Printed circuit board, display device and method of manufacturing printed circuit board
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-001/02
H05K-003/46
출원번호
US-0054308
(2013-10-15)
등록번호
US-9288900
(2016-03-15)
우선권정보
KR-10-2013-0046297 (2013-04-25)
발명자
/ 주소
Kim, You Bean
Kang, Seock-Hwan
Lee, Jong Seo
출원인 / 주소
Samsung Display Co., Ltd.
대리인 / 주소
Knobbe Martens Olson & Bear LLP
인용정보
피인용 횟수 :
0인용 특허 :
9
초록▼
A printed circuit board includes an insulation layer adjacent to a high-speed signal wire layer. A low-loss material layer is provided between the high-speed signal wire layer and the insulation layer. As a result, it is possible to reduce frequency loss of a high-speed signal wire layer and improve
A printed circuit board includes an insulation layer adjacent to a high-speed signal wire layer. A low-loss material layer is provided between the high-speed signal wire layer and the insulation layer. As a result, it is possible to reduce frequency loss of a high-speed signal wire layer and improve reliability of the printed circuit board.
대표청구항▼
1. A printed circuit board, comprising: a plurality of signal wire layers comprising a first high-speed signal wire layer and a first low-speed signal wire layer, wherein the first high-speed signal wire layer is connected to a source of signals of a data speed of 3.0 Gbps or higher whereas the firs
1. A printed circuit board, comprising: a plurality of signal wire layers comprising a first high-speed signal wire layer and a first low-speed signal wire layer, wherein the first high-speed signal wire layer is connected to a source of signals of a data speed of 3.0 Gbps or higher whereas the first low-speed signal wire layer is not connected to a source of signals of a data speed of 3.0 Gbps or higher;a plurality of high-loss insulation layers made of a high-loss insulation material; anda plurality of low-loss insulation layers made of a low-loss insulation,wherein a frequency-dependent loss of the high-loss insulation material greater than that of the low-loss insulation material,wherein the first high-speed signal wire layer, a first one of the plurality of low-loss insulation layers, a first one of the plurality of high-loss insulation layers and the first low-speed signal wire layer are laminated in order such that the first low-loss insulation layer contacts the first high-speed signal wire layer and that the first high-loss insulation layer contacts the first low-speed signal wire layer. 2. A display device, comprising: a display panel; andthe printed circuit board of claim 1 configured to apply a driving signal to the display panel. 3. The display device of claim 2, wherein the first low-loss insulation layer has a thickness of about 15% to about 100% of a thickness of the first high-loss insulation layer. 4. The display device of claim 2, wherein the low-loss insulation material comprises any one selected from the group consisting of hydrocarbon, ceramic, thermosetting polyester, and polytetrafluoroethylene (PTFE). 5. The printed circuit board of claim 1, wherein the first low-loss insulation layer has a thickness of about 15% to about 100% of a thickness of the first high-loss insulation layer. 6. The printed circuit board of claim 1, wherein the low-loss insulation material comprises any one selected from the group consisting of hydrocarbon, ceramic, thermosetting polyester, and polytetrafluoroethylene (PTFE). 7. The printed circuit board of claim 1, wherein the number of the a plurality of high-loss insulation layers is an odd number, wherein the printed circuit board has a laminated structure in which one of the plurality of high-loss insulation layers is disposed in the middle of the laminated structure and the other ones of the plurality of high-loss insulation layers are symmetrically arranged with respect to the insulation layer positioned in the middle. 8. The printed circuit board of claim 1, wherein the first high-speed signal wire layer is positioned at an outermost portion among the plurality of signal wire layers. 9. The printed circuit board of claim 1, wherein the first high-speed signal wire layer is positioned between two of the plurality of high-loss insulation layers. 10. The printed circuit board of claim 1, wherein the first high-speed signal wire layer is interposed between two of the plurality of low-loss insulation layers. 11. The printed circuit board of claim 10, wherein the first high-speed signal wire layer contacts the two low-loss insulation layers. 12. The printed circuit board of claim 1, wherein the first low-loss insulation layer contacts both the first high-loss insulation layer and the first high-speed signal wire layer. 13. A method of manufacturing a printed circuit board, comprising: forming signal wire layers comprising a first high-speed signal wire layer and a first low-speed signal wire layer, wherein the first high-speed signal wire layer is connected to a source of signals of a data speed of 3.0 Gbps or higher whereas the first low-speed signal wire layer is not connected to a source of signals of a data speed of 3.0 Gbps or higher;forming a plurality of high-loss insulation layers made of a high-loss insulation material and comprising a first high-loss insulation layer;forming a plurality of low-loss insulation layers made of a low-loss insulation material and comprising a first low-loss insulation layer,wherein a frequency-dependent loss of the high-loss insulation material greater than that of the low-loss insulation material,wherein the first high-speed signal wire layer, the first low-loss insulation layer, the first high-loss insulation layer and the first low-speed signal wire layer are laminated in order such that the first low-loss insulation layer contacts the first high-speed signal wire layer and that the first high-loss insulation layer contacts the first low-speed signal wire layer. 14. The method of claim 13, wherein the low-loss material layer is formed by spraying a liquid-state low-loss material. 15. The method of claim 13, wherein the low-loss material layer is formed by forming a thin film with a film-state low-loss material. 16. The method of claim 13, wherein the low-loss material layer has a thickness of about 15% to about 100% of a thickness of the insulation layer. 17. The method of claim 13, wherein the low-loss material layer comprises any one selected from the group consisting of hydrocarbon, ceramic, thermosetting polyester, and polytetrafluoroethylene (PTFE).
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