Nanowire array based solar energy harvesting device
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G01J-001/20
H01L-031/0352
H01L-031/056
출원번호
US-0982269
(2010-12-30)
등록번호
US-9299866
(2016-03-29)
발명자
/ 주소
Yu, Young-June
Wober, Munib
Duane, Peter
출원인 / 주소
ZENA TECHNOLOGIES, INC.
대리인 / 주소
Pillsbury Winthrop Shaw Pittman LLP
인용정보
피인용 횟수 :
0인용 특허 :
171
초록▼
A photovoltaic device operable to convert light to electricity, comprising a substrate, a plurality of structures essentially perpendicular to the substrate, one or more recesses between the structures, each recess having a planar mirror on a bottom wall thereof and each recess filled with a transpa
A photovoltaic device operable to convert light to electricity, comprising a substrate, a plurality of structures essentially perpendicular to the substrate, one or more recesses between the structures, each recess having a planar mirror on a bottom wall thereof and each recess filled with a transparent material. The structures have p-n or p-i-n junctions for converting light into electricity. The planar mirrors function as an electrode and can reflect light incident thereon back to the structures to be converted into electricity.
대표청구항▼
1. A photovoltaic device operable to convert light to electricity, comprising a substrate, a plurality of structures essentially perpendicular to the substrate, one or more recesses between the structures, each recess having a sidewall and a bottom wall, and a planar reflective layer disposed on the
1. A photovoltaic device operable to convert light to electricity, comprising a substrate, a plurality of structures essentially perpendicular to the substrate, one or more recesses between the structures, each recess having a sidewall and a bottom wall, and a planar reflective layer disposed on the bottom wall of each recess, wherein the structures comprise a single crystalline semiconductor material; the sidewall of each recess is free of the planar reflective layer; and each recess is filled with a transparent material, wherein the structures have an overhanging portion along an entire contour of a top surface of the structures. 2. The photovoltaic device of claim 1, wherein the single crystalline semiconductor material is selected from a group consisting of silicon, germanium, group III-V compound materials, group II-VI compound materials, and quaternary materials. 3. The photovoltaic device of claim 1, wherein the structures are cylinders or prisms with a cross-section selected from a group consisting of elliptical, circular, rectangular, and polygonal cross-sections, strips, or a mesh. 4. The photovoltaic device of claim 1, wherein the structures are pillars with diameters from 50 nm to 5000 nm, heights from 1000 nm to 20000 nm, a center-to-center distance between two closest pillars of 300 nm to 15000 nm. 5. The photovoltaic device of claim 1, wherein each recess has a rounded or beveled inner edge between the sidewall and the bottom wall thereof. 6. The photovoltaic device of claim 1, wherein the planar reflective layer is a material selected from a group consisting of ZnO, Al, Au, Ag, Pd, Cr, Cu, Ti, Ni, and a combination thereof. 7. The photovoltaic device of claim 1, wherein the planar reflective layer is an electrically conductive material. 8. The photovoltaic device of claim 1, wherein the planar reflective layer is a metal. 9. The photovoltaic device of claim 1, whereinthe planar reflective layer has a reflectance of at least 50% for visible light of any wavelength. 10. The photovoltaic device of claim 1, wherein the planar reflective layer has a thickness of at least 5 nm. 11. The photovoltaic device of claim 1, wherein the planar reflective layer is functional to reflect light incident thereon to the structures so that the light is absorbed by the structures. 12. The photovoltaic device of claim 1, wherein the planar reflective layers in all the recesses are connected. 13. The photovoltaic device of claim 1, wherein the planar reflective layer is functional as an electrode of the photovoltaic device. 14. The photovoltaic device of claim 1, wherein the substrate has a flat surface opposite the structures. 15. The photovoltaic device of claim 14, wherein the flat surface has a doped layer and optionally a metal layer metal layer disposed on and forming an Ohmic contact with the doped layer. 16. The photovoltaic device of claim 15, wherein: the transparent material has a surface coextensive with a top surface of the structures;the transparent material is substantially transparent to visible light with a transmittance of at least 50%;the transparent material is an electrically conductive material or an electrically insulating material;the transparent material is a transparent conductive oxide;the transparent material forms an Ohmic contact with the planar reflective layer; and/orthe transparent material is functional as an electrode of the photovoltaic device. 17. The photovoltaic device of claim 16, further comprising an electrode layer and optionally a coupling layer, wherein: the electrode layer is disposed on the transparent material and the structures; the electrode layer is the same material as the transparent material or different material from the transparent material; the electrode layer is substantially transparent to visible light with a transmittance of at least 50%; the electrode layer is an electrically conductive material; the electrode layer is a transparent conductive oxide; the electrode layer is functional as an electrode of the photovoltaic device; and/or the coupling layer is disposed on the electrode layer and only above a top surface of the structures. 18. The photovoltaic device of claim 17, further comprising a passivation layer, wherein: the passivation layer is disposed on the sidewall, and on the bottom wall under the planar reflective layer; a top surface of the structures is free of the passivation layer; and the passivation layer is effective to passivate the sidewall and the bottom wall; and/or each of the structures has a top portion and a bottom portion having dissimilar conduction types. 19. The photovoltaic device of claim 18, wherein the structures have one of the following doping profiles: (i) the bottom portion is intrinsic and the top portion is p type; (ii) the bottom portion is n type and the top portion is p type; (iii) the bottom portion is intrinsic and the top portion is n type; (iv) the bottom portion is p type and the top portion is n type. 20. The photovoltaic device of claim 18, further comprising a cladding layer, wherein: the top portion has a height of 1 micron to 20 micron;the passivation layer has a thickness from 1 nm to 100 nm;the passivation layer is an electrically insulating material selected from a group consisting of HfO2, SiO2, Si3N4, Al2O3, an organic molecule monolayer;the doped layer has an opposite conduction type from the top portion;the doped layer is electrically connected to the bottom portion;the doped layer, the bottom portion and the top portion form a p-n or p-i-n junction;the coupling layer is the same material as the cladding layer or different material from the cladding layer; and/or a refractive index of the structures n1, a refractive index of the transparent material n2, a refractive index of the coupling layer n3, satisfy relations of n1>n2 and n1>n3. 21. The photovoltaic device of claim 17, further comprising a junction layer wherein: the junction layer is a doped semiconductor; the junction layer is disposed on the sidewall, on the bottom wall under the planar reflective layer, and on a top surface of the structures; and the junction layer is effective to passivate the sidewall and the bottom wall. 22. The photovoltaic device of claim 21, wherein the structures are a doped semiconductor and the structures and the junction layer have opposite conduction types; or the structures are an intrinsic semiconductor. 23. The photovoltaic device of claim 21, further comprising a cladding layer, wherein: the junction layer has a thickness from 5 nm to 100 nm; the doped layer has an opposite conduction type from the junction layer;the doped layer is electrically connected to each of the structures; the doped layer, the structures and the junction layer form a p-n or p-i-n junction;the cladding layer has a thickness of about 175 nm;the coupling layer is the same material as the cladding layer or different material from the cladding layer; and/ora refractive index of the structures n.sub.1, a refractive index of the transparent material n2, a refractive index of the coupling layer n3, satisfy relations of n1>n2 and n1>n3. 24. The photovoltaic device of claim 21, wherein: each of the structures has a top portion and a bottom portion having dissimilar conduction types. 25. The photovoltaic device of claim 24, wherein the top portion and the junction layer have the same conduction type; and the structures have one of the following doping profiles: (i) the bottom portion is intrinsic and the top portion is p type; (ii) the bottom portion is n type and the top portion is p type; (iii) the bottom portion is intrinsic and the top portion is n type; (iv) the bottom portion is p type and the top portion is n type. 26. The photovoltaic device of claim 24, wherein: the junction layer has a thickness from 5 nm to 100 nm; the doped layer has an opposite conduction type from the junction layer; the doped layer is electrically connected to the bottom portion of each of the structures; the doped layer, the bottom portion, the top portion and the junction layer form a p-n or p-i-n junction; the coupling layer is the same material as the cladding layer or different material from the cladding layer; and/or a refractive index of the structures n1, a refractive index of the transparent material n2, a refractive index of the coupling layer n3, satisfy relations of n1>n2 and n1>n3. 27. The photovoltaic device of claim 17, further comprising at least one via in the transparent material and between the electrode layer and the planar reflective layer, wherein the at least one via is an electrically conductive material and the at least one via electrically connects the electrode layer and the planar reflective layer. 28. The photovoltaic device of claim 14, wherein total area of the planar reflective layer is at least 40% of a surface area of the flat surface. 29. The photovoltaic device of claim 1, wherein the substrate has a thickness of at least 50 microns. 30. The photovoltaic device of claim 1, wherein the structures are pillars arranged in an array; each structure is about 5 microns in height; a pitch of the structures is from 300 nm to 15 microns. 31. A photo detector comprising the photovoltaic device of claim 1, wherein the photo detector is functional to output an electrical signal when exposed to light. 32. The method of claim 31, wherein the electrical signal is an electrical current, an electrical voltage, an electrical conductance and/or an electrical resistance. 33. A method of detecting light comprises: exposing the photovoltaic device of claim 1 to light; measuring an electrical signal from the photovoltaic device. 34. The method of claim 33, wherein a bias voltage is applied to the structures in the photovoltaic device. 35. A method of making a photovoltaic device comprising a substrate, a plurality of structures essentially perpendicular to the substrate, one or more recesses between the structures, each recess having a sidewall and a bottom wall, a planar reflective layer disposed on the bottom wall of each recess and each recess filled with a transparent material, the method comprising: generating a pattern of openings in a resist layer using a lithography technique, wherein locations and shapes of the openings correspond to location and shapes of the structures;forming the structures and recesses by etching the substrate;depositing the planar reflective layer to the bottom wall, such that the sidewall of each recess is free of the planar reflective layer;depositing the transparent material such that each recess is completely filled by the transparent material;wherein the structures comprise a single crystalline semiconductor material, wherein the structures have an overhanging portion along an entire contour of a top surface of the structures. 36. The method of claim 35, further comprising: planarizing the transparent material; coating the substrate with the resist layer;developing the pattern in the resist layer;depositing a mask layer; andlifting off the resist layer. 37. The method of claim 35, further comprising ion implantation or depositing a dopant layer. 38. The method of claim 35, wherein the structures and recesses are formed by deep etch followed by isotropic etch. 39. The method of claim 35, further comprising applying a resist layer by a print coating method, the print coating method comprising: coating a roller of a flexible material with a resist layer; transferring the resist layer to a surface of a substrate by rolling the roller on the surface, wherein the surface is flat or textured. 40. The method of claim 39, wherein the roller is polydimethylsiloxane. 41. The method of claim 35, further comprising applying a resist layer by a print coating method, the print coating method comprising: coating a stamp of a flexible material with a resist layer; transferring the resist layer to a surface of a substrate by pressing the stamp on the surface, wherein the surface is flat or textured. 42. The method of claim 41, wherein the stamp is polydimethylsiloxane. 43. A method of converting light to electricity comprising: exposing a photovoltaic device to light, wherein the photovoltaic device comprises a substrate, a plurality of structures essentially perpendicular to the substrate, one or more recesses between the structures, each recess having a sidewall and a bottom wall, a planar reflective layer disposed on the bottom wall of each recess, the sidewall of each recess being free of the planar reflective layer, and each recess filled with a transparent material;reflecting light to the structures using the planar reflective layer;absorbing the light and converting the light to electricity using the structures;drawing an electrical current from the photovoltaic device;wherein the structures comprise a single crystalline semiconductor material, wherein the structures have an overhanging portion along an entire contour of a top surface of the structures. 44. The method of claim 43, wherein the electrical current is drawn from the planar reflective layer.
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