Sealed body, method for manufacturing sealed body, light-emitting device, and method for manufacturing light-emitting device
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-029/08
H01L-027/15
B32B-037/06
H01L-051/52
H01L-033/48
H01L-033/56
H01L-033/58
출원번호
US-0467238
(2014-08-25)
등록번호
US-9202843
(2015-12-01)
우선권정보
JP-2011-133957 (2011-06-16)
발명자
/ 주소
Shimomura, Akihisa
출원인 / 주소
Semiconductor Energy Laboratory Co., Ltd.
대리인 / 주소
Husch Blackwell LLP
인용정보
피인용 횟수 :
0인용 특허 :
22
초록▼
A highly productive method for sealing substrates with the use of glass frit is provided. A method for sealing substrates with the use of glass frit, which can be used for a substrate provided with a material having low heat resistance, is provided. A highly airtight sealed body which is manufacture
A highly productive method for sealing substrates with the use of glass frit is provided. A method for sealing substrates with the use of glass frit, which can be used for a substrate provided with a material having low heat resistance, is provided. A highly airtight sealed body which is manufactured by such a method is provided. A light-emitting device having high productivity and high reliability and a manufacturing method thereof are provided. A heat generation layer containing a conductive material which generates heat by induction heating is formed to overlap with a region where a paste including a frit material and a binder is applied. Alternatively, a conductive material which generates heat by induction heating is added to the paste itself. The paste is locally heated by induction heating to remove the binder included in the paste.
대표청구항▼
1. A sealed body comprising: a first substrate;a second substrate;a glass frit comprising a conductive material;a heat generation layer between the first substrate and the glass frit, the heat generation layer comprising a conductive material;a wiring between the second substrate and the glass frit;
1. A sealed body comprising: a first substrate;a second substrate;a glass frit comprising a conductive material;a heat generation layer between the first substrate and the glass frit, the heat generation layer comprising a conductive material;a wiring between the second substrate and the glass frit; anda sealant between the first substrate and the second substrate, the sealant being positioned outside of the glass frit;wherein the heat generation layer, the glass fit and the wiring overlap one another, andwherein a closed space surrounded by the first substrate, the second substrate, and the glass frit is formed. 2. The sealed body according to claim 1, wherein the conductive material comprises any one of iron, tungsten, and molybdenum. 3. The sealed body according to claim 1, the glass frit further comprising a binder and a frit material. 4. The sealed body according to claim 3, wherein the frit material comprises one or more compounds selected from magnesium oxide, calcium oxide, barium oxide, lithium oxide, sodium oxide, potassium oxide, boron oxide, vanadium oxide, zinc oxide, tellurium oxide, aluminum oxide, silicon dioxide, lead oxide, tin oxide, phosphorus oxide, ruthenium oxide, rhodium oxide, iron oxide, copper oxide, titanium oxide, tungsten oxide, bismuth oxide, and antimony oxide. 5. A light-emitting device comprising the sealed body according to claim 1, wherein the second substrate is provided with a light-emitting unit. 6. The light-emitting device according to claim 5, the light-emitting unit comprising an EL element, the EL element comprising: an anode;a cathode; andan EL layer between the anode and the cathode,wherein the EL layer comprises a light-emitting layer. 7. The light-emitting device according to claim 5, wherein the first substrate is provided with a color filter. 8. A lighting device comprising the light-emitting device according to claim 5. 9. A display device comprising the light-emitting device according to claim 5. 10. A light-emitting device comprising: a first substrate provided with a color filter;a second substrate provided with a light-emitting unit;a glass frit comprising a conductive material;a heat generation layer between the first substrate and the glass frit, the heat generation layer comprising a conductive material;a wiring between the second substrate and the glass frit; anda sealant between the first substrate and the second substrate, the sealant being positioned outside of the glass frit;wherein the heat generation layer, the glass frit and the wiring overlap one another, andwherein a closed space surrounded by the first substrate, the second substrate, and the glass fit is formed. 11. The light-emitting device according to claim 10, wherein the conductive material comprises any one of iron, tungsten, and molybdenum. 12. The light-emitting device according to claim 10, the glass frit further comprising a binder and a frit material. 13. The light-emitting device according to claim 12, wherein the frit material comprises one or more compounds selected from magnesium oxide, calcium oxide, barium oxide, lithium oxide, sodium oxide, potassium oxide, boron oxide, vanadium oxide, zinc oxide, tellurium oxide, aluminum oxide, silicon dioxide, lead oxide, tin oxide, phosphorus oxide, ruthenium oxide, rhodium oxide, iron oxide, copper oxide, titanium oxide, tungsten oxide, bismuth oxide, and antimony oxide. 14. The light-emitting device according to claim 10, the light-emitting unit comprising an EL element, the EL element comprising: an anode;a cathode; andan EL layer between the anode and the cathode,wherein the EL layer comprises a light-emitting layer. 15. A lighting device comprising the light-emitting device according to claim 10. 16. A display device comprising the light-emitting device according to claim 10. 17. The sealed body according to claim 1, wherein the glass frit further comprises an absorber having an absorption property with respect to a laser light. 18. The light-emitting device according to claim 10, wherein the glass frit further comprises an absorber having an absorption property with respect to a laser light. 19. The sealed body according to claim 1, further comprising an insulating layer between the glass frit and the wiring. 20. The light-emitting device according to claim 10, further comprising an insulating layer between the glass fit and the wiring.
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