Electronic product including a heat dissipating device
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-007/20
G06F-001/28
H01L-023/427
H01L-023/473
F28D-015/02
F28D-021/00
출원번호
US-0284553
(2014-05-22)
등록번호
US-9332672
(2016-05-03)
발명자
/ 주소
Horng, Alex
Yin, Tso-Kuo
출원인 / 주소
Sunonwealth Electric Machine Industry Co., Ltd.
대리인 / 주소
Kamrath, Alan D.
인용정보
피인용 횟수 :
0인용 특허 :
14
초록▼
An electronic product including a heat dissipating device is disclosed. The electronic product includes a casing, a heat conducting board, at least one fan unit and a plurality of electronic elements. The casing includes a compartment. The heat conducting board divides the compartment into first and
An electronic product including a heat dissipating device is disclosed. The electronic product includes a casing, a heat conducting board, at least one fan unit and a plurality of electronic elements. The casing includes a compartment. The heat conducting board divides the compartment into first and second chambers. The first chamber includes a plurality of openings. The fan unit(s) includes an air inlet aligned with an opening of the openings, as well as an air outlet aligned with another opening of the openings. The first chamber defines at least one air channel each being in the form of a single air channel including two ends respectively in communication with the opening and the other opening. In one embodiment, the at least one fan unit includes first and second fan units. In another embodiment, the at least one air channel includes first and second air channels in communication with each other.
대표청구항▼
1. A heat dissipating device comprising: a casing including two opposing walls defining a compartment;at least one heat conducting board mounted between the two opposing walls in the compartment and dividing the compartment into a first chamber and a second chamber, with said at least one heat condu
1. A heat dissipating device comprising: a casing including two opposing walls defining a compartment;at least one heat conducting board mounted between the two opposing walls in the compartment and dividing the compartment into a first chamber and a second chamber, with said at least one heat conducting board located between the first and second chambers, with the first chamber including a plurality of openings, with the at least one heat conducting board being solid;at least one fan unit mounted in the first chamber, with each said at least one fan unit including an air inlet and an air outlet, with said air inlet aligned and in communication with an opening of the plurality of openings, with said air outlet aligned and in communication with another opening of the plurality of openings; anda plurality of electronic elements located in the second chamber, with at least one of the plurality of electronic elements mounted upon the at least one heat conducting board, with the first chamber and the second chamber not being in communication with each other, with the first chamber defining at least one air channel, with said at least one heat conducting board including a plurality of fins, with the plurality of fins located in the at least one air channel, and with the plurality of fins extending from the at least one heat conducting board towards but spaced from one of the two walls of the casing,with the at least one air channel being in the form of a single air channel including first and second ends respectively in communication with the opening and the other opening of the plurality of openings,with said at least one fan unit including first and second fan units, with the air inlet of the first fan unit aligned and in communication with the opening of the plurality of openings, and with the air outlet of the second fan unit aligned and in communication with the other opening of the plurality of openings. 2. A heat dissipating device comprising: a casing including two opposing walls defining a compartment;at least one heat conducting board mounted between the two opposing walls in the compartment and dividing the compartment into a first chamber and a second chamber with said at least one heat conducting board located between the first and second chambers, with the first chamber including a plurality of openings, with the at least one heat conducting board being solid;at least one fan unit mounted in the first chamber, with each said at least one fan unit including an air inlet and an air outlet, with said air inlet aligned and in communication with an opening of the plurality of openings, with said air outlet aligned and in communication with another opening of the plurality of openings; anda plurality of electronic elements located in the second chamber, with at least one of the plurality of electronic elements mounted upon the at least one heat conducting board, with the first chamber and the second chamber not being in communication with each other, with the first chamber defining at least one air channel, with said at least one heat conducting board including a plurality of fins, with the plurality of fins located in the at least one air channel, and with the plurality of fins extending from the at least one heat conducting board towards but spaced from one of the two walls of the casing,with the at least one air channel including a first air channel and a second air channel in communication with the first air channel. 3. The electronic product including the heat dissipating device as claimed in claim 2, with the opening of the plurality of openings located in an end of the first air channel, with the other opening of the plurality of openings located in an end of the second air channel. 4. The electronic product including the heat dissipating device as claimed in claim 3, with the first and second air channels having an intersection forming a mounting section, and with the at least one fan unit mounted in the mounting section. 5. The electronic product including the heat dissipating device as claimed in claim 4, with a further opening of the plurality of openings located in a top side of the mounting area, and with an additional opening of the plurality of openings located in a bottom side of the mounting area. 6. The electronic product including the heat dissipating device as claimed in claim 5, with the fan unit including another air inlet and another air outlet, with the air inlet aligned and in communication with the further opening, with the other air inlet aligned and in communication with the additional opening, with the air outlet in communication with the opening via the first air channel, and with the other air outlet in communication with the other opening via the second air channel. 7. The electronic product including the heat dissipating device as claimed in claim 2, with the plurality of fins parallel to each other.
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이 특허에 인용된 특허 (14)
Bhatia Rakesh, Apparatus for cooling electronic components within a computer system enclosure.
Shigeo Ohashi JP; Yoshihiro Kondo JP; Takashi Naganawa JP; Tsuyoshi Nakagawa JP, Electronic apparatus having means for cooling a semiconductor element mounted therein.
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