$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Method of reinforcing a hermetic seal of a module

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-003/00
  • H01R-043/02
  • H01R-043/20
출원번호 US-0071316 (2011-03-24)
등록번호 US-9197024 (2015-11-24)
발명자 / 주소
  • Lower, Nathan P.
  • Brower, David M.
  • Wilcoxon, Ross K.
출원인 / 주소
  • Rockwell Collins, Inc.
대리인 / 주소
    Suchy, Donna P.
인용정보 피인용 횟수 : 0  인용 특허 : 115

초록

The present invention is directed to low-cost, low-processing temperature, and simple reinforcement, repair, and corrosion protection for hermetically sealed modules and hermetic connectors. A thin layer of glass is applied over the module's seal or the connector' glass frit. The layer of glass comp

대표청구항

1. A method of reinforcing or repairing a hermetic seal for a module, comprising the steps of: sealing a module hermetically;applying a material comprising an alkali silicate over the seal; andcuring the material to form an alkali silicate glass, which performs one selected from reinforcing the seal

이 특허에 인용된 특허 (115)

  1. Martin,Yves; Van Kessel,Theodore G., Active liquid metal thermal spreader.
  2. Laney Bill E. (Albuquerque NM) Williams F. Truman (Albuquerque NM) Rutherford Ronald L. (Albuquerque NM) Bailey David T. (Albuquerque NM), Advanced geopolymer composites.
  3. Drescher Helga,ATX ; Martin Frank,LIX ; Rheinberger Volker,LIX ; Holand Wolfram,LIX, Alkali silicate glass.
  4. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K.; Hillman, David D., Alkali silicate glass based coating and method for applying.
  5. Schulman, Joseph H.; Lucisano, Joseph Y.; Shah, Rajiv; Byers, Charles L.; Pendo, Shaun M., Alumina insulation for coating implantable components and other microminiature devices.
  6. Shimizu Toshihide,JPX ; Watanabe Mikio,JPX ; Iida Tamaki,JPX, Aluminum nitride composition.
  7. Pennisi Robert W. (Boca Raton FL) Papageorge Marc V. (Plantation FL) Urbish Glenn F. (Coral Springs FL), Anisotropic conductive adhesive and encapsulant material.
  8. Miyamoto Tetsuya,JPX ; Kawata Masakazu,JPX, Anisotropic conductive adhesive and method for preparation thereof and an electronic apparatus using said adhesive.
  9. Yamaguchi Hiroaki (Yamato JPX), Anisotropic, electrically conductive adhesive film.
  10. Fox Leslie R. (Boxborough MA), Apparatus for packaging and cooling integrated circuit chips.
  11. Young, Dianna M., Articles sealed with glass.
  12. Pesch Wolfgang (Grevenbroich DEX) Beer Gnter (Duisburg DEX), Binder compositions based on alkali metal silicate solutions.
  13. Hayashi, Hirokatsu; Fukunaga, Kenji; Fukuda, Kentaro, Cake of easily dispersible precipitated silica.
  14. Frampton Thomas J. (Poway CA), Ceramic package system using low temperature sealing glasses.
  15. Meguro,Toru; Wada,Ryuichiro; Saito,Yoshifumi, Ceramic substrate, electronic apparatus, and method for producing ceramic substrate.
  16. Solc Jitka (Midland MI) Kleweno Douglas G. (Lake Jackson TX), Ceramic-filled thermally-conductive-composites containing fusible semi-crystalline polyamide and/or polybenzocyclobutene.
  17. Butt Sheldon H. (Godfrey IL) Cann William F. (Ladue MO), Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs.
  18. Naruse,Tohru; Miyabara,Kouji, Coating material composition having photocatalytic activity.
  19. Makowski, Michael P.; Martz, Jonathan T.; Novak, Carolyn A.; Verardi, Christopher A., Coatings with improved chip resistance and methods of making the same.
  20. Eichorst Dennis J. ; Gardner Sylvia A. ; Apai ; II Gustav R., Colloidal vanadium oxide having improved stability.
  21. Hayashi, Eiji; Nishikawa, Michinori; Shiota, Atsushi; Yamada, Kinji, Composition for film formation, method of film formation, and silica-based film.
  22. Matsumoto Hiroshi (Kokubu JPX) Inokuchi Hiroaki (Kokubu JPX), Container package for semiconductor element.
  23. DeLuca Robert A. (Newton Centre MA) Garabedian George (Boston MA), Coolant circulation system for a liquid metal nuclear reactor.
  24. Ghoshal, Uttam; Miner, Andrew Carl, Cooling of electronics by electrically conducting fluids.
  25. Ghoshal,Uttam; Miner,Andrew Carl, Cooling of electronics by electrically conducting fluids.
  26. Ghoshal, Uttam; Miner, Andrew Carl, Cooling of high power density devices by electrically conducting fluids.
  27. Hahn, John; Heimann, Robert L.; Crosby, Daniel I., Corrosion protective coatings.
  28. Ghoshal,Uttam, Counterflow thermoelectric configuration employing thermal transfer fluid in closed cycle.
  29. Lamers, Paul H.; Martz, Jonathan T.; Meyers, Lawrence D.; Novak, Carolyn A.; Olson, Kurt G.; Rowley, James P.; Verardi, Christopher A., Curable polyurethanes, coatings prepared therefrom, and method of making the same.
  30. Chiruvolu,Shivkumar; Chapin,Michael Edward, Dense coating formation by reactive deposition.
  31. Bak-Boychuk Gregory ; Bradley Martin G. ; Mack Darryl K. ; Jaffe Stephen M. ; Simpson Matthew, Diamond film deposition.
  32. Jeong,Kwang Jin, Display module.
  33. Davidson Daniel F. (Altrincham GB2), Electromagnetic pumps.
  34. Wakely Wilbur T. (San Diego CA) Scott Philip R. (San Diego CA), Electronic enclosures having metal parts.
  35. Bergmann,Robert; Mahler,Joachim, Electronic module with layer of adhesive and process for producing it.
  36. O\Donnelly Brian E. (Branford CT) Mravic Brian (North Haven CT) Crane Jacob (Woodbridge CT) Mahulikar Deepak (Madison CT), Electronic package with stress relief channel.
  37. SinghDeo Narendra N. (New Haven CT) Mahulikar Deepak (Meriden CT) Butt Sheldon H. (Godfrey IL), Electronic packaging of components incorporating a ceramic-glass-metal composite.
  38. Heimann, Robert L.; Dalton, William M.; Hahn, John; Price, David M.; Soucie, Wayne L.; Chandran, Ravi, Energy enhanced process for treating a conductive surface and products formed thereby.
  39. Ito,Hisataka; Ota,Shinya, Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same.
  40. Bealka, David Joseph; Da Costa, Pedro Henrique, Feedthrough devices.
  41. Hittman Fred (Baltimore MD) Gelb Allan S. (Baltimore MD) Gelb Marcia J. (Baltimore MD) Foreman Thomas N. (Ellicott City MD), Filtered feedthrough assembly having a mounted chip capacitor for medical implantable devices and method of manufacture.
  42. Kajiwara, Ryoichi; Koizumi, Masahiro; Morita, Toshiaki; Takahashi, Kazuya; Nishimura, Asao; Shinoda, Masayoshi, Flip chip assembly structure for semiconductor device and method of assembling therefor.
  43. Rostoker Michael D. (San Jose CA) Pasch Nicholas F. (Pacifica CA) Schneider Mark (San Jose CA), Fluid-filled and gas-filled semiconductor packages.
  44. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P.; Wyckoff, Nathaniel P.; Hamilton, Brandon C., Glass thick film embedded passive material.
  45. Batchelder John Samuel, Heat exchange apparatus.
  46. Batchelder John Samuel, Heat exchange apparatus.
  47. Kim,Seo Young, Heat spreader, heat sink, heat exchanger and PDP chassis base.
  48. Wolfson, Sumner H., Heater preform for sealing a closure.
  49. Kraska Robert E. (Minneapolis MN) Wilary Frank J. (Plymouth MN) Lessar Joseph F. (Coon Rapids MN), Hermetic electrical feedthrough assembly.
  50. Lower, Nathan P.; Brower, David M.; Wilcoxon, Ross K., Hermetic seal and hermetic connector reinforcement and repair with low temperature glass coatings.
  51. Sridharan Srinivasan ; Whang Tack J. ; Roberts Gordon J., High temperature sealing glass.
  52. Taylor William J. (Anoka MN) Weiss Douglas (Plymouth MN) Lessar Joseph F. (Coon Rapids MN), Implantable pulse generator feedthrough.
  53. Mazany,Anthony M.; Robinson,John W.; Cartwright,Craig L., Inorganic matrix compositions and composites incorporating the matrix composition.
  54. Bhatia,Rakesh, Integrated circuit cooling apparatus and method.
  55. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P., Integrated circuit protection and ruggedization coatings and methods.
  56. Satoru Noda JP; Kunihiko Hamada JP, Laminated ceramic electronic device.
  57. Scapple Robert Y. (Los Angeles CA) Keister Frank S. (Culver City CA) Grieger Robert G. (Marina Del Ray CA) Himmel Richard P. (Mission Viego CA), Large area hybrid microcircuit assembly.
  58. Kanazawa, Jitsuo; Saito, Yo; Suto, Kimio, Light emitting apparatus.
  59. Sakano, Kensho; Sakai, Kazuhiko; Okada, Yuji; Umezu, Toshihiko, Light emitting diode, optical semiconductor element and epoxy resin composition suitable for optical semiconductor element and production methods therefor.
  60. Juestel,Thomas; Ronda,Cornelis Reinder; Mayr,Walter; Schmidt,Peter; Weiler,Volker Ulrich, Light-emitting device with coated phosphor.
  61. Meisner John W. (Newbury Park CA) Moore Robert M. (Canoga Park CA) Bienvenue Louis L. (Chatsworth CA), Linear induction pump.
  62. Ranjan J. Mathew ; Seshadri Vikram, Liquid crystal display assembly and method for reducing residual stresses.
  63. Calmidi, Varaprasad V.; Johnson, Eric A.; Stutzman, Randall J., Liquid metal thermal interface for an electronic module.
  64. Sauciuc,Ioan; Chrysler,Gregory M., Liquid metal thermal interface for an integrated circuit device.
  65. Steven M. Kuznicki ; Tadeusz W. Langner ; Jacqueline S. Curran ; Valerie A. Bell, Macroscopic aggregates of microcrystalline zeolites.
  66. Hirano, Koichi; Karashima, Seiji; Ichiryu, Takashi; Tomita, Yoshihiro, Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same.
  67. Dean,William Kit, Method and apparatus for hermetic sealing of assembled die.
  68. Sauciuc,Ioan; Williams,Jim D., Method and apparatus for removing heat.
  69. Woolley Robert D., Method and system to directly produce electrical power within the lithium blanket region of a magnetically confined, de.
  70. Casson Keith L. (Northfield MN) Myers Carol (Faribault MN) Gilleo Kenneth B. (W. Kingston RI) Suilmann Deanna (Bloomer WI) Mahagnoul Edward (Faribault MN) Tibesar Marion (Northfield MN), Method for electrically and mechanically connecting at least two conductive layers.
  71. Carlo Saling DE; Martin Schuessler DE; Thomas Stefanovski DE, Method for periodically reactivating a copper-containing catalyst material.
  72. Fanning Alan W. (San Jose) Dahl Leslie R. (Livermore) Patel Mahadeo R. (San Jose) Olich Eugene E. (Aptos CA), Method for producing inner stators for electromagnetic pumps.
  73. Boone, Alan P.; Lower, Nathan P.; Wilcoxon, Ross K., Method for providing near-hermetically coated integrated circuit assemblies.
  74. Uchiyama Akira,JPX, Method for surface treatment, ornaments and electronic devices.
  75. Vu Duy-Pach (Taunton MA) Dingle Brenda (Mansfield MA) Cheong Ngwe (Boston MA), Method of forming high density electronic circuit modules.
  76. Keenan,Phil; Byrne,Maurice; Hendley,Odhran; Meleady,Michelle Ryan; Logue,Fred, Method of making an inkjet printhead.
  77. Aoki Shigeo (Habikino JPX) Ugai Yasuhiro (Yao JPX) Miyake Katsumi (Nara JPX) Okamoto Kotaro (Hino JPX), Method of manufacturing liquid crystal display device.
  78. Bruxvoort Wesley J. ; Culler Scott R. ; Ho Kwok-Lun ; Kaisaki David A. ; Kessel Carl R. ; Klun Thomas P. ; Kranz Heather K. ; Messner Robert P. ; Webb Richard J. ; Williams Julia P., Method of modifying an exposed surface of a semiconductor wafer.
  79. Mashino,Naohiro, Method of producing of circuit board; for semiconductor device.
  80. Uchiyama, Akira, Method of treating a surface of a surface of a substrate containing titanium for an ornament.
  81. Nakashima,Shintaro, Molded package and semiconductor device using molded package.
  82. Hayes Donald J. (Plano TX) Wallace David B. (Dallas TX), Multi-channel array actuation system for an ink jet printhead.
  83. Umeda Yuhji (Nagoya JPX) Otagiri Tadashi (Nagoya JPX) Suzuki Go (Nagoya JPX), Multilayered ceramic substrate fireable in low temperature.
  84. Allen, Kevin M.; Shipman, Thomas W.; Frysz, Christine, Multipin feedthrough containing a ground pin passing through an insulator and directly brazed to a ferrule.
  85. Charles,Scott B.; Gross,Kathleen M.; Hackett,Steven C.; Kropp,Michael A.; Schultz,William J.; Thompson,Wendy L., Nanoparticle filled underfill.
  86. Humphreys Peter (Warrington GB2) Davidson Daniel F. (Altrincham GB2) Thatcher Gordon (Lymm GB2), Nuclear reactors.
  87. Hecht, Steven F.; Phalen, Kenneth C., Original christmas tree transport system.
  88. Oshio,Shozo, Phosphor composition and method for producing the same, and light-emitting device using the same.
  89. Murray, Helen M.; Wigham, Jonathan P.; Cahill, John E.; Lakes, Aisling; Holloway, Matthew J.; Ledwidge, Eadaoin D.; Ward, Mary B., Photocurable adhesive compositions, reaction products of which have low halide ion content.
  90. Kyoda, Takeshi; Fukuda, Jun; Kawai, Shinya; Arimune, Hisao, Photoelectric conversion device, glass composition for coating silicon, and insulating coating in contact with silicon.
  91. Hidetaka Takato JP; Ryuichi Shimokawa JP, Photovoltaic device.
  92. Coyle, Anthony L., Plastic package for micromechanical devices.
  93. Margaret E. Greene ; Robert Morena, Potassium silicate frits for coating metals.
  94. Nakaso Akishi (Oyama JPX) Tsuyama Koichi (Shimodate JPX) Otsuka Kazuhisa (Shimodate JPX) Ogino Haruo (Tochigi-ken JPX) Tamura Yoshihiro (Shimodate JPX) Inada Teiichi (Shimodate JPX) Yamamoto Kazunori, Process for producing multilayer printed circuit board.
  95. Takiguchi Yoshikazu ; Obiya Hiroyuki,JPX ; Takahashi Toru,JPX ; Shiroyama Taisuke,JPX ; Tazawa Kenji,JPX, Process for producing multilayer wiring boards.
  96. Mole Cecil J. (Monroeville PA), Pump.
  97. Nathenson Richard D. (Pittsburgh PA) Alexion Christopher C. (N. Huntingdon PA) Sumpman Wayne C. (N. Huntingdon PA), Pump/intermediate heat exchanger assembly for a liquid metal reactor.
  98. Sakai Takaaki (Suita JPX), Sea water antifouling method.
  99. Cho,Chung kun; Lee,Jong ki; Lee,Jea woan; Lee,Sang mock, Separator having inorganic protective film and lithium battery using the same.
  100. Yamazaki Hiroshi (Sagamihara JPX) Kawakami Hiroto (Kawasaki JPX), Sodium cooled fast reactor.
  101. Parkhill, Robert L.; Coleman, Steven M.; Knobbe, Edward T., Sol-gel-based composite materials for direct-write electronics applications.
  102. Goldstein, Jonathan R., Solar cell device.
  103. Suehiro, Yoshinobu, Solid-state element device.
  104. Higashi Masahiko,JPX ; Yamaguchi Kouichi,JPX ; Kokubu Masanari,JPX ; Kumatabara Hitoshi,JPX ; Hamada Noriaki,JPX ; Nagae Kenichi,JPX ; Shinozaki Michio,JPX ; Tami Yasuhide,JPX, Structure for mounting a wiring board.
  105. Nam Shi-baek,KRX ; Mok Seung-kon,KRX ; Kwon Dae-hoon,KRX, Structure of a semiconductor package including chips bonded to die bonding pad with conductive adhesive and chips bonde.
  106. Lower, Nathan P.; Wilcoxon, Ross K.; Yao, Qizhou; Dlouhy, David W.; Chihak, John A., System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling.
  107. Hakura,Ziyad S.; Langendorf,Brian Keith; Pescador,Stefano A.; Danilak,Radoslay; Simeral,Brad W., System, apparatus and method for issuing predictions from an inventory to access a memory.
  108. Camilletti Robert Charles ; Haluska Loren Andrew ; Michael Keith Winton, Tamper-proof electronic coatings.
  109. Saita Yoshiaki,JPX ; Takizawa Osamu,JPX, Thermal head.
  110. Papageorge Marc V. (Boca Raton FL) Pennisi Robert W. (Boca Raton FL) Davis James L. (Coral Springs FL), Thermally conducting adhesive containing aluminum nitride.
  111. Ghoshal,Uttam, Thermoelectric configuration employing thermal transfer fluid flow(s) with recuperator.
  112. Wesley A. Clark ; Ivan E. Sutherland, Tile array computers.
  113. Komiyama, Shinobu; Tsuiki, Yugo; Seo, Akihiro, Treating agent for forming a protective coating and metallic materials with a protective coating.
  114. Landa, Ksenia; Landa, Leonid; Aggas, Steven L.; Wang, Yei-Ping H., Vacuum IG unit with alkali silicate edge seal and/or spacers.
  115. Akram Salman ; Jiang Tongbi, Void-free underfill of surface mounted chips.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트