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Multiplexed heater array using AC drive for semiconductor processing

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05B-003/68
  • H01L-021/67
  • H01L-021/683
출원번호 US-0406978 (2012-02-28)
등록번호 US-9324589 (2016-04-26)
발명자 / 주소
  • Pease, John
  • Benjamin, Nell
출원인 / 주소
  • LAM RESEARCH CORPORATION
대리인 / 주소
    Buchanan Ingersoll & Rooney
인용정보 피인용 횟수 : 1  인용 특허 : 77

초록

A heating plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable planar heater zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. A substrate suppo

대표청구항

1. A heating plate for a substrate support assembly used to support a semiconductor substrate in a semiconductor processing apparatus, the heating plate comprising: a first electrically insulating layer; a plurality of heater zones comprising at least first, second, third and fourth heater zones, th

이 특허에 인용된 특허 (77)

  1. O\Geary Daniel R. (Albuquerque NM) Arnold Larry D. (Albuquerque NM), Advanced thermoelectric heating and cooling system.
  2. Cox,Kenneth A.; Nichols,Walter A.; Sprinkel, Jr.,F. Murphy; McRae,Douglas D.; Sweeney,William R., Aerosol generator having temperature controlled heating zone and method of use thereof.
  3. Koelmel, Blake; Lerner, Alexander N.; Ranish, Joseph M.; Sangam, Kedarnath; Sorabji, Khurshed, Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber.
  4. Dress, Peter; Dietze, Uwe; Szekeresch, Jakob; Weihing, Robert, Apparatus and method for the treatment of substrates.
  5. Strang,Eric J.; Johnson,Wayne L., Apparatus for active temperature control of susceptors.
  6. Grimard, Dennis; Kholodenko, Arnold; Veytser, Alex; Thach, Senh; Cheng, Wing, Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber.
  7. Shu Nakajima JP; Neil Benjamin, Ceramic electrostatic chuck assembly and method of making.
  8. Tachikawa,Toshihiro; Miyahara,Junichi; Hanamachi,Toshihiko, Ceramics heater.
  9. Natsuhara, Masuhiro; Narita, Masashi; Nakata, Hirohiko; Kuibira, Akira, Circuit pattern of resistance heating elements and substrate-treating apparatus incorporating the pattern.
  10. Brown,Karl; Sherstinsky,Semyon; Wang,Wei W.; Tsai,Cheng Hsiung; Mehta,Vineet; Lau,Allen; Sansoni,Steve, Detachable electrostatic chuck for supporting a substrate in a process chamber.
  11. Donald C. Mayer ; Jon V. Osborn ; Siegfried W. Janson ; Peter D. Fuqua, Diode isolated thin film fuel cell array addressing method.
  12. Ootsuka,Takeshi; Endou,Kazunori, Electrode-built-in susceptor and a manufacturing method therefor.
  13. Burket, Chris T.; Yoshihara, Yumiko; Kobayashi, Masaaki, Electrolytic capacitor.
  14. Matsuyama, Shoichiro, Electrostatic chuck and substrate processing apparatus having same.
  15. Hausmann Gilbert, Electrostatic chuck having a combination electrode structure for substrate chucking, heating and biasing.
  16. Steger, Robert J., Electrostatic chuck having radial temperature control capability.
  17. Morioka, Ikuhisa; Nobori, Kazuhiro; Kawajiri, Tetsuya; Hattori, Akiyoshi, Electrostatic chuck with heater and manufacturing method thereof.
  18. Moon, Jung Eon, Electrostatic discharge protection device having low junction capacitance and operational voltage.
  19. Jerome Hubacek, Electrostatically clamped edge ring for plasma processing.
  20. Gore,Makarand P., Fuel cartridge with thermo-degradable barrier system.
  21. Arthur, Alan R; Edmonds, Heather, Fuel-cell resistors and methods.
  22. Cohn ; Marvin, Harmonic mixing with an anti-parallel diode pair.
  23. Yoo Woo Sik, Heat management in wafer processing equipment using thermoelectric device.
  24. Shirakawa Eiichi,JPX ; Sata Nobuyuki,JPX, Heat treatment apparatus.
  25. Ohkase Wataru (Sagamihara JPX) Yagi Yasushi (Zama JPX) Kawachi Satoshi (Yokohama JPX), Heat treatment apparatus utilizing flat heating elements for treating semiconductor wafers.
  26. Okajima,Hisakazu; Unno,Yutaka; Kawasaki,Keiji, Heating apparatus.
  27. Arena Chantal (Le Fontanil FRX) Noel Patrice (Sassenage FRX), Heating plate for heating an object placed on its surface and chemical treatment reactor equipped with said plate.
  28. Gaff, Keith William; Comendant, Keith, Heating plate with diode planar heater zones for semiconductor processing.
  29. Singh, Harmeet, Heating plate with planar heater zones for semiconductor processing.
  30. Shamouilian Shamouil ; Kumar Ananda H. ; Kholodenko Arnold ; Grimard Dennis S. ; Mohn Jonathan D. ; Chafin Michael G. ; Collins Kenneth S., High density plasma process chamber.
  31. Ohata, Mitsunori, High rate method for stable temperature control of a substrate.
  32. Katata, Tomio; Hayasaka, Nobuo; Okumura, Katsuya, Hot plate and semiconductor device manufacturing method using the same.
  33. Colelli ; Jr. James J. ; Leggett Randall A. ; Mundenar Joseph ; Whiting Charles A., Hot plate with in situ surface temperature adjustment.
  34. Hasegawa Isahiro (Stormville NY) Muller Karl Paul (Wappingers Falls NY) Poschenriedes Bernhard L. (Poughkeepsie NY) Timme Hans-Joerg (Wappingers Falls NY) Van Kessel Theodore (Millbrook NY), In-situ wafer temperature control apparatus for single wafer tools.
  35. Mak,Alfred W.; Lee,Yung Hee Yvette; Brooks,Cynthia B.; Buie,Melisa J.; Sahin,Turgut; Ding,Jian, Integrated phase angle and optical critical dimension measurement metrology for feed forward and feedback process control.
  36. Hull John R., Levitation pressure and friction losses in superconducting bearings.
  37. Benjamin, Neil; Steger, Robert, Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support.
  38. Benjamin,Neil; Steger,Robert, Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support.
  39. Fulford, H. Jim; Lansford, Jeremy, Method and apparatus for providing etch uniformity using zoned temperature control.
  40. Moroz,Paul, Method and apparatus for rapid temperature change and control.
  41. Segawa, Terutsugu; Sanada, Minoru, Method and apparatus for wafer level burn-in.
  42. Mitrovic,Andrej; Tsukamoto,Yuji, Method and system for temperature control of a substrate.
  43. Tsukamoto,Yuji, Method for multi-step temperature control of a substrate.
  44. Strang,Eric J.; Mitrovic,Andrej; Fordemwalt,Jim; Johnson,Wayne L., Method of and structure for controlling electrode temperature.
  45. Matsuda,Hiroto; Nobori,Kazuhiro; Mori,Yutaka, Method of manufacturing electrical resistance heating element.
  46. Mahawili Imad (Sunnyvale CA), Multi-zone planar heater assembly and method of operation.
  47. Johnson, Wayne L.; Strang, Eric J., Multi-zone resistance heater.
  48. Schaper Charles D. ; El-Awady Khalid A. ; Kailath Thomas, Multizone bake/chill thermal cycling module.
  49. Lund Mark D. (Vancouver WA), Passively-multiplexed resistor array.
  50. Masuda, Toshio; Takahashi, Kazue; Suehiro, Mitsuru; Kaji, Tetsunori; Kanai, Saburo, Plasma etching apparatus and plasma etching method.
  51. Deguchi Youichi (Tokyo JPX) Kawakami Satoru (Sagamihara JPX) Ueda Yoichi (Yokohama JPX) Komino Mitsuaki (Tokyo JPX), Plasma processing apparatus.
  52. Chen,Lee; Kambara,Hiromitsu; Tian,Caizhong; Nishizuka,Tetsuya; Nozawa,Toshihisa, Plasma processing system for treating a substrate.
  53. Getchel Paul A. ; Lyden Henry A. ; Miffitt Donald C., Power and control system for a workpiece chuck.
  54. Barnett, Jr.,James R.; Ekblad,Mark K.; Parker,Jeffrey M., Process module tuning.
  55. Brcka, Jozef, Ring-shaped high-density plasma source and method.
  56. Gopalraja,Praburam; Fu,Jianming; Tang,Xianmin; Forster,John C.; Kelkar,Umesh, Self-ionized and capacitively-coupled plasma for sputtering and resputtering.
  57. Kuibira,Akira; Nakata,Hirohiko; Shinma,Kenji, Semiconductor heating apparatus.
  58. Kanno, Seiichiro; Nishio, Ryoji; Yoshioka, Ken; Kanai, Saburou; Kihara, Hideki; Yamamoto, Hideyuki, Semiconductor processing apparatus.
  59. Bethune Edwin M. ; Olmsted Donald, Semiconductor processing furnace heating control system.
  60. Dhindsa Rajinder, Solid state temperature controlled substrate holder.
  61. Morita Akihiko,JPX ; Ohtani Masami,JPX ; Imanishi Yasuo,JPX ; Tsuji Masao,JPX ; Iwami Masaki,JPX ; Nishimura Joichi,JPX ; Nishimura Kazuhiro,JPX ; Hamada Tetsuya,JPX ; Yamamoto Satoshi,JPX ; Kamei Ke, Substrate processing apparatus having regulated power consumption and method therefor.
  62. Ishii Nobuo,JPX, Susceptor structure for mounting processing object thereon.
  63. Reiter, Jeffrey Shane; Barlow, Stephen Eric; Cai, Zhiwei, System and method for controlling thin film defects.
  64. Giere, Matthew; Prakash, Satya; Askeland, Ronald A., System and method for predicting dynamic thermal conditions of an inkjet printing system.
  65. Ghoshal,Uttam, System employing temporal integration of thermoelectric action.
  66. Sorabji, Khurshed; Lerner, Alexander; Ranish, Joseph; Hunter, Aaron; Adams, Bruce; Behdjat, Mehran; Ramanujam, Rajesh, Temperature measurement and control of wafer support in thermal processing chamber.
  67. Charles D. Schaper ; Khalid El-Awady ; Thomas Kailath, Temperature processing module.
  68. Jyousaka, Megumi; Shinozuka, Shinichi; Ogata, Kunie, Temperature setting method of thermal processing plate, computer-readable recording medium recording program thereon, and temperature setting apparatus for thermal processing plate.
  69. Feder,Jan; Beyerle,Rick; Byers,Stephen; Jones,Thomas, Thermal control of a DUT using a thermal control substrate.
  70. Gaff, Keith William; Comendant, Keith; Ricci, Anthony, Thermal plate with planar thermal zones for semiconductor processing.
  71. Hackleman David E. (Monmouth OR), Thermal-ink heater array using rectifying material.
  72. Kessler Rolf (Merzhausen DEX), Thermoelectric heating or cooling device.
  73. Saunders, John; Jacob, Jamey D.; Gao, Dayong; Myers, Michel A., Thermoelectric modules and a heating and cooling apparatus incorporating same.
  74. Ennis, Gerard, Vacuum plasma processor and method of operating same.
  75. Ennis,Gerard, Vacuum plasma processor and method of operating same.
  76. Kamp, Tom A.; Gottscho, Richard; Lee, Steve; Lee, Chris; Yamaguchi, Yoko; Vahedi, Vahid; Eppler, Aaron, Variable temperature processes for tunable electrostatic chuck.
  77. Hudson, Douglas E.; Butcher, Dana G.; Gates, Richard B.; Pelrin, James, Workpiece chuck with temperature control assembly having spacers between layers providing clearance for thermoelectric modules.

이 특허를 인용한 특허 (1)

  1. Ono, Hiroshi, Sample holder.
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