A data center system can include a mobile support structure; one or more enclosures for removable electronic equipment where the enclosures are housed by the support structure; a cooling system in fluid communication with the enclosures for cooling of the electronic equipment where the cooling syste
A data center system can include a mobile support structure; one or more enclosures for removable electronic equipment where the enclosures are housed by the support structure; a cooling system in fluid communication with the enclosures for cooling of the electronic equipment where the cooling system is housed by the support structure; and a power system operably connected to the electronic equipment and the cooling system for supplying power thereto where the power system comprises a generator housed by the support system. The mobile data center can be moved to remote locations, and the electronic equipment can be placed in communication with a network when at the remote location. Other embodiments are disclosed.
대표청구항▼
1. A modular data center system comprising: a module for housing removable electronic equipment;the module connected directly to a utility power grid;a cooling system in fluid communication with an inner volume of the module for cooling of the electronic equipment;wherein the data center system is c
1. A modular data center system comprising: a module for housing removable electronic equipment;the module connected directly to a utility power grid;a cooling system in fluid communication with an inner volume of the module for cooling of the electronic equipment;wherein the data center system is capable of being moved to remote locations;a cabinet within the module that forms an enclosure;a sensor in proximity to the cabinet for sensing environmental data associated with the electronic equipment;a controller coupled to the sensor and the module, the controller receiving the environmental data from the sensor and configured to collect historical data associated with the modular data center system. 2. The modular data center system of claim 1, wherein, based upon the environmental data, the controller causes an adjustment to an environmental condition associated with the modular data center system. 3. The modular data center system of claim 1, wherein the module receives power only from the power grid. 4. The modular data center system of claim 1, wherein, based upon the environmental data, the controller causes an adjustment to an environmental condition associated with the modular data center system, and wherein the environmental condition is at least one of a temperature, a pressure or a humidity associated with the cabinet. 5. The modular data center system of claim 4, wherein the controller causes the adjustment in real time. 6. The modular data center system of claim 4, wherein the environmental condition comprises the temperature, the pressure and the humidity. 7. The modular data center system of claim 1, wherein the electronic equipment is capable of being placed in communication with a network when at the remote location. 8. The modular data center system of claim 1, wherein the cabinet has an inlet and an outlet, and wherein the modular data system further comprises a supply channel connected with the cabinet inlet;an exhaust channel connected with the cabinet outlet; andone or more plenums in fluid communication with at least one of the supply and exhaust channels. 9. The modular data center system of claim 8, further comprising a damper connected with the air supply channel, wherein the damper has a damper actuator connected thereto, and wherein the damper can be opened and closed based on signals transmitted from the controller to the damper actuator. 10. The modular data center system of claim 1, wherein the sensor comprises a plurality of sensors in proximity to the electronic equipment for monitoring at least one of a temperature, a pressure and a humidity associated with the electronic equipment. 11. The modular data center system of claim 1, further comprising a mobile support structure, wherein the housing is disposed on the mobile support structure and the mobile support structure comprises a trailer capable of being towed to the remote location. 12. The modular data center system of claim 1, wherein the cabinet has an inlet and an outlet, and a supply channel connected with the cabinet inlet;an exhaust channel connected with the cabinet outlet; andone or more plenums in fluid communication with at least one of the supply channel and the exhaust channel,wherein the cooling system includes a cooling coil, wherein a coolant flows through the cooling coil to remove heat from the air flowing through the supply channel. 13. The modular data center system of claim 12, further comprising a pressure source within the one or more plenums for generating a pressure differential through the module causing air to flow therethrough. 14. The modular data center system of claim 12, wherein the cooling system is at least partially housed by the module. 15. The modular data center system of claim 12, wherein the inlet is in proximity to a bottom portion of the cabinet, and wherein the outlet is in proximity to a top portion of the cabinet. 16. The modular data center system of claim 12, wherein the cabinet is positioned on a floor in the module and the supply channel is under the floor. 17. The modular data center system of claim 16, wherein the cooling coil is positioned under the floor and in thermal contact with the supply channel.
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이 특허에 인용된 특허 (13)
Gourdine Meredith C. (Houston TX), Apparatus and method for cooling heat generating electronic components in a cabinet.
Yates, Randall A.; Ferren, Bran; Hillis, W. Daniel; Khanlian, Luke W.; Salter, Kenneth D., Server rack service utilities for a data center in a shipping container.
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