Thin form factor computational array cameras and modular array cameras
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H04N-005/225
H04N-005/33
H04N-005/349
출원번호
US-0188524
(2014-02-24)
등록번호
US-9253380
(2016-02-02)
발명자
/ 주소
Venkataraman, Kartik CA
Gallagher, Paul
Lelescu, Dan
McMahon, Andrew Kenneth John
Duparre, Jacques
Pain, Bedabrata
출원인 / 주소
Pelican Imaging Corporation
대리인 / 주소
KPPB LLP
인용정보
피인용 횟수 :
47인용 특허 :
167
초록▼
Systems and methods in accordance with embodiments of the invention implement modular array cameras using sub-array modules. In one embodiment, an X×Y sub-array module includes: an X×Y arrangement of focal planes, where X and Y are each greater than or equal to 1; and an X×Y arrangement of lens stac
Systems and methods in accordance with embodiments of the invention implement modular array cameras using sub-array modules. In one embodiment, an X×Y sub-array module includes: an X×Y arrangement of focal planes, where X and Y are each greater than or equal to 1; and an X×Y arrangement of lens stacks, the X×Y arrangement of lens stacks being disposed relative to the X×Y arrangement of focal planes so as to form an X×Y arrangement of cameras, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene; and image data output circuitry that is configured to output image data from the X×Y sub-array module that can be aggregated with image data from other sub-array modules so that an image of the scene can be constructed.
대표청구항▼
1. An X×Y sub-array module comprising: an X×Y arrangement of focal planes, wherein: X and Y are each greater than or equal to 1;each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels;each focal plane does not include pixels from another focal plane;
1. An X×Y sub-array module comprising: an X×Y arrangement of focal planes, wherein: X and Y are each greater than or equal to 1;each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels;each focal plane does not include pixels from another focal plane; andthe X×Y arrangement of focal planes are embodied within an integrated circuit that does not include any focal planes of another X×Y sub-array module; andan X×Y arrangement of lens stacks, the X×Y arrangement of lens stacks being disposed relative to the X×Y arrangement of focal planes so as to form an X×Y arrangement of cameras, each of which being configured to independently capture an image of a scene, wherein each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene;image data output circuitry that is configured to output image data from the X×Y sub-array module that is capable of being aggregated with image data from other sub-array modules to construct so that an image of the scene; andinterface circuitry configured to couple, either directly or indirectly, with one of:another X×Y sub-array module or a processor that is in electrical communication with at least one other X×Y sub-array module; wherein the interface circuitry is configured to transmit output image data to a directly or indirectly coupled X×Y sub-array module or a directly or indirectly coupled processor that is in electrical communication with at least one other X×Y sub-array module. 2. The X×Y sub-array module of claim 1, wherein X is 1. 3. The X×Y sub-array module of claim 1, wherein X and Y are each greater than 1. 4. The X×Y sub-array module of claim 1, wherein the arrangement of cameras are embodied within a single monolithic structure. 5. An M×N array camera comprising: a plurality of X×Y sub-array modules, each comprising: an X×Y arrangement of focal planes, wherein: X and Y are each greater than or equal to 1;each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels; andeach focal plane does not include pixels from another focal plane;the X×Y arrangement of focal planes are embodied within an integrated circuit that does not include any focal planes of another X×Y sub-array module; andan X×Y arrangement of lens stacks, the X×Y arrangement of lens stacks being disposed relative to the X×Y arrangement of focal planes so as to form an X×Y arrangement of cameras, each of which being configured to independently capture an image of a scene, wherein each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene;image data output circuitry that is configured to output image data from the sub-array module that is capable of being aggregated with image data from other sub-array modules to construct an image of the scene; andinterface circuitry configured to couple, either directly or indirectly, with one of: another X×Y sub-array module or a processor that is in electrical communication with at least one other X×Y sub-array module; wherein the interface circuitry is configured to transmit output image data to a directly or indirectly coupled X×Y sub-array module or a directly or indirectly coupled processor that is in electrical communication with at least one other X×Y sub-array module;wherein the plurality of X×Y sub-array modules define at least some of the cameras in an M×N arrangement of cameras; anda processor;wherein each sub-array module is configured to transmit respective output image data to the processor via its respective distinct interface circuitry;wherein the processor is configured to construct an image of the scene using image data generated by each of the sub-array modules. 6. The array camera of claim 5, wherein X is 1 and M is 1. 7. The array camera of claim 5, wherein the plurality of X×Y sub-array modules define an M×N arrangement of cameras. 8. The array camera of claim 5, further comprising circuitry that aggregates the image data generated by each of the sub-array modules into a single MIPI output, and provides the MIPI output to the processor. 9. The array camera of claim 5, further comprising a parallax disparity resolution module, wherein the parallax disparity resolution module is configured to receive image data captured by each sub-array module, implement a parallax detection and correction process on the received image data, and output the result for further processing. 10. The array camera of claim 9, further comprising circuitry that converts the output of the parallax disparity resolution module into a single MIPI output, and provides the MIPI output to the processor. 11. The array camera of claim 10, wherein the parallax disparity resolution module comprises a processor and memory, wherein the memory contains software to configure the processor to act as a parallax disparity resolution module. 12. The array camera of claim 10, wherein the parallax disparity resolution module is a hardware parallax disparity resolution module. 13. The array camera of claim 5, wherein M and N are each greater than or equal to 2. 14. The array camera of claim 5, wherein at least two of the plurality of sub-array modules are adjoined to the interconnects of a single substrate, and are each capable of outputting image data through the interconnects. 15. The array camera of claim 14, wherein each of the plurality of sub-array modules are adjoined to the interconnects of a single substrate, and are each capable of outputting image data through the interconnects. 16. The array camera of claim 15, wherein the substrate is optically transparent. 17. The array camera of claim 16, wherein the substrate is glass. 18. The array camera of claim 15, wherein the substrate is ceramic with through-holes that clear the optical path. 19. The array camera of claim 5, wherein at least one sub-array module is embodied within a single monolithic structure. 20. The array camera of claim 5, wherein each sub-array module is embodied within a single respective monolithic structure. 21. The array camera of claim 5, further comprising: a plurality of I/O devices, wherein each of the plurality of I/O devices interfaces with at least one camera: anda separate I/O block that includes circuitry configured to receive image data, aggregate the received image data, and output the aggregated image data to the processor; andwherein each of the plurality of I/O devices interfaces with the I/O block. 22. The array camera of claim 21, wherein the number of I/O devices equals the number of sub-array modules, and wherein each I/O device interfaces with a corresponding sub-array module. 23. The X×Y sub-array module of claim 1, wherein the interface circuitry is configured to transmit output image data to a directly or indirectly coupled X×Y sub-array module. 24. The X×Y sub-array module of claim 1, wherein the interface circuitry is configured to transmit output image data to a directly or indirectly coupled processor that is in electrical communication with at least one other X×Y sub-array module. 25. The M×N array camera of claim 5, wherein at least one X×Y sub-array module comprises interface circuitry configured to transmit output image data to a directly or indirectly coupled X×Y sub-array module. 26. The M×N array camera of claim 5, wherein at least one X×Y sub-array module comprises interface circuitry configured to transmit output image data to a directly or indirectly coupled X×Y processor that is in electrical communication with at least one sub-array module.
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이 특허에 인용된 특허 (167)
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