An implantable medical device includes a case having a conductive housing defining an opening. A dielectric material is coupled to the conductive housing to hermetically seal the opening. An antenna is within the case under the dielectric material. A header block is coupled to the case over the diel
An implantable medical device includes a case having a conductive housing defining an opening. A dielectric material is coupled to the conductive housing to hermetically seal the opening. An antenna is within the case under the dielectric material. A header block is coupled to the case over the dielectric material.
대표청구항▼
1. An implantable medical device comprising: a case including a conductive housing defining an opening;a dielectric material coupled to the conductive housing to hermetically seal the opening;an antenna within the case under the dielectric material; anda header block coupled to the case over the die
1. An implantable medical device comprising: a case including a conductive housing defining an opening;a dielectric material coupled to the conductive housing to hermetically seal the opening;an antenna within the case under the dielectric material; anda header block coupled to the case over the dielectric material, wherein the header block directly overlies and completely covers the dielectric material. 2. The implantable medical device of claim 1, wherein the header block comprises a polymer material, the dielectric material comprises a ceramic material, and the conductive housing comprises a metal or metal alloy material. 3. The implantable medical device of claim 1, wherein the header block is formed of a first material that has a first mechanical failure mechanism when implanted within a patient and the dielectric material is formed of a second material that has a second mechanical failure mechanism when implanted within the patient. 4. The implantable medical device of claim 3, wherein the second material is more brittle at body temperature than the first material. 5. The implantable medical device of claim 1, wherein the header block is configured to retain pieces of the dielectric material in event of a catastrophic failure of the dielectric material. 6. The implantable medical device of claim 1, further comprising an insulating layer between the antenna and an interior of the conductive housing. 7. The implantable medical device of claim 1, wherein the antenna is a planar antenna comprising one or more conductive elements disposed on a circuit board within the case. 8. The implantable medical device of claim 1, further comprising communication circuitry within the case and coupled to the antenna, the communication circuitry operable to at least one of: send a first signal to a device external to the case; orreceive a second signal from the device external to the case. 9. The implantable medical device of claim 8, wherein the antenna is a slot-type antenna including a conductive layer on a surface of a circuit board, the conductive layer defining a radiating slot. 10. The implantable medical device of claim 9, further comprising a second antenna, wherein the second antenna is arranged to receive a second signal that propagates through the opening and through the radiating slot of the antenna. 11. The implantable medical device of claim 10, wherein the conductive layer of the antenna is coupled to a first side of the circuit board and the second antenna is coupled to a second side of the circuit board, the second side opposite the first side. 12. The implantable medical device of claim 10, further comprising wake-up circuitry within the case and coupled to the second antenna, wherein the wake-up circuitry is operable, in response to the second signal received at the second antenna, to cause the communication circuitry to transition from a sleep state in which the communication circuitry is inactive to an awake state in which the communication circuitry is active. 13. The implantable medical device of claim 1, further comprising medical circuitry within the case, the medical circuitry including at least one of therapeutic circuitry or sensing circuitry, wherein the header block includes one or more lead interface blocks connected to the medical circuitry and wherein the one or more lead interface blocks at least partially obscure the antenna. 14. The implantable medical device of claim 1, wherein the case has a first side and a second side opposite the first side, wherein the first side has a recessed portion and a non-recessed portion, wherein a first distance between the second side and the recessed portion of the first side is smaller than a second distance between the second side and the non-recessed portion of the first side, and wherein the antenna is positioned between the second side and the recessed portion of the first side. 15. The implantable medical device of claim 14, wherein the header block extends from the recessed portion of the first side to approximately flush with the non-recessed portion of the first side. 16. A method comprising: positioning an antenna in a portion of a case of an implantable medical device, the case including: a conductive housing that defines an opening; anda dielectric material coupled to the conductive housing to hermetically seal the opening, wherein the antenna is positioned under the dielectric material;hermetically sealing the case; andcoupling a header block to the case over the dielectric material, wherein the header block directly overlies and completely covers the dielectric material. 17. The method of claim 16, further comprising coupling the antenna to communication circuitry within the case before hermetically sealing the case. 18. The method of claim 16, wherein the header block includes one or more lead interface blocks and the method further comprises: coupling the one or more lead interface blocks to corresponding one or more hermetically sealed feedthroughs that extend through the case; andcoupling the one or more hermetically sealed feedthroughs to at least one of stimulation circuitry or sensing circuitry within the case. 19. The implantable medical device of claim 1, wherein the header block is configured to protect the dielectric material against catastrophic failure by absorbing impact energy. 20. A method comprising: receiving a signal at a first antenna that is hermetically sealed within an implantable medical device, wherein the implantable medical device comprises: a case including a conductive housing defining an opening and a dielectric material coupled to the conductive housing to hermetically seal the opening; anda header block over the dielectric material, wherein the header block directly overlies and completely covers the dielectric material, wherein the first antenna is positioned within the case under the dielectric material and under the header block; andperforming an action at the implantable medical device in response to the signal. 21. The method of claim 20, further comprising, before receiving the signal: receiving a wake-up signal at a second antenna that is hermetically sealed within the implantable medical device, wherein the first antenna is a slot-type antenna including a conductive layer defining a radiating slot, and wherein the wake-up signal propagates through the opening and through the radiating slot of the first antenna to be received at the second antenna; andin response to the wake-up signal, switching communication circuitry of the implantable medical device from a sleep state in which the communication circuitry is inactive to an awake state in which the communication circuitry is operable to receive the signal. 22. An implantable medical device comprising: a case including a conductive housing defining an opening;a dielectric material coupled to the conductive housing to hermetically seal the opening, wherein the dielectric material is located within an interior of the implantable medical device;an antenna within the case and located on a first side of the opening; anda header block coupled to the case and located on a second side of the opening that is opposite the first side, wherein the header block completely covers the dielectric material.
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