Liquid processing apparatus, liquid processing method and storage medium for liquid processing
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G03F-007/16
B05C-005/02
H01L-021/67
B05C-011/10
B05C-011/08
B08B-003/10
B08B-003/08
출원번호
US-0949733
(2013-07-24)
등록번호
US-9217922
(2015-12-22)
우선권정보
JP-2012-165319 (2012-07-26)
발명자
/ 주소
Kubota, Minoru
Yoshihara, Kousuke
Tachibana, Kouzou
출원인 / 주소
TOKYO ELECTRON LIMITED
대리인 / 주소
Nath, Goldberg & Meyer
인용정보
피인용 횟수 :
0인용 특허 :
2
초록▼
A liquid processing apparatus includes a substrate holding unit arranged within a processing cup and configured to horizontally hold a substrate, a rotating mechanism configured to rotate the substrate holding unit about a vertical axis, a processing liquid supply unit configured to supply a process
A liquid processing apparatus includes a substrate holding unit arranged within a processing cup and configured to horizontally hold a substrate, a rotating mechanism configured to rotate the substrate holding unit about a vertical axis, a processing liquid supply unit configured to supply a processing liquid onto a surface of the substrate, and an exhaust mechanism configured to discharge an atmospheric gas around the substrate. The exhaust mechanism includes an exhaust flow path connected to an exhaust port formed at the processing cup, a circulation flow path branched from the exhaust flow path and configured to communicate with the processing cup, a gas liquid separator, a first regulator valve installed at one end of the exhaust flow path, and a second regulator valve installed at the other end of the exhaust flow path.
대표청구항▼
1. A liquid processing apparatus, comprising: a substrate holding unit arranged within a processing cup having an open top end and configured to horizontally hold a substrate;a rotating mechanism configured to rotate the substrate holding unit about a vertical axis;a processing liquid supply unit co
1. A liquid processing apparatus, comprising: a substrate holding unit arranged within a processing cup having an open top end and configured to horizontally hold a substrate;a rotating mechanism configured to rotate the substrate holding unit about a vertical axis;a processing liquid supply unit configured to supply a processing liquid onto a surface of the substrate; andan exhaust mechanism configured to discharge an atmospheric gas around the substrate held by the substrate holding unit,wherein the exhaust mechanism includes:an exhaust flow path communicating with an exhaust port formed in a bottom portion of the processing cup at a first end while communicating with an outside at a second end and provided with an exhaust device installed in the exhaust flow path;a circulation flow path branched from a branching portion of the exhaust flow path to communicate with the processing cup;a gas liquid separator installed at the branching portion, and configured to separate the atmospheric gas into a mist and a gas;a first regulator valve installed at the first end of the exhaust flow path and capable of being opened and closed and capable of adjusting an opening degree; anda second regulator valve installed at the second end of the exhaust flow path and capable of being opened and closed. 2. The apparatus of claim 1, further comprising: a control unit configured to control operations of the rotating mechanism, the exhaust device, the first regulator valve and the second regulator valve, wherein, based on a control signal supplied from the control unit, during a processing operation of forming a processing liquid film on the substrate surface by supplying the processing liquid from the processing liquid supply unit onto the surface of the substrate under rotation, the gas separated by the gas liquid separator is introduced into the processing cup from the circulation flow path by opening the first regulator valve and closing the second regulator valve and the atmospheric gas around the substrate within the processing cup is guided toward the exhaust port by the gas introduced into the processing cup, and after stopping the processing operation, the gas remaining within the exhaust flow path is discharged by closing the first regulator valve and opening the second regulator valve;wherein a supply port is formed below a gap between an opening portion of the processing cup and a peripheral portion of the substrate, the supply port communicating with the circulation flow path; andwherein a flow rate of the gas flowing through the circulation flow path is kept constant by adjusting the opening degree of the first regulator valve. 3. The apparatus of claim 1, wherein the second regulator valve is formed such that an opening degree thereof is adjustable;a third regulator valve and a concentration sensor configured to measure an organic component concentration are arranged in the circulation flow path in a direction from the gas liquid separator toward a supply port;the apparatus further comprises a control unit configured to control operations of the rotating mechanism, the exhaust device, the first regulator valve and the second regulator valve and to control an operation of the third regulator valve in response to a detection signal supplied from the concentration sensor;based on control signals supplied from the control unit, during a processing operation of supplying the processing liquid from the processing liquid supply unit onto the surface of the substrate under rotation, the gas separated by the gas liquid separator is introduced into the processing cup from the circulation flow path by opening the first regulator valve and the third regulator valve and closing the second regulator valve and the atmospheric gas around the substrate within the processing cup is guided toward the exhaust port by the gas introduced into the processing cup;after stopping the processing operation, the gas remaining within the exhaust flow path is discharged by closing the first regulator valve and the third regulator valve and opening the second regulator valve;if the organic component concentration of the gas existing in the circulation flow path is equal to or higher than a specified concentration, the gas is discharged by opening the first regulator valve and the second regulator valve and closing the third regulator valve;if the organic component concentration is lower than the specified concentration and higher than a permissible concentration, the gas is discharged by opening the first regulator valve and the second regulator valve and closing the third regulator valve and then the gas remaining in the exhaust flow path is discharged by closing the first regulator valve;if the organic component concentration is equal to or lower than the permissible concentration, the processing operation is performed by opening the first regulator valve and the third regulator valve and closing the second regulator valve after reducing the opening degree of the second regulator valve;wherein the supply port is formed below a gap between an opening portion of the processing cup and a peripheral portion of the substrate, the supply port communicating with the circulation flow path; andwherein a flow rate of the gas flowing through the circulation flow path is kept constant by adjusting the opening degree of the first regulator valve. 4. The apparatus of claim 2, wherein a temperature/humidity regulator configured to regulate at least one of the temperature and the humidity is installed in the circulation flow path, the temperature/humidity regulator controlled by a control unit to make constant the temperature and/or the humidity of the gas introduced into the processing cup from above the processing cup and the temperature and/or the humidity of the gas introduced into the processing cup from the circulation flow path. 5. The apparatus of claim 2, wherein a baffle plate configured to prevent the gas introduced from the circulation flow path into the processing cup from flowing toward the substrate is installed in the supply port of the circulation flow path. 6. The apparatus of claim 2, wherein the supply port of the circulation flow path is opened radially outwardly with respect to the substrate held by the substrate holding unit.
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이 특허에 인용된 특허 (2)
Koji Sakai JP, Coating film formation apparatus and aging process apparatus.
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