Contaminant separator for a vapor-compression refrigeration apparatus
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F25D-023/12
F25B-021/02
F25B-043/00
H05K-007/20
B23P-015/26
출원번호
US-0271304
(2011-10-12)
등록번호
US-9207002
(2015-12-08)
발명자
/ 주소
Campbell, Levi A.
Chu, Richard C.
Colgan, Evan G.
David, Milnes P.
Ellsworth, Jr., Michael J.
Iyengar, Madhusudan K.
Simons, Robert E.
출원인 / 주소
INTERNATIONAL BUSINESS MACHINES CORPORATION
대리인 / 주소
Chiu, Esq., Steven
인용정보
피인용 횟수 :
0인용 특허 :
54
초록▼
Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to a
Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant separator coupled in fluid communication with the refrigerant flow path. The separator includes a refrigerant cold filter and a thermoelectric array. At least a portion of refrigerant passing through the refrigerant flow path passes through the cold filter, and the thermoelectric array provides cooling to the cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the cold filter. The separator may further include a refrigerant hot filter coupled to a hot side of the thermoelectric array for further filtering the refrigerant.
대표청구항▼
1. An apparatus for facilitating cooling of an electronic component, the apparatus comprising: a vapor-compression refrigeration system comprising a refrigerant expansion component, a refrigerant evaporator, a compressor and a condenser coupled in fluid communication to define a refrigerant flow pat
1. An apparatus for facilitating cooling of an electronic component, the apparatus comprising: a vapor-compression refrigeration system comprising a refrigerant expansion component, a refrigerant evaporator, a compressor and a condenser coupled in fluid communication to define a refrigerant flow path and allow the flow of refrigerant therethrough, the refrigerant evaporator being configured to couple to the electronic component; anda contaminant separator coupled in fluid communication with the refrigerant flow path, the contaminant separator comprising: a first filter and a second filter, the first filter and the second filter being coupled to the refrigerant flow path at different locations along the refrigerant flow path, wherein at least a portion of refrigerant passing through the refrigerant flow path passes through the first filter and passes through the second filter, the first filter being a cooling filter cooling the refrigerant passing therethrough, and the second filter being a heating filter heating the refrigerant passing therethrough; anda thermoelectric array comprising at least one thermoelectric module, the thermoelectric array being coupled at a first side to the first filter and at a second side to the second filter, and providing cooling to the first filter to cool refrigerant passing through the first filter, and facilitate deposition in the first filter of contaminants solidifying from the refrigerant due to cooling of the refrigerant in the first filter, an providing heating to the second filter to heat refrigerant passing through the second filter, and facilitate deposition in the second filter of contaminants extracted from the refrigerant by heating of the refrigerant in the second filter. 2. The apparatus of claim 1, wherein the first filter is coupled in fluid communication with the refrigerant flow path upstream of the refrigerant expansion component, and the second filter is coupled to the refrigerant flow path upstream of the first filter. 3. The apparatus of claim 1, wherein the second filter comprises a refrigerant boiling filter to boil refrigerant passing through the refrigerant boiling filter, and facilitate deposition in the refrigerant boiling filter of contaminants extracted from the refrigerant due to boiling of the refrigerant in the refrigerant boiling filter. 4. The apparatus of claim 1, wherein the second filter is coupled in fluid communication with and parallel to at least a portion of a refrigerant path through the condenser. 5. The apparatus of claim 1, wherein the first filter comprises a liquid-permeable structure which includes thermally conductive surfaces across which refrigerant passing through the contaminant separator flows, and wherein the thermoelectric array provides conduction cooling to the thermally conductive surfaces of the liquid-permeable structure across which the refrigerant flows to facilitate contaminants solidifying from the refrigerant due to cooling of the refrigerant. 6. The apparatus of claim 5, wherein the second filter comprises a fluid-permeable structure which includes thermally conductive surfaces across which the refrigerant passing through the second filter passes, and wherein the thermoelectric array heats the thermally conductive surfaces of the fluid-permeable structure of the second filter across which the refrigerant passes to facilitate boiling of liquid refrigerant and extracting of contaminants from the refrigerant due to heating of the refrigerant. 7. The apparatus of claim 6, wherein the first filter comprises one of a metal foam structure, metal mesh or screen structure, or an array of thermally conductive fins, and wherein the second filter comprises one of a metal foam structure, metal mesh or screen structure, or an array of thermally conductive fins. 8. A cooled electronic system comprising: at least one heat generating electronic component;a vapor-compression refrigeration system coupled to the at least one heating generating electronic component, the vapor compression refrigeration system comprising: a refrigerant expansion component;a refrigerator evaporator, the refrigerant evaporator being coupled to the at least one heat generating electronic component;a compressor; anda condenser,a refrigerant flow path coupling in fluid communication the refrigerant expansion component, the refrigerant evaporator, the compressor and the condenser; anda contaminant separator coupled in fluid communication with the refrigerant flow path, the refrigerant separator including: a first filter and a second filter, the first filter and the second filter being coupled to the refrigerant flow path at different locations along the refrigerant flow path, wherein at least a portion of refrigerant passing through the refrigerant flow path passes through the first filter and passes through the second filter, the first filter being a cooling filter cooling the refrigerant passing therethrough, and the second filter being a heating filter heating the refrigerant passing therethrough; anda thermoelectric array comprising at least one thermoelectric module, the thermoelectric array being coupled at a first side to the first filter and at a second side to the second filter, and providing cooling to the first filter to cool refrigerant passing through the first filter, and facilitate deposition in the first filter of contaminants solidifying from the refrigerant due to cooling of the refrigerant in the first filter, and providing heating to the second filter to heat refrigerant passing through the second filter, and facilitate deposition in the second filter of contaminants extracted from the refrigerant by heating of the refrigerant in the second filter. 9. The cooled electronic system of claim 8, wherein the first filter is coupled in fluid communication with the refrigerant flow path upstream of the refrigerant expansion component, and the second filter is coupled to the refrigerant flow path upstream of the first filter. 10. The cooled electronic system of claim 8, wherein the second filter comprises a refrigerant boiling filter to boil refrigerant passing through the refrigerant boiling filter, and facilitate deposition in the refrigerant boiling filter of contaminants extracted from the refrigerant due to boiling of the refrigerant in the refrigerant boiling filter. 11. The cooled electronic system of claim 8, wherein the second filter is coupled in fluid communication with and parallel to at least a portion of a refrigerant path through the condenser. 12. The cooled electronic system of claim 8, wherein the first filter comprises a liquid-permeable structure which includes thermally conductive surfaces across which refrigerant passing through the contaminant separator flows, and wherein the thermoelectric array provides conduction cooling to the thermally conductive surfaces of the liquid-permeable structure across which the refrigerant flows to facilitate contaminants solidifying from the refrigerant due to cooling of the refrigerant. 13. The cooled electronic system of claim 12, wherein the second filter comprises a fluid-permeable structure which includes thermally conductive surfaces across which the refrigerant passing through the second filter passes, and wherein the thermoelectric array heats the thermally conductive surfaces of the fluid-permeable structure of the second filter across which the refrigerant passes to facilitate boiling of liquid refrigerant and extracting of contaminants from the refrigerant due to heating of the refrigerant. 14. The cooled electronic system of claim 13, wherein the first filter comprises one of a metal foam structure, metal mesh or screen structure, or an array of thermally conductive fins, and wherein the second filter comprises one of a metal foam structure, metal mesh or screen structure, or an array of thermally conductive fins. 15. A method of fabricating a vapor-compression refrigeration system for cooling at least one heating generating electronic component, the method comprising: providing a condenser, a refrigerant expansion structure, a refrigerant evaporator, and a compressor;coupling the condenser, refrigerant expansion structure, refrigerant evaporator and compressor in fluid communication to define a refrigerant flow path;providing a contaminant separator in fluid communication with the refrigerant flow path, the refrigerant separator including: a first filter and a second filter, the first filter and the second filter being coupled to the refrigerant flow path at different locations along the refrigerant flow path, wherein at least a portion of refrigerant passing through the refrigerant flow path passes through the first filter and passes through the second filter, the first filter being a cooling filter cooling the refrigerant passing therethrough, and the second filter being a heating filter heating the refrigerant passing therethrough; anda thermoelectric array comprising at least one thermoelectric module, the thermoelectric array being coupled at a first side to the first filter and at a second side to the second filter, and providing cooling to the first filter to cool refrigerant passing through the first filter, and facilitate deposition in the first filter of contaminants solidifying from the refrigerant due to cooling of the refrigerant in the first filter, and providing heating to the second filter to heat refrigerant passing through the second filter, and facilitate deposition in the second filter of contaminants extracted from the refrigerant by heating of the refrigerant in the second filter; andproviding refrigerant within the refrigerant flow path of the vapor-compression refrigeration system to allow for cooling of the at least one heat-generating electronic component, wherein the contaminant separator removes contaminants from the refrigerant commensurate with cooling of the at least one heat-generating electronic component.
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