초록 ▼

An apparatus and an associated method for receiving and positioning a plurality of spaced-apart power semiconductor modules using a molded positioning body. The molded positioning body has a planar first main face and a plurality of receptacles for receiving the power semiconductor modules therein.

An apparatus and an associated method for receiving and positioning a plurality of spaced-apart power semiconductor modules using a molded positioning body. The molded positioning body has a planar first main face and a plurality of receptacles for receiving the power semiconductor modules therein. Each receptacle has a stop means, by which a main face of each power semiconductor module is positioned plane-parallel with one another and in alignment with the first main face of the molded positioning body. The receptacle is embodied as tapering inwardly in the direction of the first main face, beginning at the second main face.

대표청구항 ▼

1. A method for simultaneous surface treatment of a plurality of power semiconductor modules, comprising the steps of: disposing the power semiconductor modules within an apparatus for receiving and positioning a plurality of power semiconductor modules, spaced apart from one another, the apparatus

1. A method for simultaneous surface treatment of a plurality of power semiconductor modules, comprising the steps of: disposing the power semiconductor modules within an apparatus for receiving and positioning a plurality of power semiconductor modules, spaced apart from one another, the apparatus including: a molded positioning body having a planar first main top face, an opposed second main face having electrical terminal elements of the power semiconductor modules thereon, and a plurality of receptacles therein for receiving the power semiconductor modules;wherein each receptacle has a stop means, by means of which one main top face of each power semiconductor module may be positioned plane-parallel to, and in alignment with, the first main top face of the molded positioning body; andwherein the receptacle has sides which taper inward from the second main face towards the first main top face;fixing the power semiconductor modules within the apparatus; andcoating at least a portion of surface of the power semiconductor modules which is exposed through the receptacles. 2. The method as defined by claim 1, wherein the coating is effected by means of template printing. 3. The method as defined by claim 1, wherein the coating is effected by means of screenprinting. 4. The method as defined by claim 1, wherein the material is an adhesive. 5. The method as defined by claim 1, wherein the material is a heat-conducting paste. 6. An apparatus for receiving and positioning a plurality of power semiconductor modules, spaced apart from one another, the apparatus comprising: a rigid positioning body having a planar first main top face, an opposed second main face having electrical terminal elements of the power semiconductor modules thereon, and a plurality of receptacles therein for receiving the power semiconductor modules; anda plurality of power semiconductor modules, each power semiconductor module having one main top face positioned plane-parallel to, and in alignment with, the first main top face of the rigid positioning body and stop edges,wherein said second main face includes a respective plurality of openings therein, each of said openings being sized to be larger than said power semiconductor modules, to permit the unobstructed placement of respective ones of said power semiconductor modules in corresponding ones of said receptacles;wherein each receptacle has a stop having at least two detent lugs, which do not protrude past the first main top face of the rigid positioning body, which are disposed in the interior of the receptacles adjacent said first main top face, which are configured to contact the stop edges of the power semiconductor modules when the power semiconductor modules are disposed therein and which limit the displacement of the power semiconductor module to be disposed within the apparatus in the direction of the surface normal to said first main top face of said rigid positioning body;wherein each receptacle has sides which taper inward from the second main face towards the first main top face; andwherein said receptacles are arranged in a non-linear matrix. 7. The apparatus as defined by claim 6, wherein the rigid positioning body is configured to be disposed over a partial body of a package of power semiconductor modules. 8. The apparatus as defined by claim 6, wherein the power semiconductor modules each include an associated substrate that forms the aligned main top face of the power semiconductor module; andwherein the stop edges of the power semiconductor modules are formed by a housing of the respective power semiconductor module, which housing protrudes, in the direction of at least two edges or in the direction of the corners of the receptacle, past the associated substrate. 9. The apparatus as defined by claim 6, wherein the height tolerance between the planar first main top face of the rigid positioning body and the respective associated main top faces of the power semiconductor modules is less than about 0.5 mm. 10. The apparatus as defined by claim 6, wherein the rigid positioning body has at least two positioning devices for aligning a screenprinting device therewith. 11. The apparatus as defined by claim 6, in which each stop is positioned at or near the planar first main top face of the rigid positioning body.