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Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow one or more fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks

Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow one or more fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves fanless servers installed on the server racks and introduces fan units to draw cooling air from the cold row encapsulation structure through the fanless servers on the racks.

대표청구항 ▼

1. An encapsulation structure comprising: a first server rack port for receiving one or more racks, each rack associated with the first server rack port for receiving one or more servers;a second server rack port for receiving one or more racks, each rack associated with the second server rack port

1. An encapsulation structure comprising: a first server rack port for receiving one or more racks, each rack associated with the first server rack port for receiving one or more servers;a second server rack port for receiving one or more racks, each rack associated with the second server rack port for receiving one or more servers, the second server rack port facing the first server rack port, the first server rack port spaced apart from the first server rack port to create a space between the first server rack port and the second server rack port;a ceiling extending above the space, the ceiling for facilitating enclosure of the space and for supporting one or more fans, the one or more fans located above the space for pushing air from outside the encapsulation structure to the space within the encapsulation structure for cooling the one or more servers associated with the first server rack port and the one or more servers associated with the second server rack port; anda cooling module disposed over the ceiling and interfaced with the one or more fans. 2. The encapsulation structure of claim 1, further comprising a first side and a second side, the first side, the second side, the first server rack port, and the second server rack port for facilitating enclosure of the space between the first server rack port and the second server rack port. 3. The encapsulation structure of claim 2, wherein the first side includes a door for facilitating entrance into and exit from the space between the first server rack port and the second server rack port. 4. The encapsulation structure of claim 1, wherein the encapsulation structure includes a frame and a door, the door used for access to the space. 5. The encapsulation structure of claim 4, wherein the first server rack port and the second server rack port facilitate a supply of air associated with the one or more servers associated with the first server rack port and the one or more servers associated with the second server rack port from the encapsulation structure to a space of a data center. 6. The encapsulation structure of claim 1, further comprising a bottom part that is adjacent to the first server rack port and the second server rack port, wherein the bottom part is on top of a plurality of stability control units, the stability control units configured to withstand seismic movements. 7. The encapsulation structure of claim 1, wherein the one or more racks associated with the first server rack port and the one or more racks associated with the second server rack port are connected to the encapsulation structure. 8. The encapsulation structure of claim 1, wherein the one or more racks associated with the first server rack port and the one or more racks associated with the second server rack port are integral with the encapsulation structure. 9. The encapsulation structure of claim 1, wherein the one or more fans face the space. 10. The encapsulation structure of claim 1, wherein the ceiling is located between the first server rack port and the second server rack port. 11. A data center comprising: an encapsulation structure including: a first server rack port for receiving one or more racks, each rack associated with the first server rack port for receiving one or more servers;a second server rack port for receiving one or more racks, each rack associated with the second server rack port for receiving one or more servers, the second server rack port facing the first server rack port, the first server rack port spaced apart from the first server rack port to create a space between the first server rack port and the second server rack port; anda ceiling extending above the space, the ceiling of the encapsulation structure for supporting a cooling module located above the space, the cooling module for providing air to the space; andone or more dampers located above the cooling module and the ceiling, the one or more dampers configured to open to facilitate an increase in a supply of air to the cooling module, the one or more dampers configured to close to facilitate a decrease in the supply of air to the cooling module. 12. The data center of claim 11, further comprising a ceiling, the ceiling of the data center connected to one or more fans. 13. The data center of claim 11, further comprising a ceiling, wherein the one or more dampers are located at the ceiling of the data center. 14. The data center of claim 11, further comprising a mixing chamber located above the cooling module, the mixing chamber for receiving air that is ejected from the one or more servers associated with the first server rack port and the one or more servers associated with the second server rack port. 15. The data center of claim 14, further comprising a side wall, the side wall spaced apart from the mixing chamber to form a space, wherein the one or more dampers are located between the mixing chamber and the space between the side wall of the data center and the mixing chamber. 16. An encapsulation structure comprising: a first server rack port for receiving one or more racks, each rack associated with the first server rack port for receiving one or more servers;a second server rack port for receiving one or more racks, each rack associated with the second server rack port for receiving one or more servers, the second server rack port facing the first server rack port, the first server rack port spaced apart from the first server rack port to create a space between the first server rack port and the second server rack port; anda top side of the encapsulation structure for supporting a cooling module, the top side extending over the space, the cooling module having a side wall and a bottom wall, the bottom wall adjacent to the top side, the side wall attached to one or more fans, the one or more fans for pushing air into the encapsulation structure. 17. The encapsulation structure of claim 16, wherein the side wall faces a side wall of a data center. 18. The encapsulation structure of claim 16, wherein the one or more racks associated with the first server rack port and the one or more racks associated with the second server rack port are connected to the encapsulation structure. 19. The encapsulation structure of claim 16, wherein the one or more racks associated with the first server rack port and the one or more racks associated with the second server rack port are integral with the encapsulation structure. 20. The encapsulation structure of claim 16, wherein the one or more fans face a space formed between the encapsulation structure and a side wall of a data center.