A water bonding device for electrically grounding a swimming pool is described. Embodiments include a bonding electrode installed in a pool skimmer or pump strainer. The bonding electrode typically resides in a skimmer or strainer cavity, and a ground conductor coupled directly to the electrode exte
A water bonding device for electrically grounding a swimming pool is described. Embodiments include a bonding electrode installed in a pool skimmer or pump strainer. The bonding electrode typically resides in a skimmer or strainer cavity, and a ground conductor coupled directly to the electrode extends out of the skimmer or strainer through a port. A plug assembly forms a water tight seal against the port and the ground conductor, providing a water tight access point for the ground conductor to enter the pool skimmer or pump strainer. The ground conductor is typically electrically connected to both the bonding electrode and a ground pole residing at ground potential.
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1. A water bonding device comprising: a filter inlet component selected from the group consisting of a pool skimmer and a pump strainer, the filter inlet component including a main cavity and a first port disposed proximate a bottom of the main cavity;a plug assembly removably installed in the first
1. A water bonding device comprising: a filter inlet component selected from the group consisting of a pool skimmer and a pump strainer, the filter inlet component including a main cavity and a first port disposed proximate a bottom of the main cavity;a plug assembly removably installed in the first port, the plug assembly including a plug penetrated by a plug bore, the plug forming a water tight seal with the first port; anda bonding electrode (i) comprising a metal structure having a surface area of at least 9.0 square inches, (ii) residing within the main cavity, and (iii) being directly coupled to a ground conductor, the ground conductor extending from within the main cavity through the plug bore to outside the filter inlet component. 2. The device of claim 1, wherein the plug assembly forms a water tight seal around the ground conductor. 3. The device of claim 2, wherein the plug assembly further comprises a conductor fitting removably installed in the plug, the conductor fitting being penetrated by a fitting bore and the ground conductor extending through the fitting bore. 4. The device of claim 3, wherein: the plug further comprises a fitting receptacle within which the plug fitting is installed; andthe plug assembly further comprises a fitting gasket residing within the fitting receptacle and forming a seal around the ground conductor. 5. The device of claim 4, wherein the ground conductor comprises a solid copper wire not smaller than 8 AWG. 6. The device of claim 5, wherein the filter inlet component is a pool skimmer and the bonding electrode is removably coupled to the ground conductor. 7. A water bonding system comprising: a built-in swimming pool comprising a pool wall;the water bonding device of claim 6, wherein the pool skimmer further includes: a skimmer inlet projecting through the pool wall;a second port directly coupled to a pool water conduit, the pool water conduit providing fluid communication between the pool skimmer and a pool filter. 8. The water bonding device of claim 5, wherein the pool filter inlet component is a pump strainer and the first port is a drain port. 9. The water bonding device of claim 8, wherein the ground conductor is spliced with a connector, the connector residing outside the main cavity and within 12 inches of the drain port. 10. A water bonding device comprising: a plug assembly including (i) a plug penetrated by a plug bore, and (ii) a fitting receptacle residing in the plug;a conductor fitting configured to removably install in the fitting receptacle, the conductor fitting being penetrated by a fitting bore;a bonding electrode comprising a metal structure having a surface area of at least 9.0 square inches, the bonding electrode being adapted to affix to a #8 AWG or larger solid copper conductor. 11. A method of using the water bonding device of claim 10 comprising: providing a built-in swimming pool, the swimming pool including a pool skimmer having a main cavity and a first port;passing a first end of a ground conductor from outside the pool skimmer through the first port, the plug bore, and the fitting bore;installing the plug in the first port;installing the fitting in the fitting receptacle;installing the bonding electrode on the ground conductor proximate the first end, whereupon the bonding electrode resides within the main cavity. 12. The method of claim 11, wherein the plug assembly forms a water tight seal with the ground electrode and with pool skimmer. 13. The method of claim 12, wherein the ground conductor is directly coupled to a ground pole. 14. The method of claim 13, wherein the pool skimmer further comprises a second port directly coupled to a pool water conduit, the pool water conduit providing fluid communication between the pool skimmer and a pool filter. 15. The method of claim 14, further comprising at least partially filling the swimming pool with water, the water extending from the swimming pool into the cavity and submerging the bonding electrode. 16. The method of claim 15, wherein the swimming pool water and ground pole have approximately equal electric potential. 17. A water bonding device comprising: a pool skimmer including: an inlet;a main cavity;a first port disposed at a bottom of the main cavity;a second port disposed at the bottom of the main cavity; anda skimmer basket residing in the main cavity;a plug assembly removably installed in the first port, the plug assembly including a plug penetrated by a plug bore, the plug forming a water tight seal with the first port; anda bonding electrode (i) comprising a metal structure having a surface area of at least 9.0 square inches, (ii) residing within the main cavity beneath the skimmer basket, and (iii) being directly coupled to a ground conductor, the ground conductor extending from within the main cavity through the plug bore to outside the filter inlet component. 18. The water bonding device of claim 17, wherein the ground conductor is directly coupled to a ground pole. 19. The water bonding device of claim 18, wherein the second port is directly coupled to a pool water conduit, the pool water conduit providing fluid communication between the pool skimmer and a pool filter. 20. The water bonding device of claim 19, wherein the pool water conduit is directly coupled to the pool filter.
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이 특허에 인용된 특허 (9)
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