An abrasive article may include a substrate, a tacking film overlying the substrate, abrasive particles that may include a coating layer bonded to the tacking film such that a bond between the coating layer and the tacking film defines a metallic bonding region, and a bonding layer overlying the abr
An abrasive article may include a substrate, a tacking film overlying the substrate, abrasive particles that may include a coating layer bonded to the tacking film such that a bond between the coating layer and the tacking film defines a metallic bonding region, and a bonding layer overlying the abrasive particles and the tacking film.
대표청구항▼
1. An abrasive article for cutting a workpiece formed by a process comprising: providing a wire substrate;forming a tacking film comprising a metal material overlying a surface of the wire substrate;placing abrasive particles in the tacking film;treating the tacking film to form a metallic bonding r
1. An abrasive article for cutting a workpiece formed by a process comprising: providing a wire substrate;forming a tacking film comprising a metal material overlying a surface of the wire substrate;placing abrasive particles in the tacking film;treating the tacking film to form a metallic bonding region between the abrasive particles and the tacking film, wherein the tacking film comprises an average thickness of at least about 10% and not greater than about 30% of an average particle size of the abrasive particles and wherein the tacking film comprises an electroplated layer; andforming a bonding layer over the tacking film and the abrasive particles. 2. The abrasive article of claim 1, wherein the substrate comprises an inorganic material. 3. The abrasive article of claim 2, wherein the substrate comprises steel. 4. The abrasive article of claim 1, wherein the substrate comprises an average width of at least about 0.03 mm and not greater than about 1 cm. 5. The abrasive article of claim 1, wherein the tacking film comprises an average thickness of not greater than about 80% of an average particle size of the abrasive particles. 6. The abrasive article of claim 1, wherein the metallic bonding region comprises a diffusion bond region characterized by a region of interdiffusion between at least one chemical species of a coating layer overlying the abrasive particles and one chemical species of the tacking film. 7. An abrasive article for cutting a workpiece formed by a process comprising: providing a wire substrate;forming a tacking film comprising a metal material overlying a surface of the wire substrate;applying a flux material to the tacking film, wherein the flux material comprises abrasive particles mixed therein;treating the tacking film to form a metallic bonding region between the abrasive particles and the tacking film, wherein the tacking film comprises an average thickness of at least about 10% and not greater than about 30% of an average particle size of the abrasive particles and wherein the tacking film comprises an average thickness of at least about 0.1 microns and not greater than about 4 microns; andforming a bonding layer over the tacking film and the abrasive particles. 8. The abrasive article of claim 7, wherein the abrasive particles comprise an average particle size of at least about 0.1 microns and not greater than about 500 microns. 9. The abrasive article of claim 7, wherein the abrasive particles comprise a superabrasive material. 10. The abrasive article of claim 7, wherein an average thickness of the bonding layer is at least about 2 microns and not greater than about 100 microns. 11. The abrasive article of claim 7, wherein the tacking film has a melting point of not greater than about 250° C. 12. The abrasive article of claim 7, wherein the tacking film comprises a metal alloy of tin and lead. 13. The abrasive article of claim 7, wherein the substrate comprises a plurality of filaments braided together. 14. The abrasive article of claim 7, wherein the substrate includes a wire and an abrasive grain concentration of the abrasive article is at least about 60 particles per mm of wire and not greater than about 750 particles per mm of wire. 15. The abrasive article of claim 7, wherein forming the tacking film comprises a method selected from the group consisting of deposition, spraying, printing, dipping, die coating, electroplating, and a combination thereof. 16. The abrasive article of claim 7, wherein the tacking film is bonded to the substrate at a bonding region defined by interdiffusion of elements of the tacking film and the substrate. 17. The abrasive article of claim 7, wherein the tacking film comprises a material selected from the group of materials consisting of metal, metal alloys, metal matrix composites, and a combination thereof. 18. The abrasive article of claim 7, wherein the tacking film comprises a metal alloy of tin and lead. 19. The abrasive article of claim 7, wherein the tacking film has a melting point of not greater than about 450° C.
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Brukvoort Wesley J. (P.O. Box 33427 St. Paul MN 55133-3427) Howard Robert N. (P.O. Box 33427 St. Paul MN 55133-3427), Abrasive article and processes for producing it.
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Gorsuch Ian (Biddenden GB2) Lawson Timothy (Maidston GB2), Abrasive articles incorporating abrasive elements comprising abrasive particles partially embedded in a metal binder.
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Adefris Negus B. ; Erickson Carl P., Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece.
McDonald Allen S. (Bridgeport CT) Philp Charles W. (New York NY) Sperakis Thomas A. (E. Elmhurst NY), Method of brazing carbide using copper-zinc-manganese-nickel alloys.
Chesley Jason A. ; Bell Donald R. ; Rude Harold E. ; Sheffield William F. ; Slama David F. ; Stephens Alan N.,GBX, Method of making an abrasive article.
Barber ; Jr. Loren L. (Lake Elmo MN) Welygan Dennis G. (Woodbury MN) Pihl Richard M. (Cottage Grove MN), Method of making composite abrasive filaments.
Hoffmuller Wilhelm (Munchen DEX) Eichner Josef (Scheyern DEX) Sigl Robert (Ergolding DEX) Uihlein Thomas (Dachau DEX), Method of manufacturing a metallic component or substrate with bonded coating.
Smith, Maynard B.; Schmid, Frederick; Khattak, Chandra P., Process of forming a plated wirepack with abrasive particles only in the cutting surface with a controlled kerf.
Lange, Martin; Vaneecke, Jan; Lameire, Rebecca, Sawing wire with abrasive particles partly embedded in a metal wire and partly held by an organic binder.
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