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Multi-level redundant cooling system for continuous cooling of an electronic system(s) 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • F28F-027/02
  • G06F-001/20
출원번호 US-0745939 (2013-01-21)
등록번호 US-9313930 (2016-04-12)
발명자 / 주소
  • Goth, Gary F.
  • Krug, Jr., Francis R.
  • Mullady, Robert K.
  • Low, Kevin P.
  • Vandeventer, Allan C.
  • Zoodsma, Randy J.
출원인 / 주소
  • INTERNATIONAL BUSINESS MACHINES CORPORATION
대리인 / 주소
    McNamara, Esq., Margaret A.
인용정보 피인용 횟수 : 1  인용 특허 : 66

초록

A cooling system is provided to remove heat generated by one or more electronic systems. The cooling system includes a coolant-based cooling apparatus, redundant pumping units, redundant backup blowers, and multiple separate controllers. The cooling apparatus includes one or more heat exchange assem

대표청구항

1. A cooling system comprising: a coolant-based cooling apparatus configured to assist in removal of heat generated by one or more electronic systems of an electronic rack, the coolant-based cooling apparatus being disposed within the electronics rack and comprising at least one heat exchange assemb

이 특허에 인용된 특허 (66)

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  6. Chung, Chu Te; Dishman, C. Charles; Lin, Jen Ching; Lindfors, Eino A., Apparatus, system, and method for controlling speed of a cooling fan.
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  16. Cheon,Kioan, Cooling system for electronic devices.
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  32. Shabany, Younes, Liquid-air hybrid cooling in electronics equipment.
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  34. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Rizzolo, Michael R.; Simons, Robert E., Liquid-cooled electronics apparatus and methods of fabrication.
  35. Cader,Tahir; Ressa,Robert J., Low momentum loss fluid manifold system.
  36. Kimura Hideyuki (Tsuchiura JPX) Takahashi Tsuyoshi (Odawara JPX) Suzuki Tomio (Hiratsuka JPX) Ohdaira Toshio (Odawara JPX) Uefune Kouki (Minamiashigara JPX) Nishimura Yuji (Odawara JPX), Magnetic disk storage system.
  37. Coe Carlos J. (1847 Ware Rd. Falls Church VA 22043) Godfrey Elizabeth A. (1131 University Blvd. W. ; #720 Silver Spring MD 20902) Henniges Benjamin L. (6111 Bristol Way Alexandria VA 22310) O\Brien D, Material consolidation modeling and control system.
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  39. Ni,Jim, Memory module assembly including heat sink attached to integrated circuits by adhesive.
  40. Chu, Richard C.; Ellsworth, Jr., Michael J.; Furey, Edward; Schmidt, Roger R.; Simons, Robert E., Method and apparatus for combined air and liquid cooling of stacked electronics components.
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  42. Ali, Ihab, Method and apparatus for dissipating heat in a computer system.
  43. Jones Jeffrey K. (1861 SE. 148th Ave. Portland OR 97233) White James (2233 SE. 53 Portland OR 97215), Method and apparatus for predictive maintenance of HVACR systems.
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  54. Goth, Gary F.; Kearney, Daniel J.; Low, Kevin P.; Meyer, Udo H. G.; Swaney, Scott B., System and method for cooling multiple logic modules.
  55. Shah,Rasiklal Punjalal; Rajiv,Vrinda; Osborn,Mark David; Asati,Mahesh Kumar; Bonissone,Piero Patrone, System and method for predicting component failures in large systems.
  56. Frankel, Scott; Hardt, Eric, System and method of controlling cooling fan speeds.
  57. Frankel, Scott; Martin, Peter; Hardt, Eric, System and method of designing cooling fans.
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  63. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Thermoelectric-enhanced heat exchanger.
  64. Clayton, James E.; Fathi, Zakaryae, Thin multi-chip flex module.
  65. Peng,Xue Wen; Chen,Rui Hua, Video graphics array (VGA) card assembly.
  66. Cheng,Chia Chun, Water-cooling heat dissipator.

이 특허를 인용한 특허 (1)

  1. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Thermoelectric-enhanced, inlet air-cooled thermal conductors.
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