초록 ▼

A welding method, including: forming a molten solder in a solder bath, forming a dynamic flow of the molten solder from the solder bath, and contacting an object to be welded with the dynamic flow of the molten solder and conducting welding. The surface of the molten solder includes a reduction laye

A welding method, including: forming a molten solder in a solder bath, forming a dynamic flow of the molten solder from the solder bath, and contacting an object to be welded with the dynamic flow of the molten solder and conducting welding. The surface of the molten solder includes a reduction layer. The oxygen content of the molten solder is below 10 ppm.

대표청구항 ▼

1. A soldering method, comprising: 1) forming a molten solder in a solder bath;2) forming a dynamic flow of the molten solder from the solder bath; and3) contacting an object to be soldered with the dynamic flow of the molten solder; wherein: a surface of the molten solder comprises a reduction laye

1. A soldering method, comprising: 1) forming a molten solder in a solder bath;2) forming a dynamic flow of the molten solder from the solder bath; and3) contacting an object to be soldered with the dynamic flow of the molten solder; wherein: a surface of the molten solder comprises a reduction layer;an oxygen content of the molten solder is below 10 ppm;the reduction layer comprises a nonionic surfactant, an antioxidant, and ammonium metaphosphate;the nonionic surfactant is selected from nonylphenol ethoxylates, polyoxyethylene sorbitan monolaurates, or a mixture thereof;the antioxidant is selected from phytic acid, malic acid, citric acid, or a mixture thereof; andthe reduction layer comprises between 59 and 80 wt. % of the nonionic surfactant, between 15 and 40 wt. % of the antioxidant, and between 0.5 and 5 wt. % of ammonium metaphosphate. 2. The method of claim 1, wherein a soldering temperature is between 240 and 280° C. 3. The method of claim 1, wherein the reduction layer further comprises an accelerator. 4. The method of claim 3, wherein the accelerator is selected from aniline, tetrabutylammonium bromide, triethanolamine, ethylene diamine, methylamine, ammonium citrate, ammonium dihydrogen phosphate, or a mixture thereof; andthe reduction layer comprises between 0.5 and 5 wt. % of the accelerator. 5. A soldering method, comprising: 1) forming a molten solder in a solder bath;2) forming a dynamic flow of the molten solder from the solder bath; and3) contacting an object to be soldered with the dynamic flow of the molten solder; wherein: a surface of the molten solder comprises a reduction layer;an oxygen content of the molten solder is below 10 ppm;the reduction layer comprises a nonionic surfactant, an antioxidant, and ammonium metaphosphate;the reduction layer further comprises an accelerator;the reduction layer comprises between 0.5 and 5 wt. % of the accelerator;the accelerator is ammonium dihydrogen phosphate; anda weight ratio of ammonium metaphosphate to ammonium dihydrogen phosphate is between 2:1 and 5:1. 6. The method of claim 4, wherein the accelerator is ammonium dihydrogen phosphate; anda weight ratio of ammonium metaphosphate to ammonium dihydrogen phosphate is between 2:1 and 5:1.