A light-emitting diode package includes a light-emitting structure, a first electrode pad and a second electrode pad connected with the light-emitting structure, an insulating pattern layer in contact with a bottom surface of the light-emitting structure and abutting the first and second electrode p
A light-emitting diode package includes a light-emitting structure, a first electrode pad and a second electrode pad connected with the light-emitting structure, an insulating pattern layer in contact with a bottom surface of the light-emitting structure and abutting the first and second electrode pads, a substrate including via-holes in contact with a bottom surface of the insulating pattern layer and exposing a portion of the first electrode pad and a portion of the second electrode pad, a first penetrating electrode and a second penetrating electrode that are disposed in the via-holes and respectively connected with the first and second electrode pads, a fluorescent material layer disposed on the light-emitting structure, a glass disposed on and spaced apart from the light-emitting structure with the fluorescent material layer therebetween.
대표청구항▼
1. A light-emitting diode (LED) package, comprising: a light-emitting structure;a first electrode pad and a second electrode pad, connected with the light-emitting structure;an insulating pattern layer in contact with a bottom surface of the light-emitting structure and abutting the first electrode
1. A light-emitting diode (LED) package, comprising: a light-emitting structure;a first electrode pad and a second electrode pad, connected with the light-emitting structure;an insulating pattern layer in contact with a bottom surface of the light-emitting structure and abutting the first electrode pad and the second electrode pad;a substrate including via-holes that are in contact with a bottom surface of the insulating pattern layer and expose a portion of the first electrode pad and a portion of the second electrode pad;a first penetrating electrode and a second penetrating electrode that are disposed in the via-holes and are respectively connected with the first electrode pad and the second electrode pad;a fluorescent material layer disposed on the light-emitting structure; anda glass disposed on and spaced apart from the light-emitting structure with the fluorescent material layer between the glass and the light-emitting structure. 2. The LED package of claim 1, wherein the fluorescent material layer comprises an adhesive fluorescent material layer. 3. The LED package of claim 1, further comprising an adhesive material layer disposed between the fluorescent material layer and the glass. 4. The LED package of claim 3, further comprising a support layer disposed between the adhesive material layer and the insulating pattern layer to abut the light-emitting structure, wherein a first width of the substrate is greater than a second width of the bottom surface of the light-emitting structure. 5. The LED package of claim 4, wherein the support layer comprises an adhesive material. 6. The LED package of claim 4, wherein the second width is greater than a third width of an upper surface of the light-emitting structure. 7. The LED package of claim 1, further comprising a growth substrate of the light-emitting structure, which is interposed between the light-emitting structure and the fluorescent material layer. 8. The LED package of claim 1, wherein a fourth width of an upper surface of the glass is smaller than the first width of the substrate. 9. The LED package of claim 1, wherein the glass is tapered from a bottom surface of the glass to an upper surface of the glass. 10. A dimming system, comprising: a light-emitting module including the LED package of claim 1; anda power supply unit including an interface configured to receive power and including a power control unit configured to control power supplied to the light emitting module. 11. A light-processing system, comprising: a light-source system including the LED package of claim 1;a light guide;a camera system connected with the light source system via the light guide and configured to output an image signal; anda data process and analysis system configured to process, analyse and store the image signal outputted from the camera system. 12. A light-emitting diode (LED) package, comprising: a light-emitting structure;a first electrode pad and a second electrode pad, connected with the light-emitting structure;an insulating pattern layer in contact with a bottom surface of the light-emitting structure and abutting the first electrode pad and the second electrode pad;a substrate including via-holes that are in contact with a bottom surface of the insulating pattern layer and expose a portion of the first electrode pad and a portion of the second electrode pad;a first penetrating electrode and a second penetrating electrode that are disposed in the via-holes and are respectively connected with the first electrode pad and the second electrode pad;a fluorescent material layer disposed on the light-emitting structure and having a second width smaller than a first width of the substrate;a first support layer abutting the fluorescent material layer disposed on the light-emitting structure; anda glass disposed on and spaced apart from the light-emitting structure with the fluorescent material layer between the glass and the light-emitting structure. 13. The LED package of claim 12, wherein the first support layer comprises an adhesive material. 14. The LED package of claim 12, wherein the first support layer comprises a fluorescent material. 15. The LED package of claim 12, wherein the first support layer comprises an adhesive fluorescent material. 16. The LED package of claim 12, further comprising a second support layer abutting the light-emitting structure between an upper layer including the first support layer and the fluorescent material layer and a lower layer including the insulating pattern layer, wherein a third width of the bottom surface of the light-emitting structure is smaller than the first width of the substrate. 17. The LED package of claim 16, wherein the first support layer and the second support layer include an identical material. 18. A dimming system, comprising: a light-emitting module including the LED package of claim 12; anda power supply unit including an interface configured to receive power and including a power control unit configured to control power supplied to the light emitting module. 19. A light-processing system, comprising: a light-source system including the LED package of claim 12;a light guide;a camera system connected with the light source system via the light guide and configured to output an image signal; anda data process and analysis system configured to process, analyse and store the image signal outputted from the camera system. 20. A light-emitting diode (LED) package, comprising: a light-emitting structure including a first semiconductor layer, an active layer and a second semiconductor layer;a first electrode pad and a second electrode pad, respectively connected with the first semiconductor layer and the second semiconductor layer of the light-emitting structure;an insulating pattern layer in contact with a bottom surface of the light-emitting structure and disposed between the first electrode pad and the second electrode pad;a substrate including via-holes that penetrate the substrate and expose a portion of the first electrode pad and a portion of the second electrode pad;a first penetrating electrode and a second penetrating electrode that are disposed in the via-holes and are respectively connected with the first electrode pad and the second electrode pad,wherein a first width of the bottom surface of the light-emitting structure is greater than a second width of an upper surface of the light-emitting surface and smaller than a third width of the substrate.
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