초록 ▼

An enclosure includes an explosion resistant housing having a back wall, a top, a first side, a second side, and a door. The enclosure further including a transistor disposed on the back wall of the explosion resistant housing. The enclosure also includes a passive heat exchanger disposed on the out

An enclosure includes an explosion resistant housing having a back wall, a top, a first side, a second side, and a door. The enclosure further including a transistor disposed on the back wall of the explosion resistant housing. The enclosure also includes a passive heat exchanger disposed on the outside of the back wall of the explosion resistant housing. Also, a method of thermal management within an enclosure includes transferring heat from a transistor within an explosion resistant housing, wherein the heat is transferred from the transistor to a back wall of the explosion resisting housing. The method further includes passively removing the heat from the explosion resistant housing.

대표청구항 ▼

1. An enclosure comprising: an explosion resistant housing having a back wall, a top, a first side, a second side, and a door;a transistor disposed on the back wall;a passive heat exchanger disposed on the outside of the back wall of the explosion resistant housing;an air circulation device disposed

1. An enclosure comprising: an explosion resistant housing having a back wall, a top, a first side, a second side, and a door;a transistor disposed on the back wall;a passive heat exchanger disposed on the outside of the back wall of the explosion resistant housing;an air circulation device disposed outside the explosion resistant housing and configured to move air over at least the passive heat exchanger; andan air shroud disposed over the explosion resistant housing,wherein at least a portion of the transistor is disposed on a plate and at least a portion of the transistor is disposed on the back wall. 2. The enclosure of claim 1, further comprising a second heat exchanger disposed on the top of the explosion resistant housing. 3. The enclosure of claim 1, further comprising at least one air circulation device disposed inside the explosion resistant housing. 4. The enclosure of claim 1, further comprising an active fluid cooling system disposed on the outer back wall of the explosion resistant housing. 5. The enclosure of claim 1, wherein at least the first side, the second side, and the back of the enclosure comprises aluminum. 6. The enclosure of claim 1, wherein a plurality of circuit components are disposed on a second plate, wherein the second plate comprises aluminum and the second plate is disposed in explosion resistant housing. 7. The enclosure of claim 1, wherein a rectifier is disposed on the back wall of the explosion resistant housing. 8. A method of thermal management within an enclosure, the method comprising: transferring heat from a transistor within an explosion resistant housing, wherein the heat is transferred from the transistor to a back wall of the explosion resistant housing;removing passively the heat from the explosion resistant housing;moving air over a passive heat exchanger disposed on a back wall of the explosion resistant housing, wherein the air is directed through an air shroud; andremoving actively the heat from the explosion resistant housing, wherein the removing includes passing the heat through a fluid cooling system disposed outside of the explosion resistant housing. 9. The method of claim 8, further comprising circulating air within the explosion resistant housing. 10. The method of claim 8, further comprising transferring heat from a rectifier disposed on the back wall of the explosion resistant housing. 11. The method of claim 8, wherein the explosion resistant housing comprises aluminum. 12. An explosion resistant enclosure comprising: an explosion resistant housing having a back wall, a top, a first side, a second side, and a door;a variable frequency drive disposed in the explosion resistant housing, the variable frequency drive comprising at least an insulated-gate bipolar transistor and a rectifier, wherein at least one of the insulated-gate bipolar transistor and the rectifier is disposed on the back wall of the explosion resistant housing;a passive heat exchanger disposed on the outside of the back wall of the explosion resistant housing;an air circulation device disposed outside the explosion resistant housing and configured to move air over at least the passive heat exchanger;an air shroud disposed over the explosion resistant housing; anda radiant barrier disposed above the explosion resistant enclosure. 13. The explosion resistant enclosure of claim 12, wherein the explosion resistant housing comprises aluminum. 14. The explosion resistant enclosure of claim 12, wherein heat is transferred from a rectifier within the explosion resistant housing, wherein the heat circuit components are disposed on a plate, and wherein the plate is disposed in the explosion resistant housing. 15. The explosion resistant enclosure of claim 1, further comprising an active fluid cooling system. 16. The explosion resistant housing of claim 15, wherein the active fluid cooling system comprises one or more pipes containing fluids disposed proximate the passive heat exchanger.