이 특허에 인용된 특허 (110)

1. Dershem Stephen M. (San Diego CA) Osuna ; Jr. Jose A. (San Diego CA), Adhesive bonding composition with bond line limiting spacer system.

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2. Dershem, Stephen M., Adhesive composition of phenol-functional polyamides.

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3. Mizori, Farhad G., Adhesive compositions containing cyclic siloxanes and methods for use thereof.

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4. Sakumoto Yukinori,JPX ; Yokoyama Shigeyuki,JPX ; Shibuya Akihiro,JPX ; Koshimura Atsushi,JPX, Adhesive tapes.

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5. Dershem, Stephen M, Amide-extended crosslinking compounds and methods for use thereof.

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6. Dershem, Stephen M, Anti-bleed compounds, compositions and methods for use thereof.

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7. Forray,Deborah Derfelt; Liu,Puwei; Santos,Benedicto delos, B-stageable die attach adhesives.

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8. Dershem, Stephen M.; Liu, Puwei; Mizori, Farhad G., Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof.

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9. Dershem, Stephen M.; Liu, Puwei; Mizori, Farhad G., Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof.

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10. Dao Buu,AUX ; Morton Trevor,AUX, Bisallyloxyimides.

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11. Petit Christian J. (Chicopee MA), Bisimide compositions.

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12. Morton Trevor C. (Hampton AUX) Hodgkin Jonathan H. (Burwood AUX) Eibl Robert (Little River AUX), Bismaleimide compounds.

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13. Dershem Stephen M. ; Patterson Dennis B. ; Osuna ; Jr. Jose A., Bismaleimide-divinyl adhesive compositions and uses therefor.

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14. Dershem Stephen M. (San Diego CA) Derfelt Deborah L. (San Diego CA), Bleed resistant cyanate ester-containing compositions.

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15. Dershem Stephen M. ; Derfelt Deborah L., Bleed resistant cyanate ester-containing compositions.

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16. Dershem Stephen M. ; Derfelt Deborah L., Bleed resistant cyanate ester-containing compositions.

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17. Okazaki, Eiichi; Kaai, Michihiro, Composition.

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18. Corley Larry S. (Houston TX), Composition comprising bisimide and triene.

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19. Mori ; Kogoro ; Izawa ; Taro ; Mizuno ; Yoshifumi ; Matsui ; Sadayoshi, Composition for inhibiting adhesion of shellfish and algae.

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20. Musa,Osama M., Compositions containing oxetane compounds for use in semiconductor packaging.

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21. Tong Quinn K. ; Ma Bodan ; Xiao Chaodong, Compositions for use in the fabrication of circuit components and printed wire boards.

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22. Musa Osama M., Compounds with electron donor and electron acceptor functionality.

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23. Musa, Osama M.; Herr, Donald E.; Nikolic, Nikola A., Curable electron donor compounds.

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24. Dershem, Stephen M, Curatives for epoxy compositions.

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25. Dershem, Stephen M, Curing agents for epoxy resins.

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26. Dershem, Stephen M., Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof.

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27. Dershem, Stephen M, Di-cinnamyl compounds and methods for use thereof.

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28. Herr Donald ; Schultz Rose Ann ; Xu Pingyong ; McLaughlin Scott R., Die attach adhesives for use in microelectronic devices.

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29. Musa, Osama M.; Herr, Donald E., Die attach adhesives with vinyl ether and carbamate or urea functionality.

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30. Dershem Stephen M. (San Diego CA) Derfelt Deborah L. (San Diego CA) Patterson Dennis B. (La Jolla CA), Die-attach composition comprising polycyanate ester monomer.

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31. Donald E. Herr, Dye attach adhesives for use in microelectronic devices.

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32. Reitz, John Bradford; Gorczyca, Thomas Bert; Cella, James Anthony, Embossing process.

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33. Dershem Stephen M., Epoxy-containing die-attach compositions.

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34. Sheppard Clyde H. (Bellevue WA) Lubowitz Hyman R. (Rolling Hills Estates CA), Extended end cap monomer for making advanced composites.

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35. Boyd Jack D. (Westminster CA) Repecka Linas N. (Lakewood CA), Extremely tough thermosetting bismaleimide resin systems.

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36. Liu, Puwei; Dershem, Stephen M.; Yang, Kang; Albino, Carolyn C., Film adhesives containing maleimide compounds and methods for use thereof.

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37. Beggs James M. (Washington DC) Mikroyannidis John A. (Patras CA GBX) Kourtides Demetrius A. (Gilroy CA), Fire and heat resistant laminating resin based on maleimido and citraconimido substituted 1-[diorganooxyphosphonyl)-meth.

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38. Mikroyannidis John A. (Patras CA GBX) Kourtides Demetrius A. (Gilroy CA), Fire and heat resistant laminating resins based on maleimido and citraconimido substituted 1-(diorganooxyphosphonyl)-met.

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39. Liu,Puwei; Dershem,Stephen M.; Neff,Benjamin; Villegas,Maria, Free radically polymerizable coupling agents.

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40. Dershem, Stephen M.; Mizori, Farhad G., Free-radical curable polyesters and methods for use thereof.

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41. Dershem, Stephen M.; Mizori, Farhad G., Free-radical curable polyesters and methods for use thereof.

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42. Dershem,Stephen M.; Mizori,Farhad G., Free-radical curable polyesters and methods for use thereof.

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43. Dershem Stephen M. (San Diego CA), Freeze resistant die-attach compositions.

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44. Dershem, Stephen M., Functionalized styrene oligomers and polymers.

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45. Eisenbarth Philipp (Bad Duerkheim DEX) Linden Gerd (Heidelberg DEX) Altstaedt Volker (Gernsheim DEX) Peter Roland (Mutterstadt DEX), Heat-curable bismaleimide-alkenyl heterocyclic molding material.

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46. Dershem, Stephen M.; Mizori, Farhad G, Hetero-functional compounds and methods for use thereof.

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47. Dershem, Stephen M.; Forrestal, Kevin J.; Liu, Puwei, Heterobifunctional monomers and uses therefor.

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48. Stephen M. Dershem ; Kevin J. Forrestal, Heterobifunctional monomers and uses therefor.

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49. Dershem, Stephen M, Hydrolytically resistant thermoset monomers.

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50. Dershem Stephen M. ; Osuna ; Jr. Jose A., Hydrophobic vinyl monomers, formulations containing same, and uses therefor.

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51. Stephen M. Dershem ; Frank G. Mizori, Hydrophobic, high Tg cycloaliphatic epoxy resins.

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52. Mizori,Farhad G.; Dershem,Stephen M., Imide-extended liquid bismaleimide resin.

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53. Mizori, Farhad G., Imide-linked maleimide and polymaleimide compounds.

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54. Mizori, Farhad G; Dershem, Stephen M, Imide-linked maleimide and polymaleimide compounds.

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55. Mizori,Farhad G.; Dershem,Stephen M., Imide-linked maleimide and polymaleimide compounds.

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56. Dershem, Stephen M, Low shrinkage polyester thermosetting resins.

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57. Dershem, Stephen M.; Yang, Kang; Liu, Puwei, Low shrinkage thermosetting resin compositions and methods of use therefor.

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58. Dershem, Stephen M.; Yang, Kang, Low shrinkage thermosetting resin compositions and methods of use thereof.

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59. Dershem, Stephen M., Low temperature curing acrylate and maleimide based formulations and methods for use thereof.

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60. Dershem Stephen M. ; Osuna Jose A., Low viscosity acrylate monomers formulations containing same and uses therefor.

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61. Dershem, Stephen, Maleimide compositions and methods for use thereof.

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62. Dershem,Stephen M; Patterson,Dennis B; Osuna, Jr.,Jose A., Maleimide compounds in liquid form.

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63. Husson ; Jr. Frank D. ; Neff Benjamin ; Dershem Stephen M., Maleimide containing formulations and uses therefor.

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64. Takamizawa ; Minoru ; Yamamoto ; Yasushi ; Inoue ; Yoshio ; Noshiro ; At sumi ; Fujii ; Hitoshi, Maleimido group-containing organosilicon compounds.

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65. Dershem, Stephen M; Mizori, Farhad G; Huneke, James T, Materials and methods for stress reduction in semiconductor wafer passivation layers.

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66. Dershem Stephen M., Method for isomerization of arylpropargyl ether monomers and uses therefor.

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67. Mizori Farhad G. ; Dershem Stephen M., Method for the preparation of maleimides.

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68. Corley Larry Steven, Modified bisimide compositions.

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69. Dershem, Stephen, Modified calcium carbonate-filled adhesive compositions and methods for use thereof.

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70. Dershem, Stephen M.; Forray, Debbie, Mold compositions with high adhesion to metal substrates.

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71. Dershem, Stephen M., Monomers derived from pentacyclopentadecane dimethanol.

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72. Singh Balwant (Stamford CT) Tynik Robert J. (Stamford CT), N-(substituted) maleimides and compositions incorporating the same.

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73. Dershem Stephen M. (Santee CA) Weaver Richard R. (Poway CA), Non-ionic, water washable soldering paste.

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74. Dershem, Stephen M., Olefin oligomers containing pendant maleimide groups.

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75. Ma Bodan ; Tong Quinn K., Package encapsulant compositions for use in electronic devices.

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76. Dershem Stephen M. ; Forray Deborah D., Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor.

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77. Benicewicz Brian C. (Los Alamos NM) Hoyt Andrea E. (Los Alamos NM), Polyamide thermosets.

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78. You Kyung-hee,KRX ; Han Kwan-soo,KRX ; Rhee Tae-hyung,KRX, Polyimide for optical communications, method of preparing the same, and method of forming multiple polyimide film using the polyimide.

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79. Goto Hirofumi,JPX ; Yamada Takako,JPX ; Ito Nobuyuki,JPX, Polyimide-based composite, electronic parts using the composite, and polyimide-based aqueous dispersion.

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80. Charles E. Hoyle ; Shan Christopher Clark ; E. Sonny Jonsson SE, Polymerization processes using aliphatic maleimides.

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81. Hoyle, Charles E.; Clark, Shan Christopher; J?nsson, E. Sonny, Polymerization processes using aliphatic maleimides.

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82. Mueller Werner H. (E. Greenwich RI) Khanna Dinesh N. (W. Warwick RI) Vora Rohitkumar H. (W. Warwick RI) Erckel Ruediger J. (Warren NJ), Polymers prepared from 4,4′-bis(2-(amino(halo) phenoxyphenyl) hexafluoroisopropyl) diphenyl ether.

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83. Mueller Werner H. (E. Greenwich RI) Khanna Dinesh N. (W. Warwick RI) Vora Rohitkumar H. (W. Warwick RI) Erckel Ruediger J. (Warren NJ), Polymers prepared from 4,4′-bis[2-(3,4-(dicarboxyphenyl)hexafluoroisopropyl]diphenyl ether dianhydride.

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84. Locatelli Jean-Louis (Vienne FRX) Macabrey Louis (Mitry-le Neuf FRX), Polypropylene/glass fiber/imide/thermoplastic elastomer based compositions.

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85. Dershem, Stephen M.; Forrestal, Kevin J., Radical polymerizable compositions containing polycyclic olefins.

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86. Dershem Stephen M. (San Diego CA), Resinless pseudoplastic bonding compositions.

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87. Dershem Stephen M. (San Diego CA), Resinless pseudoplastic bonding compositions.

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88. Meador, Mary Ann B.; Kinder, James D., Rod-coil block polyimide copolymers.

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89. Marien Bruce A. (Woodbridge CT) Wilbourn Keith O. (Manchester CT), Selected poly(dianhydride) compounds terminated with reactive end groups.

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90. Dershem, Stephen M., Siloxane monomers and methods for use thereof.

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91. Dershem Stephen M. (Santee CA), Silver-glass die attach paste with reduced resin.

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92. Kramer Andreas (Ddingen CHX) Wolf Jean-Pierre (Courtaman CHX) Brunner Rudolf (Belfaux CHX), Soluable polyimides.

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93. Dershem, Stephen M, Soluble metal salts for use as conductivity promoters.

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94. Dershem Stephen M. (San Diego CA) Patterson Dennis B. (La Jolla CA) Derfelt Deborah L. (San Diego CA), Solvent free die-attach compositions.

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95. Dershem, Stephen M, Thermoplastic elastomer with acyloxyphenyl hard block segment.

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96. Dershem, Stephen M.; Hoang, Gina; Lu, Melin, Thermosetting adhesive compositions.

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97. Dershem, Stephen M., Thermosetting hyperbranched compositions and methods for use thereof.

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98. Dershem, Stephen M, Thermosetting polyether oligomers, compositions and methods for use thereof.

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99. Inoue Hiroshi (Oosaka JPX) Muramatsu Tadao (Oosaka JPX) Hirano Tetsuji (Oosaka JPX), Thermosetting resin composition and thermosetting dry film.

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100. Dershem Stephen M. ; Patterson Dennis B. ; Osuna ; Jr. Jose A., Thermosetting resin compositions containing maleimide and/or vinyl compounds.

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101. Dershem, Stephen M.; Liu, Puwei, Thermosetting resin compositions containing maleimide and/or vinyl compounds.

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102. Dershem, Stephen M.; Patterson, Dennis B.; Osuna, Jr., Jose A., Thermosetting resin compositions containing maleimide and/or vinyl compounds.

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103. Dershem, Stephen M.; Patterson, Dennis B.; Osuna, Jr., Jose A., Thermosetting resin compositions containing maleimide and/or vinyl compounds.

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104. Dershem, Stephen M.; Patterson, Dennis B.; Osuna, Jr., Jose A., Thermosetting resin compositions containing maleimide and/or vinyl compounds.

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105. Dershem, Stephen M.; Patterson, Dennis B.; Osuna, Jr., Jose A., Thermosetting resin compositions containing maleimide and/or vinyl compounds.

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106. Dershem,Stephen M.; Patterson,Dennis B.; Osuna, Jr.,Jose A., Thermosetting resin compositions containing maleimide and/or vinyl compounds.

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107. Frihart Charles R. (Lawrenceville NJ), Three component aminoamide acrylate resin compositions.

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108. Dershem, Stephen M.; Forray, Debbie, Underfill compositions and methods for use thereof.

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109. Ma Bodan ; Tong Quinn K., Underfill encapsulant compositions for use in electronic devices.

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110. Dershem Stephen M. (Santee CA) Weaver Richard R. (Poway CA), Water washable soldering paste.

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