Organic optoelectronic device and method for producing an organic optoelectronic device
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-051/44
H01L-051/52
H01L-027/32
H01L-051/56
출원번호
US-0383845
(2013-03-01)
등록번호
US-9196866
(2015-11-24)
우선권정보
DE-10 2012 203 637 (2012-03-08)
국제출원번호
PCT/EP2013/054204
(2013-03-01)
국제공개번호
WO2013/131828
(2013-09-12)
발명자
/ 주소
Schlenker, Tilman
Philippens, Marc
출원인 / 주소
OSRAM Opto Semiconductors GmbH
대리인 / 주소
Slater & Matsil, L.L.P.
인용정보
피인용 횟수 :
2인용 특허 :
5
초록▼
An organic optoelectronic device has a first substrate, on which a functional layer stack having at least one first electrode, thereabove an organic functional layer and thereabove a second electrode is arranged. A encapsulating arrangement includes a second substrate, on which a connecting material
An organic optoelectronic device has a first substrate, on which a functional layer stack having at least one first electrode, thereabove an organic functional layer and thereabove a second electrode is arranged. A encapsulating arrangement includes a second substrate, on which a connecting material and at least one spacer facing the functional layer stack are applied. The connecting material is arranged between the first and second substrate and mechanically connects the first and second substrate together. The functional layer stack is enclosed by the connecting material in a frame-like manner. At least one of the first and second electrode includes at least one opening, above which the at least one spacer is arranged and which has a larger lateral dimension that the spacer.
대표청구항▼
1. An organic optoelectronic device comprising: a first substrate on which a functional layer stack is arranged, wherein the functional layer stack has at least one first electrode, thereabove an organic functional layer and thereabove a second electrode; andan encapsulating arrangement which compri
1. An organic optoelectronic device comprising: a first substrate on which a functional layer stack is arranged, wherein the functional layer stack has at least one first electrode, thereabove an organic functional layer and thereabove a second electrode; andan encapsulating arrangement which comprises a second substrate, on which a connecting material and a spacer facing the functional layer stack are located and are fixedly connected to the second substrate, wherein the spacer is fixedly connected only to the second substrate,wherein the connecting material is arranged between the first substrate and the second substrate, and mechanically connects the first and second substrates together,wherein the functional layer stack is enclosed by the connecting material in a frame-like manner, andwherein at least one of the first electrode or the second electrode comprises an opening, above which the spacer is arranged, the opening having a larger lateral dimension than the spacer. 2. The device according to claim 1, wherein the electrode having the opening is formed by a contiguous layer or a contiguous layer stack. 3. The device according to claim 1, wherein the first electrode comprises the opening and the organic functional layer, and wherein the second electrode covers the opening. 4. The device according to claim 1, wherein the second electrode comprises the opening and the organic functional layer and the first electrode are arranged in a region of the opening. 5. The device according to claim 1, wherein the connecting material and the material of the spacer are identical. 6. The device according to claim 1, wherein the connecting material and the material of the spacer contain glass. 7. The device according to claim 6, wherein the connecting material and the material of the spacer are formed by a glass solder or a glass frit. 8. The device according to claim 1, wherein the spacer does not contact the functional layer stack. 9. The device according to claim 1, wherein the spacer contacts the functional layer stack. 10. The device according to claim 1, wherein the spacer has a smaller height than the connecting material. 11. The device according to claim 1, wherein the spacer is one of a plurality of spacers applied on the second substrate and the opening is one of a plurality of openings, each spacer is arranged above a respective one of the openings. 12. A method for producing an organic optoelectronic device, the method comprising: providing a first substrate on which a functional layer stack is arranged, wherein the functional layer stack has a first electrode, thereabove an organic functional layer and thereabove a second electrode, and wherein at least one of the first electrode and the second electrode comprises an opening;providing a second substrate;applying a connecting material onto an upper side of the second substrate;applying a spacer onto the upper side of the second substrate;connecting the spacer to the second substrate by a sintering process thereby producing an encapsulating arrangement; andarranging the encapsulating arrangement on the first substrate so that the functional layer stack is enclosed by the connecting material and the spacer is arranged above the opening. 13. The method according to claim 12, wherein connecting the spacer to the second substrate comprises connecting the connecting material to the second substrate by the sintering process. 14. The method according to claim 13, wherein the arranging the encapsulating arrangement comprises melting the connecting material with a laser to fixedly connect the connecting material to the first substrate. 15. The method according to claim 12, wherein the opening has a larger lateral dimension than the spacer. 16. An organic optoelectronic device comprising: a first substrate on which a functional layer stack is arranged, wherein the functional layer stack has at least one first electrode, thereabove an organic functional layer and thereabove a second electrode; andan encapsulating arrangement which comprises a second substrate, on which a connecting material and a spacer facing the functional layer stack are located and are fixedly connected to the second substrate,wherein the connecting material is arranged between the first substrate and the second substrate and mechanically connects the first and second substrates together,wherein the functional layer stack is enclosed by the connecting material in a frame-like manner,wherein at least one of the first electrode or the second electrode comprises an opening, above which the spacer is arranged, the opening having a larger lateral dimension than the spacer, andwherein the first electrode comprises the opening, and wherein the organic functional layer and the second electrode cover the opening. 17. An organic optoelectronic device comprising: a first substrate on which a functional layer stack is arranged, wherein the functional layer stack has at least one first electrode, thereabove an organic functional layer and thereabove a second electrode; andan encapsulating arrangement which comprises a second substrate, on which a connecting material and a spacer facing the functional layer stack are located and are fixedly connected to the second substrate, wherein the connecting material and the material of the spacer are identical,wherein the connecting material is arranged between the first substrate and the second substrate and mechanically connects the first and second substrates together,wherein the functional layer stack is enclosed by the connecting material in a frame-like manner, andwherein at least one of the first electrode or the second electrode comprises an opening, above which the spacer is arranged, the opening having a larger lateral dimension than the spacer. 18. An organic optoelectronic device comprising: a first substrate on which a functional layer stack is arranged, wherein the functional layer stack has at least one first electrode, thereabove an organic functional layer and thereabove a second electrode; andan encapsulating arrangement which comprises a second substrate, on which a connecting material and a spacer facing the functional layer stack are located and are fixedly connected to the second substrate,wherein the connecting material is arranged between the first substrate and the second substrate and mechanically connects the first and second substrates together,wherein the functional layer stack is enclosed by the connecting material in a frame-like manner,wherein the spacer does not contact the functional layer stack, andwherein at least one of the first electrode or the second electrode comprises an opening, above which the spacer is arranged, the opening having a larger lateral dimension than the spacer.
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