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A wave solder machine is configured to perform a wave solder operation on an electronic substrate. The wave solder machine includes a fluxing station configured to apply flux onto the electronic substrate, a pre-heating station configured to heat the electronic substrate, a wave soldering station co

A wave solder machine is configured to perform a wave solder operation on an electronic substrate. The wave solder machine includes a fluxing station configured to apply flux onto the electronic substrate, a pre-heating station configured to heat the electronic substrate, a wave soldering station configured to attach electronic components to the electronic substrate with solder, and a conveyor configured to transport substrates through a tunnel passing through the fluxing station, the pre-heating station and the wave soldering station. The wave solder machine further includes a flux management system configured to remove contaminants from the tunnel. The flux management system is in fluid communication with the tunnel for passage of a vapor stream from the tunnel through the flux management system and back to the tunnel. Methods of performing a wave solder operation are further disclosed.

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1. A wave solder machine configured to perform a wave solder operation on an electronic substrate, the wave solder machine comprising: a fluxing station configured to apply flux onto the electronic substrate;a pre-heating station configured to heat the electronic substrate;a wave soldering station c

1. A wave solder machine configured to perform a wave solder operation on an electronic substrate, the wave solder machine comprising: a fluxing station configured to apply flux onto the electronic substrate;a pre-heating station configured to heat the electronic substrate;a wave soldering station configured to attach electronic components to the electronic substrate with solder;a conveyor configured to transport substrates through a tunnel passing through the fluxing station, the pre-heating station and the wave soldering station; anda flux management system configured to remove contaminants from the tunnel, the flux management system being in fluid communication with the tunnel for passage of a vapor stream from the tunnel through the flux management system and back to the tunnel, the flux management system including a housing, a first stage unit provided within the housing, and a second stage unit provided within the housing and in fluid communication with the first stage unit, the first stage unit including an air-to-air heat exchanger using compressed air as a cooling medium to condense flux vapor on contact with the air-to-air heat exchanger, the first stage unit separating larger particles from a gas stream, the air-to-air heat exchanger including a plurality of tubes configured to receive compressed air, the air-to-air heat exchanger including at least one airflow deflector plate in thermal contact with the plurality of tubes of the air-to-air heat exchanger. 2. The wave solder machine of claim 1, wherein the second stage unit includes a packed bed of steel balls contained within a perforated sheet metal structure. 3. The wave solder machine of claim 2, wherein the perforated sheet metal structure of the second stage unit includes an upper structure portion and a lower structure portion, with the packed bed of steel balls being contained within the upper and lower structure portions. 4. The wave solder machine of claim 2, wherein the flux management system further includes at least one collection container to collect contaminants from the second stage unit. 5. The wave solder machine of claim 1, wherein the housing includes a first stage compartment configured to house components of the first stage unit and a second stage compartment configured to house components of the second stage unit. 6. The wave solder machine of claim 5, wherein the housing further includes a divider wall positioned between the first stage compartment and the second stage compartment. 7. The wave solder machine of claim 6, wherein the divider wall includes at least one opening formed therein to enable process gas passage between the first stage compartment and the second stage compartment. 8. The wave solder machine of claim 7, wherein the flux management system further includes a blower secured to the housing and configured to move gas within the second stage compartment back to the first stage compartment. 9. A method for removing vaporized contaminants from inside a wave solder machine, the method comprising: extracting a gas including vaporized contaminants from a tunnel of a wave solder machine;directing the gas to a flux management system configured to remove contaminants from the gas;removing contaminants from the gas with the flux management system to produce a processed gas; andintroducing the processed gas back into the tunnel,wherein removing contaminants from the gas with the flux management system includes passing the gas over a first stage unit of the flux management system having a heat exchanger to condense the gas, passing the gas over a second stage unit of the flux management system having a filter assembly, the heat exchanger including a plurality of tubes configured to receive compressed air and at least one air flow deflector plate in thermal contact with the plurality of tubes, and manipulating the flow of gas within the first stage unit with the deflector plate. 10. The method of claim 9, wherein the filter assembly of the second stage unit includes a packed bed of steel balls contained within a perforated sheet metal structure. 11. The method of claim 9, further comprising collecting the removed contaminants. 12. The method of claim 9, further comprising separating gas within the first stage unit from the second stage unit. 13. The method of claim 12, further comprising moving a portion of gas within the second stage unit back to the first stage unit. 14. The wave solder machine of claim 1, wherein the deflector plate includes a plurality of slots formed therein through which the plurality of tubes of the heat exchanger extend. 15. The method of claim 9, wherein the deflector plate includes a plurality of slots formed therein through which a plurality of tubes of the heat exchanger extend. 16. A method for removing vaporized contaminants from inside a wave solder machine, the method comprising: extracting a gas including vaporized contaminants from a tunnel of a wave solder machine;directing the gas to a flux management system configured to remove contaminants from the gas;removing contaminants from the gas with the flux management system to produce a processed gas; andintroducing the processed gas back into the tunnel,wherein removing contaminants from the gas with the flux management system includes passing the gas over a first stage unit of the flux management system having a heat exchanger to condense the gas, and passing the gas over a second stage unit of the flux management system having a filter assembly, the heat exchanger including a plurality of tubes configured to receive compressed air and at least one air flow deflector plate in thermal contact with the plurality of tubes, the flow of the gas over the heat exchanger of the first stage unit being impeded by the deflector plate.