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According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing. In an exemplary embodiment, a thermally-conductive structure which comprises graphit

According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing. In an exemplary embodiment, a thermally-conductive structure which comprises graphite may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path around the battery area through or along the thermally-conductive structure which comprises graphite.

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1. An assembly suitable for use in dissipating heat from a heat source of a circuit board within an electronic device that includes an exterior casing and a battery area between the circuit board and the exterior casing, the assembly comprising a thermally-conductive structure which comprises graphi

1. An assembly suitable for use in dissipating heat from a heat source of a circuit board within an electronic device that includes an exterior casing and a battery area between the circuit board and the exterior casing, the assembly comprising a thermally-conductive structure which comprises graphite and is disposed about or defining the battery area such that a thermally-conductive heat path is provided from the heat source around the battery area to the exterior casing, the thermally-conductive heat path including a portion around a battery positioned within the battery area provided by the thermally-conductive structure, such that heat is transferrable through the thermally-conductive structure and along the thermally-conductive heat path from the heat source around the battery area to the exterior casing, wherein the thermally-conductive structure comprises a lower portion in direct contact with the heat source, an upper portion in direct contact with the exterior casing, and side portions that extend upwards from the lower portion to the upper portion, whereby heat is transferrable from the heat source to the lower portion, upwards through the side portions, to the upper portion, and to the exterior casing. 2. The assembly of claim 1, wherein the graphite of the thermally-conductive structure comprises a flexible graphite sheet. 3. The assembly of claim 1, wherein the thermally-conductive structure comprises a thermal interface material including compressed particles of exfoliated graphite formed from intercalating and exfoliating graphite flakes. 4. The assembly of claim 1, wherein the graphite of the thermally-conductive structure comprises intercalated and exfoliated graphite flakes formed into a flexible graphite sheet. 5. The assembly of claim 1, wherein the thermally-conductive structure comprises a graphite thermal interface material. 6. The assembly of claim 1, wherein the thermally-conductive structure comprises an exfoliated graphite thermal interface material. 7. The assembly of claim 1, wherein the lower portion of the thermally-conductive structure comprises a phase change material. 8. The assembly of claim 1, wherein the thermally-conductive structure is configured with sufficient conformability to allow the thermally-conductive structure to closely conform to a mating surface when placed in contact with the mating surface. 9. The assembly of claim 1, wherein the thermally-conductive structure comprises a thermal interface material having a thermal conductivity better than air alone. 10. The assembly of claim 1, wherein the thermally-conductive structure is wrapped about the battery for the electronic device. 11. The assembly of claim 1, further comprising an electromagnetic interface (EMI) shield configured to be disposed over the heat source to provide EMI shielding to the heat source. 12. An electronic device comprising: a circuit board including a heat source;an exterior casing;a battery area between the circuit board and the exterior casing;a thermal interface material comprising graphite and disposed about or defining the battery area such that a thermally-conductive heat path is provided from the heat source around the battery area to the exterior casing,the thermally-conductive heat path including a portion around the battery area provided by the thermal interface material, such that heat is transferrable through the thermal interface material and along the thermally-conductive heat path from the heat source around the battery area to the exterior casing,wherein the thermal interface material comprises a lower portion in direct contact with the heat source, an upper portion in direct contact with the exterior casing, and side portions that extend upwards from the lower portion to the upper portion, whereby heat is transferrable from the heat source to the lower portion, upwards through the side portions, to the upper portion, and to the exterior casing. 13. The electronic device of claim 12, wherein the graphite of the thermal interface material comprises a flexible graphite sheet. 14. The electronic device of claim 12, wherein the graphite of the thermal interface material comprises compressed particles of exfoliated graphite formed from intercalating and exfoliating graphite flakes. 15. The electronic device of claim 12, wherein the graphite of the thermal interface material comprises intercalated and exfoliated graphite flakes formed into a flexible graphite sheet. 16. The electronic device of claim 12, further comprising a battery within the battery area about which is wrapped at least a portion of the thermal interface material, such that the at least one wrapped portion of the thermal interface material defines the portion of the thermally-conductive heat path around the battery area. 17. A method relating to heat dissipation with a thermally-conductive heat path within an electronic device for allowing heat transfer from a heat source on a circuit board within the electronic device to an exterior casing of the electronic device, the method comprising positioning a thermally-conductive structure which comprises graphite to establish a thermally-conductive heat path around a battery area for receiving a battery for the electronic device between the exterior casing and the circuit board of the electronic device, such that heat may be transferred through the thermally-conductive structure which comprises graphite and along the thermally-conductive heat path from the heat source,wherein the thermally-conductive structure comprises a lower portion in direct contact with the heat source, an upper portion in direct contact with the exterior casing, and side portions that extend upwards from the lower portion to the upper portion, whereby heat is transferrable from the heat source to the lower portion, upwards through the side portions, to the upper portion, and to the exterior casing. 18. The method of claim 17, wherein: the positioning includes wrapping the thermally-conductive structure which comprises graphite around the battery for the electronic device; andthe method further comprises inserting the battery into the battery area of the electronic device after the wrapping.