초록 ▼

A thermal management system (201) is provided which includes a housing (203) equipped with a first set of apertures S1={a1, ai} (213), a second set of apertures S2={b1, . . . bj} (215) and a set of entrainment features S3={c1, Ck} (217), wherein i, j, k≧1, and wherein, for any pair of adjacent apert

A thermal management system (201) is provided which includes a housing (203) equipped with a first set of apertures S1={a1, ai} (213), a second set of apertures S2={b1, . . . bj} (215) and a set of entrainment features S3={c1, Ck} (217), wherein i, j, k≧1, and wherein, for any pair of adjacent apertures Pa={am, bn}, wherein am ε S1 and m ε I={1, . . . , i}, and wherein bn ε S2 and n ε J={1, . . . , j}, there is at least one entrainment feature cp ε S3 which is disposed between aperture am and aperture bn, wherein p ε K={1, . . . , k} . The thermal management system also includes a synthetic jet actuator disposed in said housing which is in fluidic communication with the sets of apertures S1 and S2 and which operates to create a synthetic jet at each aperture dr ε { S1, S2}, wherein r ε I∪J.

대표청구항 ▼

1. A thermal management system, comprising: a housing equipped with a first set of apertures S1={a1, . . . , ai}, a second set of apertures S2={b1, . . . , bj} and a set of entrainment features S3={c1, . . . , ck}, wherein i, j, k≧1, and wherein, for any pair of adjacent apertures Pa={am, bn}, where

1. A thermal management system, comprising: a housing equipped with a first set of apertures S1={a1, . . . , ai}, a second set of apertures S2={b1, . . . , bj} and a set of entrainment features S3={c1, . . . , ck}, wherein i, j, k≧1, and wherein, for any pair of adjacent apertures Pa={am, bn}, wherein am ε S1 and m ε I={1, . . . , i}, and wherein bn ε S2 and n ε J={1, . . . , j}, there is at least one entrainment feature cp ε S3 which is disposed between aperture am and aperture bn, wherein p ε K={1, . . . , k}; anda synthetic jet actuator disposed in said housing which is in fluidic communication with the sets of apertures S1 and S2 and which operates to create a synthetic jet at each aperture dr ε {S1, S2}, wherein r ε I∪J. 2. The thermal management system of claim 1, further comprising: a heat sink equipped with a plurality of fins and positioned with respect to said synthetic jet actuator such that the synthetic jet created at each aperture dr is directed between an adjacent pair of said fins. 3. The thermal management system of claim 2, wherein the housing comprises a lip which extends over said heat sink, and wherein the entrainment features are a series of passageways which extend through said lip. 4. The thermal management system of claim 2, wherein the housing comprises a series of protrusions which extends over said heat sink, wherein the first and second sets of apertures are disposed in said series of protrusions, and wherein the entrainment features are a series of spaces between said protrusions. 5. The thermal management system of claim 1, wherein a heat source is disposed on an external surface of said housing. 6. The thermal management system of claim 1, wherein a heat source is disposed on an internal surface of said housing. 7. The thermal management system of claim 6, wherein said heat source is a semiconductor chip. 8. The thermal management system of claim 1, further comprising first and second heat sources associated with said housing, and wherein said first heat source is a heat pipe which is in thermal communication with a second heat source. 9. The thermal management system of claim 1, wherein said thermal management system further comprises a heat sink which is equipped with a plurality of heat fins. 10. The thermal management system of claim 9, wherein said first and second sets of apertures comprise a plurality of pairs of spaced apart apertures, and wherein each aperture in any of said pairs of spaced apart apertures directs a synthetic jet into a same space formed by a pair of adjacent heat fins. 11. A method for cooling a heat source, comprising: providing a thermal management system comprising (a) a housing equipped with a first set of apertures S1={a1, . . . , ai}, a second set of apertures S2={b1, . . . , bj} and a set of entrainment features S3={c1, . . . , ck}, wherein i, j, k≧1, and wherein, for any pair of adjacent apertures Pa={am, bn}, wherein am ε S1 and m ε I={1, . . . , i}, and wherein bn ε S2 and n ε J={1, . . . , j}, there is at least one entrainment feature cp ε S3 which is disposed between aperture am and aperture bn, wherein p ε K={1, . . . , k}, and (b) a synthetic jet actuator disposed in said housing which is in fluidic communication with the sets of apertures S1 and S2 and which operates to create a synthetic jet at each aperture dr ε {S1, S2}, wherein r ε I∪J;disposing a heat source on a surface of said housing; andoperating said synthetic jet actuator so as to create a synthetic jet at each aperture dr ε {S1, S2}, wherein r ε I∪J. 12. The method of claim 11, wherein operating the synthetic jet actuator entrains ambient fluid at each member of the set of entrainment features S3. 13. The method of claim 11, wherein said heat source is disposed on an external surface of said housing. 14. The method of claim 11, wherein said heat source is disposed on an internal surface of said housing. 15. The method of claim 11, wherein said heat source is a semiconductor chip. 16. The method of claim 11, wherein said heat source comprises first and second heat sources, and wherein said first heat source is a heat pipe which is in thermal communication with a second heat source. 17. The method of claim 11, wherein said thermal management system further comprises a heat sink. 18. The method of claim 17, wherein said heat sink comprises a plurality of heat fins. 19. The method of claim 18, wherein said first and second sets of apertures comprise a plurality of pairs of spaced apart apertures, and wherein each aperture in any of said pairs of spaced apart apertures directs a synthetic jet into a same space formed by a pair of adjacent heat fins. 20. The method of claim 19, wherein each of said plurality of heat fins has a planar surface, and wherein each aperture directs a synthetic jet along an axis that is parallel to the planar surface of one of said heat fins.