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Vapor-compression refrigeration apparatus with backup air-cooled heat sink and auxiliary refrigerant heater

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25D-023/12
  • H05K-007/20
  • F25B-039/02
  • F25B-049/02
출원번호 US-0134017 (2013-12-19)
등록번호 US-9301433 (2016-03-29)
발명자 / 주소
  • Campbell, Levi A.
  • Chu, Richard C.
  • Ellsworth, Jr., Michael J.
  • Iyengar, Madhusudan K.
  • Simons, Robert E.
출원인 / 주소
  • INTERNATIONAL BUSINESS MACHINES CORPORATION
대리인 / 주소
    Chiu, Esq., Steven
인용정보 피인용 횟수 : 0  인용 특허 : 50

초록

Apparatus and method are provided for cooling an electronic component. The apparatus includes a refrigerant evaporator in thermal communication with a component(s) to be cooled, and a refrigerant loop coupled in fluid communication with the evaporator for facilitating flow of refrigerant through the

대표청구항

1. An apparatus for facilitating cooling of an electronic component, the apparatus comprising: a refrigerant evaporator in thermal communication with the electronic component, the refrigerant evaporator comprising at least one channel therein for accommodating flow of refrigerant through the refrige

이 특허에 인용된 특허 (50)

  1. Tongu,Shinji; Matsukiyo,Tomiyuki; Arita,Kazuhei; Ichino,Yoshihiro; Ogai,Masato; Yamauchi,Akira; Yamazaki,Takayuki, Air conditioner.
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  8. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Cooling system and method utilizing thermal capacitor unit(s) for enhanced thermal energy transfer efficiency.
  9. Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Cooling system with auxiliary thermal buffer unit for cooling an electronics module.
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