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Semiconductor device and peeling off method and method of manufacturing semiconductor device

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
  • H01L-033/44
  • H01L-021/20
  • H01L-021/762
  • H01L-027/12
  • G02F-001/136
출원번호 US-0848168 (2013-03-21)
등록번호 US-9202987 (2015-12-01)
우선권정보 JP-2001-216018 (2001-07-16); JP-2001-299620 (2001-09-28)
발명자 / 주소
  • Takayama, Toru
  • Maruyama, Junya
  • Mizukami, Mayumi
  • Yamazaki, Shunpei
출원인 / 주소
  • Semiconductor Energy Laboratory Co., Ltd.
대리인 / 주소
    Robinson Intellectual Property Law Office
인용정보 피인용 횟수 : 6  인용 특허 : 132

초록

The present invention provides a peeling off method without giving damage to the peeled off layer, and aims at being capable of peeling off not only a peeled off layer having a small area but also a peeled off layer having a large area over the entire surface at excellent yield ratio. The metal laye

대표청구항

1. A semiconductor device comprising: a first substrate having flexibility;an adhesive layer comprising resin over the first substrate;a metal oxide layer over the adhesive layer;an insulating layer over the metal oxide layer;a layer containing a transistor over the insulating layer; andan inorganic

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  1. Yamazaki, Shunpei; Takemura, Yasuhiko, Electronic device.
  2. Nakada, Masataka; Abe, Takayuki; Senda, Naoyuki, Light-emitting device.
  3. Chen, Yung-Chien, Method for fabricating curved decoration plate and curved display device.
  4. Chida, Akihiro, Method for manufacturing display device and method for manufacturing electronic device.
  5. Takayama, Toru; Maruyama, Junya; Mizukami, Mayumi; Yamazaki, Shunpei, Semiconductor device and peeling off method and method of manufacturing semiconductor device.
  6. Shishido, Hideaki; Hirakata, Yoshiharu; Kubota, Daisuke, Touch panel.
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