Underlayment including extruded sheet material with expanded microspheres and metalized PET film
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
E04C-001/00
E04C-002/20
E04F-015/02
E04F-015/20
E04F-015/10
E04B-001/84
출원번호
US-0819610
(2015-08-06)
등록번호
US-9169659
(2015-10-27)
발명자
/ 주소
Ford, Richard
Allgood, Richard
출원인 / 주소
Pak-Lite, Inc.
대리인 / 주소
Bockhop, Bryan W.
인용정보
피인용 횟수 :
0인용 특허 :
7
초록▼
A hybrid underlayment, includes a thermoplastic making up between 92.0% by volume to 95.5% by volume of the hybrid underlayment. A plurality of expanded microspheres is dispersed through the thermoplastic. The microspheres are expanded to a cross-sectional area in a range of between 180 square micro
A hybrid underlayment, includes a thermoplastic making up between 92.0% by volume to 95.5% by volume of the hybrid underlayment. A plurality of expanded microspheres is dispersed through the thermoplastic. The microspheres are expanded to a cross-sectional area in a range of between 180 square micrometers and 1450 square micrometers. The microspheres makeup between 1.0% by volume to 7.5% by volume of the hybrid underlayment. The hybrid underlayment is extruded into a flat sheet having a thickness of between 1.0 mm and 2.0 mm and a density from 7 pcf to 25 pcf. A metalized thermoplastic film is laminated to the top surface of the thermoplastic sheet.
대표청구항▼
1. A hybrid underlayment, comprising: (a) a thermoplastic sheet making up between 92.0% by volume to 95.5% by volume of the hybrid underlayment, the thermoplastic sheet having a top surface and an opposite bottom surface;(b) a plurality of expanded microspheres dispersed through the thermoplastic sh
1. A hybrid underlayment, comprising: (a) a thermoplastic sheet making up between 92.0% by volume to 95.5% by volume of the hybrid underlayment, the thermoplastic sheet having a top surface and an opposite bottom surface;(b) a plurality of expanded microspheres dispersed through the thermoplastic sheet, the microspheres expanded to a cross-sectional area in a range of between 180 square micrometers and 1450 square micrometers, the microspheres making up between 1.0% by volume to 7.5% by volume of the hybrid underlayment prior to expansion of the microspheres; and(c) a metalized thermoplastic film laminated to the top surface of the thermoplastic sheet. 2. The hybrid underlayment of claim 1, wherein the metalized thermoplastic film comprises polyethylene terephthalate. 3. The hybrid underlayment of claim 2, wherein the metalized thermoplastic film has a thickness of 50 microns. 4. The hybrid underlayment of claim 1, wherein the metalized thermoplastic film has a thickness in a range of 15 microns to 200 microns. 5. The hybrid underlayment of claim 1, wherein the metalized thermoplastic film is glued to the thermoplastic sheet with a heat activated glue. 6. A flooring for covering a floor substrate, comprising: (a) a hybrid underlayment that disposed on the floor substrate, the hybrid underlayment including: (i) a thermoplastic making up between 92.0% by volume to 95.5% by volume of the hybrid underlayment;(ii) a plurality of expanded microspheres dispersed through the thermoplastic sheet, the microspheres expanded to a cross-sectional area in a range of between 180 square micrometers and 1450 square micrometers, the microspheres making up between 1.0% by volume to 7.5% by volume of the hybrid underlayment prior to expansion of the microspheres; and(iii) a metalized thermoplastic film laminated to the top surface of the thermoplastic sheet; and(b) a plurality of interfacing LVT flooring units, each of which is disposed on the hybrid underlayment. 7. The flooring of claim 6, wherein the metalized thermoplastic film comprises polyethylene terephthalate. 8. The flooring of claim 6, wherein the metalized thermoplastic film has a thickness in a range of 15 microns to 200 microns. 9. The flooring of claim 8, wherein the metalized thermoplastic film has a thickness of 50 microns. 10. The flooring of claim 6, wherein the metalized thermoplastic is glued to the thermoplastic sheet. 11. The flooring of claim 6, wherein the plurality of LVT flooring units is glued to the metalized polyethylene terephthalate film. 12. A floor, comprising: (a) a sub-floor;(b) a hybrid underlayment that disposed on the floor substrate, the hybrid underlayment including: (i) a thermoplastic making up between 92.0% by volume to 95.5% by volume of the hybrid underlayment disposed on the subfloor;(ii) a plurality of expanded microspheres dispersed through the thermoplastic sheet, the microspheres expanded to a cross-sectional area in a range of between 180 square micrometers and 1450 square micrometers, the microspheres making up between 1.0% by volume to 7.5% by volume of the hybrid underlayment prior to expansion of the microspheres; and(iii) a metalized thermoplastic film laminated to the top surface of the thermoplastic sheet; and(c) a plurality of interfacing LVT flooring units, each of which is disposed on the hybrid underlayment. 13. The floor of claim 12, wherein the metalized thermoplastic film comprises polyethylene terephthalate. 14. The floor of claim 12, wherein the metalized thermoplastic film has a thickness in a range of 15 microns to 200 microns. 15. The floor of claim 14, wherein the metalized thermoplastic film has a thickness of 50 microns. 16. The floor of claim 12, wherein the metalized thermoplastic film is glued to the thermoplastic sheet. 17. The floor of claim 12, wherein the plurality of LVT flooring units is glued to the metalized polyethylene terephthalate film.
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