$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Cooling systems for electrical equipment

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • G06F-001/20
  • H01L-023/473
  • F28D-015/00
  • H01L-023/34
  • F25D-017/00
  • F25B-049/00
출원번호 US-0596798 (2012-08-28)
등록번호 US-9282684 (2016-03-08)
발명자 / 주소
  • Keisling, Earl
  • Costakis, John
  • McDonneli, Gerald
출원인 / 주소
  • INERTECH IP LLC
대리인 / 주소
    Carter, DeLuca, Farrell & Schmidt, LLP
인용정보 피인용 횟수 : 5  인용 특허 : 55

초록

A space-saving, high-density modular data center and an energy-efficient cooling system for a modular data center are disclosed. The modular data center includes a first cooling circuit including a primary cooling device and a plurality of modular data pods. Each modular data pod includes a pluralit

대표청구항

1. A cooling system for electrical equipment, comprising: a first cooling circuit including a primary cooling device;a heat exchange member in thermal communication with the electrical equipment and coupled to the first cooling circuit; anda second cooling circuit coupled to the heat exchange member

이 특허에 인용된 특허 (55)

  1. Okazaki Takashi,JPX ; Sumida Yoshihiro,JPX ; Matsushita Akihiro,JPX ; Akiyama Itsutarou,JPX ; Shida Yasunori,JPX ; Fukushima Akio,JPX, Air conditioner.
  2. Park, Hee Tae, Air conditioning system for communication equipment and controlling method thereof.
  3. Park, Hee Tae, Air conditioning system for communication equipment and controlling method thereof.
  4. Forsman Bertil S.,SEX, Air-cooling system.
  5. Aldag,Philip R.; Reinbolt,Brad L., Cable and air management adapter system for enclosures housing electronic equipment.
  6. Roberto, Trecate, Chilling unit with "free-cooling", designed to operate also with variable flow rate; system and process.
  7. Carter, Preston Henry, Closed loop scroll expander engine.
  8. Noteboom, Scott; Robison, Albert Dell; Suarez, Jesus; Holt, Norman, Cold row encapsulation for server farm cooling system.
  9. Noteboom,Scott; Robison,Albert Dell; Suarez,Jesus; Holt,Norman, Cold row encapsulation for server farm cooling system.
  10. Buck, Gilbert W., Control system for an aircraft galley cooler.
  11. Hillis, W. Daniel; Ferren, Bran, Cooling air flow loop for a data center in a shipping container.
  12. Yamamoto Masayuki,JPX ; Katoh Takahiro,JPX ; Amako Kiyoo,JPX, Cooling apparatus.
  13. Asakawa Kyoichi (Yamana JPX), Cooling apparatus for electronic system.
  14. Harder, Daniel; Leonard, Charles F., Cooling enclosure for maintaining commercial-off-the-shelf (COTS) equipment in vehicles.
  15. Fukuda, Hiroshi; Fujita, Kenji, Cooling structure for disk storage device.
  16. Chu,Richard C.; Ellsworth, Jr.,Michael J.; Schmidt,Roger R.; Simons,Robert E.; Tsukamoto,Takeshi, Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems.
  17. Chu,Richard C.; Ellsworth, Jr.,Michael J.; Schmidt,Roger R.; Simons,Robert E.; Zoodsma,Randy J., Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems.
  18. Wehner Jeffrey M. (San Diego CA) Bettenga James L. (San Diego CA) Biagini Guido (Poway CA) Godecker William J. (San Diego CA) Wigmore David B. (San Diego CA), Cooling system for an aircraft pod.
  19. Kashirajima, Yasuhiro; Kikuchi, Hiroshige; Sugiura, Takumi; Watanabe, Koji; Nakashima, Kenichi, Cooling system for electronic equipment.
  20. Sato, Yoichi; Tosaka, Kenji; Hayashi, Mitsuo; Yasuo, Akihiro; Kimura, Hideki; Ueda, Kengo; Nakata, Katsuhiko; Iwakiri, Yoshihisa; Nori, Hitoshi; Haneda, Tomoaki; Tokumitsu, Mika; Shinjo, Naoki; Kuroda, Kouji; Kusano, Yoshihiro, Cooling system for information device.
  21. Tanaka, Masaaki; Numazawa, Shigeo; Ishii, Katsuya; Sato, Hideaki; Honda, Shin; Okamoto, Yoshiyuki; Kanamori, Junichiro; Terao, Tadayoshi, Cooling system of heat emitters.
  22. Carlson, Andrew B., Data center cooling.
  23. Matsushima, Hitoshi; Fukuda, Hiroshi, Disk array device and electronic device.
  24. Kondo,Yoshihiro; Ohashi,Shigeo; Minamitani,Rintaro; Naganawa,Takashi; Yoshitomi,Yuji; Nakanishi,Masato; Sasaki,Yasuhiko; Nakagawa,Tsuyoshi; Suzuki,Osamu; Matsushita,Shinji; Yamada,Yasunori, Electronic equipment.
  25. Donowho, D. Brian; Lewis, II, Richard Evans, Electronic equipment enclosure with exhaust air duct and adjustable filler panel assemblies.
  26. Chu, Richard C.; Iyengar, Madhusudan K.; Kamath, Vinod; Schmidt, Roger R., Energy efficient apparatus and method for cooling an electronics rack.
  27. Schmidt, Roger R; Takayoshi, Jyunji; Tsukamoto, Takeshi; Funatsu, Masayoshi; Onai, Minoru; Imai, Masaaki; Inoue, Yoshinori, Facilitating cooling of an electronics rack employing water vapor compression system.
  28. Grabon,Michal K.; Ballet,Joseph, Free cooling activation optimized controls.
  29. Bittner, John D.; Rose, Vincent Ronald; Bredberg, Bengt Ake Arthur, Free cooling cascade arrangement for refrigeration system.
  30. Rigal, Philippe; Delpech, Pierre; Pham, Batung, Free-cooling capacity control for air conditioning systems.
  31. Bean, Jr.,John H., IT equipment cooling.
  32. Goodfellow, John A., Independent free cooling system.
  33. Spearing, Ian; Schrader, Tim, Integral swivel hydraulic connectors, door hinges, and methods and systems for their use.
  34. Hom, James; Choi, Hae-won; Lin, Tien Chih (Eric); Werner, Douglas E.; Chow, Norman; Correa, Adrian; Leong, Brandon; Gopalakrishnan, Sudhakar; Brewer, Richard Grant; McMaster, Mark; Upadhya, Girish, Internal access mechanism for a server rack.
  35. Takahashi Kenji (Abiko JPX) Torii Takuji (Ushiku JPX) Senshu Takao (Shizuoka JPX) Yamashita Tetsuji (Shizuoka JPX) Zushi Shizuo (Hadano JPX), LSI temperature control system.
  36. Ota,Shigemi; Matsushita,Shinji, Liquid cooling system for a rack-mount server system.
  37. Wei, Jie, Liquid cooling unit with auxillary heat exchanger and auxillary pump.
  38. Patel,Chandrakant D, Longitudinally cooled electronic assembly.
  39. Morales, Osvaldo Patricio, Method and apparatus for cooling electronic components.
  40. Seki, Masanobu; Sasaki, Jun, Method and device for controlling the temperature of an object using heat transfer fluid.
  41. Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Method and system for cooling electronics racks using pre-cooled air.
  42. Datta, Madhav; McMaster, Mark; Brewer, Rick; Zhou, Peng; Tsao, Paul; Upadhaya, Girish; Munch, Mark, Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system.
  43. Whitted,William H.; Aigner,Gerald, Modular data center.
  44. Novotny, Shlomo D.; Menoche, John P.; Roden, David W., Modular scalable coolant distribution unit.
  45. Gauthier, David Thomas; Seaton, Scott Thomas; Wenzel, Allan Joseph; Cheng, Cheerei; Andersen, Brian Clark; Costello, Daniel Gerard; Belady, Christian L.; Housley, Jens Conrad; Mattson, Brian Jon; Gilges, Stephan W.; Lundgren, Kenneth Allen, Modularization of data center functions.
  46. Schwedler Michael C. A. (La Crosse WI) Hage Jon R. (La Crosse WI) Dorman Dennis R. (La Crosse WI) Stiyer Michael J. (New Hope MN), Near optimization of cooling tower condenser water.
  47. Carlson, Andrew B.; Hamburgen, William; Clidaras, Jimmy; Weber, Wolf-Dietrich; Fan, Xiaobo, Orthogonally system arrangements for data center facility.
  48. Belady, Christian L.; Hamilton, James R.; James, Sean M., Power efficient data center.
  49. Claassen, Alan; Eckberg, Eric Alan; Hansen, Dennis John; Kamath, Vinod; Iyengar, Madhusudan K.; Mahaney, Jr., Howard Victor; Miller, Michael Sven; Mroz, Stephen Peter, Rack with integrated rear-door heat exchanger.
  50. Belady,Christian L.; Gostin,Gary, Scalable computing apparatus.
  51. Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use.
  52. Bodell, II, Mark Robinson; Miller, Wanda Jean, Stability control system and method for compressors operating in parallel.
  53. Bean, John H; Lomas, Jonathan M, Sub-cooling unit for cooling system and method.
  54. Whitted, William H., Systems and methods for close coupled cooling.
  55. Haas,Thomas; Cruz,Nicholas; Barberi,Steve; Barberi,Lou J., Tempering device for printing presses.

이 특허를 인용한 특허 (5)

  1. Lecourtier, Georges, Cooling system, cooled computer system and computer facility.
  2. Roy, Rob, Electronic equipment data center and server co-location facility configurations and method of using the same.
  3. Roy, Rob, Electronic equipment data center or co-location facility designs and methods of making and using the same.
  4. Roy, Rob, Facility including externally disposed data center air handling units.
  5. Roy, Rob, Integrated wiring system for a data center.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트