3-D stacked multiprocessor structure with vertically aligned identical layout operating processors in independent mode or in sharing mode running faster components
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G06F-015/16
H01L-025/065
G06F-015/78
출원번호
US-0602807
(2012-09-04)
등록번호
US-9298672
(2016-03-29)
발명자
/ 주소
Buyuktosunoglu, Alper
Emma, Philip G.
Hartstein, Allan M.
Healy, Michael B.
Kailas, Krishnan Kunjunny
출원인 / 주소
International Business Machines Corporation
대리인 / 주소
Davis, Jennifer R.
인용정보
피인용 횟수 :
0인용 특허 :
13
초록▼
Three-dimensional (3-D) processor structures are provided which are constructed by connecting processors in a stacked configuration. For example, a processor system includes a first processor chip comprising a first processor, and a second processor chip comprising a second processor. The first and
Three-dimensional (3-D) processor structures are provided which are constructed by connecting processors in a stacked configuration. For example, a processor system includes a first processor chip comprising a first processor, and a second processor chip comprising a second processor. The first and second processor chips are connected in a stacked configuration with the first and second processors connected through vertical connections between the first and second processor chips. The processor system further includes a mode control circuit to selectively configure the first and second processors of the first and second processor chips to operate in one of a plurality of operating modes, wherein the processors can be selectively configured to operate independently, to aggregate resources, to share resources, and/or be combined to form a single processor image.
대표청구항▼
1. A method for operating a computer processor comprising a first processor chip having a first processor, and a second processor chip having a second processor, wherein the first and second processor chips are connected in a stacked configuration with the first and second processors vertically alig
1. A method for operating a computer processor comprising a first processor chip having a first processor, and a second processor chip having a second processor, wherein the first and second processor chips are connected in a stacked configuration with the first and second processors vertically aligned and connected through vertical connections between the first and second processor chips, wherein the first and second processors have an identical layout of corresponding subsystem regions, the method comprising: generating, by a control system, different sets of configuration parameters to operate the computer processor in different operating modes;generating, by a control system, a first control signal to selectively input a first set of the configuration parameters to the first and second processors;utilizing, by the first and second processors, the first set of the configuration parameters to configure the first and second processors to operate in a first mode of operation, wherein the first and second processors are configured to operate as a single processor by combining subsystem regions of the first and second processors having faster operating speeds and by turning off subsystem regions of the first and second processors having slower operating speeds;generating, by the control system, a second control signal to selectively input a second set of the configuration parameters to the first and second processors; andutilizing, by the first and second processors, the second set of the configuration parameters to configure the first and second processors to operate in a second mode of operation wherein both the first and second processors operate independently without aggregating or sharing resources of the first and second processors. 2. The method of claim 1, further comprising: generating, by the control system, a third control signal to selectively input a third set of the configuration parameters to the first and second processors; andutilizing, by the first and second processors, the third set of the configuration parameters to configure the first and second processors to operate in a third mode of operation wherein in the third mode of operation, the first and second processors are both active, wherein a microarchitecture of the first processor of the first processor chip is configured by aggregating elements from both the first and second processors, and wherein a microarchitecture of the second processor of the second processor chip is configured by aggregating elements from both the first and second processors. 3. The method of claim 2, wherein the aggregated elements include portions of execution units of the first and second processors. 4. The method of claim 2, wherein the aggregated elements include caches. 5. The method of claim 4, wherein an aggregated cache includes caches of the first and second processors, which are vertically connected and logically operated as a shared cache between the first and second processors. 6. The method of claim 2, wherein the aggregated elements include register sets. 7. The method of claim 1, further comprising: generating, by the control system, a third control signal to selectively input a third set of the configuration parameters to the first and second processors; andutilizing, by the first and second processors, the third set of the configuration parameters to configure the first and second processors to operate in a third mode of operation wherein in the third mode of operation, the first processor chip is active and the second processor chip is inactive, and wherein a microarchitecture of the first processor of the active first processor chip is augmented by utilizing a portion of the second processor of the inactive second processor chip. 8. The method of claim 7, wherein the microarchitecture of the first processor is augmented by utilizing a portion of an execution unit of the second processor of the inactive second processor chip. 9. The method of claim 7, wherein the microarchitecture of the first processor is augmented by combining a cache of the first processor with a cache of the second processor of the inactive second processor chip. 10. The method of claim 7, wherein the first processor of the active first processor chip operates at increased power in a turbo mode while utilizing said portion of the second processor of the inactive second processor chip. 11. The method of claim 1, further comprising: generating, by the control system, a third control signal to selectively input a third set of the configuration parameters to the first and second processors; andutilizing, by the first and second processors, the third set of the configuration parameters to configure the first and second processors to operate in a third mode of operation wherein in the third mode of operation, the first and second processors are both active, and wherein the first and second processors are configured to operate as a single processor and aggregate their threads to increase an amount of threads that are usable by the first and second processors.
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이 특허에 인용된 특허 (13)
Pan, Yu-Tang; Wu, Cheng-Ting; Chou, Shih-Wen; Liu, Hui-Ping, Chip package without core and stacked chip package structure.
Zhou, Qing A; Lu, Daoqiang; Shi, Wei; He, Jiangqi, Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture.
Tanguay ; Jr. Armand R. (Fullerton CA) Jenkins B. Keith (Long Beach CA), Modulator-based photonic chip-to-chip interconnections for dense three-dimensional multichip module integration.
Bertin Claude Louis ; Hedberg Erik Leight ; Leas James Maro ; Voldman Steven Howard, Multichip semiconductor structures with consolidated circuitry and programmable ESD protection for input/output nodes.
Carson John C. (Corona del Mar CA) DeCaro Robert E. (San Juan Capistrano CA) Hsu Ying (Huntington Beach CA) Miyake Michael K. (Westminster CA), Stackable modules and multimodular assemblies.
Segelken John M. (Morristown NJ) Shively Richard R. (Convent Station NJ) Stanziola Christopher A. (Hyde Park NY) Wu Lesley J. (Denville NJ), Stacked board assembly for computing machines, including routing boards.
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