower surface of the base layer, the plurality of solder pads arranged to be within a perimeter of the lower surface of the base layer;one or more electrical connections passing through the base layer, wherein the connections electrically couple one or more of the plurality of metal pads on the upper surface of the base layer to one or more of the plurality of solder pads on the lower surface of the base layer; andat least one passive electrical element disposed within the base layer and electrically coupled between one of the plurality of metal pads and one of the plurality of solder pads;mounting a MEMS microphone die to the upper surface of each individual base portion in the unsingulated panel of base portions, and electrically coupling each MEMS microphone die to at least one of the plurality of metal pads on the upper surface of the base layer of its respective base portion; andproviding a plurality of individual rectangular cover portions, each rectangular cover portion formed from a single piece of solid material, and having a top portion and a sidewall portion, the sidewall portion supporting the top portion and adjoining the top portion at a substantially perpendicular angle and having a predetermined height, an exterior surface, an interior surface, a coupling surface, and an acoustic port located in the top portion and passing completely through the top portion, wherein the acoustic port is disposed in a position offset from a centerpoint of the top portion of the cover portion;coupling a rectangular cover portion to each individual base portion on the panel of unsingulated base portions, one cover portion to each individual base portion, wherein the coupling surface of the sidewall portion of the cover portion is aligned with and mechanically attached to the coupling area of the base layer of its respective base portion;wherein the predetermined height and interior surface of the sidewall portion of the cover portion, and the interior surface of the top portion, in cooperation with the interior region of the upper surface of the base layer of its respective base portion, forms a protective enclosure for the MEMS microphone die to define an acoustic chamber for the MEMS microphone die; andwherein the overall length of the base portion and cover portion are substantially equal, and the overall width of the base portion and cover portion are substantially equal; andsingulating the panel of base portions into individual MEMS microphones. 20. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein, for each individual base portion in the panel of unsingulated base portions, each individual base portion further comprises an internal cavity with an aperture in the inner area of the upper surface of the base layer, and the MEMS microphone die is positioned over the aperture in the upper surface of the base layer. 21. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein, for each individual MEMS microphone, the enclosure protects the MEMS microphone die from at least one of light, electromagnetic interference, and physical damage. 22. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein, for each individual rectangular cover portion, the rectangular cover portion further comprises an acoustic material that substantially blocks contaminants from entering the acoustic chamber through the acoustic port. 23. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein, for each individual MEMS microphone, a diaphragm of the MEMS microphone die defines a front volume and a back volume within the acoustic chamber, and the acoustic port disposed in the top portion of the cover portion is acoustically coupled to the diaphragm; and wherein the interface between the coupling surface of the sidewall portion of the cover portion and the coupling area of the upper surface of the base layer of the base portion is sealed to maintain acoustic pressure within the front volume. 24. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein, for each individual microphone, the acoustic port in the rectangular cover portion is a first acoustic port, and the base portion further comprises a second acoustic port located in the inner area of the base layer and passing completely through the base layer, wherein the second acoustic port is disposed in a position offset from a centerpoint of the base portion, wherein one of the second plurality of solder pads is a solder pad ring that completely surrounds the second acoustic port in the base layer, and wherein the MEMS microphone die is positioned over the second acoustic port. 25. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 24, wherein, for each individual base portion in the panel of unsingulated base portions, the second acoustic port further comprises a barrier of polymeric material that substantially blocks contaminants from entering the acoustic chamber through the second acoustic port. 26. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 24, wherein, for each individual base portion in the panel of unsingulated base portions, the second acoustic port further comprises a barrier of hydrophobic material that substantially blocks contaminants from entering the acoustic chamber through the second acoustic port. 27. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein, for each individual base portion in the panel of unsingulated base portions, the at least one passive electrical element is configured to filter one or more of an input signal, an output signal, or input power. 28. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein, for each individual base portion in the panel of unsingulated base portions, the at least one passive electrical element comprises a dielectric or resistive material that is different from the printed circuit board material in the base layer of the base portion. 29. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the microphone comprising: providing an unsingulated panel comprising a plurality of rectangular base elements, each individual base element comprising: a core layer comprised of at least one layer of FR-4 printed circuit board material, wherein the core layer has a substantially flat top surface and a substantially flat bottom surface, the top surface having a die mount region and an attachment region, the attachment region positioned between the die mount region and the edges of the core layer, and completely surrounding the die mount region;a plurality of metal pads located on the top surface of the core layer;a plurality of flat solder pads located on the bottom surface of the core layer, the plurality of solder pads arranged to be within a perimeter of the bottom surface of the core layer, wherein the solder pads are plated with at least one metal;a plurality of electrical connections passing through the core layer that electrically couple one or more of the plurality of metal pads on the top surface of the core layer to one or more of the plurality of solder pads on the bottom surface of the core layer;at least one passive electrical element disposed within the core layer and electrically coupled between one of the plurality of metal pads and one of the plurality of solder pads; anda pressure-equalizing MEMS microphone die having an internal acoustic channel mounted in the die mount region of the core layer, and electrically coupled to one or more of the metal pads on the top surface of the core layer;providing a plurality of single-piece rectangular cover elements, each rectangular cover element formed from a solid material and having a top region and a wall region, the wall portion supporting the top portion and wall region adjoining the top region at a substantially perpendicular angle and having a predetermined height, an exterior surface, an interior surface, an attachment surface, and an acoustic port located in the top region of the cover element and passing completely through the top region, wherein the acoustic port is disposed in a position offset from a centerpoint of the cover element;coupling a rectangular cover element to each individual base element on the panel of unsingulated base elements, one cover element to each individual base element, wherein the cover element is attached to the base element such that the attachment surface of the wall region of the cover element is aligned with and physically coupled to the attachment region of the top surface of the core layer of its respective base element, thereby forming a protective enclosure for the MEMS microphone die,wherein the interior of the protective enclosure is an acoustic chamber having a volume defined by the predetermined height of wall region of the cover element, and the width and length of the top region of the cover element,wherein a diaphragm of the MEMS microphone die defines a front volume and a back volume within the acoustic chamber, and the acoustic port disposed in the cover element is acoustically coupled to the diaphragm, andwherein the interface between the attachment surface of the wall region of the cover element and the attachment area of the top surface of the core layer of the base element is sealed to maintain acoustic pressure within the front volume; andsingulating the panel of base elements into individual MEMS microphones. 30. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 29, wherein, for each individual base element in the panel of unsingulated base elements, the at least one passive electrical element comprises a dielectric or resistive material that is different from the FR-4 printed circuit board material in the core layer of the base element. 31. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 29, wherein, for each individual MEMS microphone, the enclosure protects the MEMS microphone die from at least one of light, electromagnetic interference, and physical damage. 32. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 29, wherein for each individual cover element, the cover element further comprises an acoustic material that substantially blocks contaminants from entering the acoustic chamber through the acoustic port. 33. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 29, wherein, for each individual base element in the panel of unsingulated base elements, the core layer of the base element further comprises an internal cavity with an aperture in the top surface of the core layer, and the MEMS microphone die is positioned over the aperture in the top surface of the core layer. 34. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 29, wherein, for each individual base element in the panel of unsingulated base elements, the at least one passive electrical element is configured to filter one or more of an input signal, an output signal, or input power. 35. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 29, wherein, for each individual base element in the panel of unsingulated base elements, the at least one passive electrical element comprises a dielectric or resistive material that is different from the printed circuit board material in the core layer of the base element. 36. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the microphone comprising: providing a plurality of a pressure-equalizing MEMS microphone die, each having an internal acoustic channel;providing an unsingulated panel comprising a plurality of first housing elements each having a rectangular shape, the first housing elements further comprising: a core layer comprised of multiple layers of FR-4 printed circuit board material, wherein the core layer has a substantially flat top surface and a substantially flat bottom surface, wherein the top surface has an die mount region and an attachment region, the attachment region being arranged between the die mount region and the edges of the core layer, and the attachment region completely surrounds the die mount region;a plurality of metal pads disposed on the top surface of the core layer, wherein the metal pads are plated with at least one metal;a plurality of flat solder pads disposed on the bottom surface of the core layer, the plurality of solder pads arranged to be within a perimeter of the bottom surface of the core layer, wherein the solder pads are plated with at least one metal;one or more electrical vias located inside the core layer, wherein the vias electrically couple one or more of the plurality of metal pads on the top surface of the core layer to one or more of the plurality of solder pads on the bottom surface of the core layer; andat least one passive electrical element disposed within the core layer and electrically coupled between one of the plurality of metal pads and one of the plurality of solder pads, wherein the at least one passive electrical elements comprises a dielectric or resistive material that is different from the printed circuit board material in the core layer;providing a plurality of second housing elements each having a rectangular shape, each second housing element formed from a single piece of solid material, and having a top region and a wall region, the wall portion supporting the top portion and wall region adjoining the top region at a substantially perpendicular angle and having a predetermined height, an exterior surface, an interior surface, an attachment surface, and an acoustic port located in the top region of the second housing element and passing completely through the second housing element, wherein the acoustic port is disposed in a position offset from a centerpoint of the second housing element;coupling a MEMS microphone die to each first housing element in the unsingulated panel of first housing elements, wherein each MEMS microphone die is disposed in the die mount region of the core layer of its respective first housing element, and electrically coupled to one or more of the metal pads on the top surface of the core layer of its respective first housing element, the internal acoustic channel of the MEMS microphone die being arranged directly over the first acoustic port in the core layer in its respective first housing element;forming a protective housing for each MEMS microphone die mounted on a first housing element in the unsingulated panel of first housing elements by coupling a second housing element to each first housing element in the unsingulated panel of first housing elements, wherein the attachment surface of the wall region of the second housing element is aligned with and physically coupled to the attachment region of the top surface of the core layer of the first housing element, thereby forming a protective enclosure for the MEMS microphone die, andwherein the interior of the protective enclosure is an acoustic chamber having a volume defined by the predetermined height of wall region of the second housing element, and the width and length of the top region of the second housing element; andsingulating the panel of first housing elements into individual MEMS microphones. 37. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 36, wherein, for each individual MEMS microphone, the enclosure protects the MEMS microphone die from at least one of light, electromagnetic interference, and physical damage. 38. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 36, wherein, for each individual second housing element, the top region of the second housing element further comprises an acoustic material that substantially blocks contaminants from entering the acoustic chamber through the acoustic port. 39. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 36, wherein, for each first housing element in the unsingulated panel of first housing elements, the core layer of the first housing element further comprises an internal cavity with an aperture in the top surface of the core layer, and the MEMS microphone die is positioned over the aperture in the top surface of the core layer. 40. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 36, wherein, for each first housing element in the unsingulated panel of first housing elements, the at least one passive electrical element is configured to filter one or more of an input signal, an output signal, or input power.
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