Module-type data center and method of controlling the same
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-007/20
C09K-005/04
G06F-001/20
H05K-007/14
출원번호
US-0495875
(2014-09-24)
등록번호
US-9363928
(2016-06-07)
발명자
/ 주소
Kondo, Masao
Endo, Hiroshi
Umemiya, Shigeyoshi
Arioka, Takahiro
Fukuda, Hiroyuki
출원인 / 주소
FUJITSU LIMITED
대리인 / 주소
Fujitsu Patent Center
인용정보
피인용 횟수 :
0인용 특허 :
10
초록▼
A module-type data center includes: a casing including a first intake opening, a second intake opening, and an exhaust opening; an air conditioner provided in the casing and configured to generate a first airflow by taking in outside air through the first intake opening and bringing the outside air
A module-type data center includes: a casing including a first intake opening, a second intake opening, and an exhaust opening; an air conditioner provided in the casing and configured to generate a first airflow by taking in outside air through the first intake opening and bringing the outside air into direct contact with a refrigerant; a fan unit provided in the casing and configured to generate a second airflow by taking in the outside air through the second intake opening; and an electronic device provided in the casing and configured to be air-cooled by a mixed airflow of the first airflow and the second airflow and release an exhaust airflow after the air-cooling to the exhaust opening. The first intake opening and the second intake opening are provided on different surfaces of the casing.
대표청구항▼
1. A module-type data center comprising: a casing including a first intake opening, a second intake opening, and an exhaust opening;an air conditioner provided in the casing and configured to generate a first airflow by taking in outside air through the first intake opening and bringing the outside
1. A module-type data center comprising: a casing including a first intake opening, a second intake opening, and an exhaust opening;an air conditioner provided in the casing and configured to generate a first airflow by taking in outside air through the first intake opening and bringing the outside air into direct contact with a refrigerant;a fan unit provided in the casing and configured to generate a second airflow by taking in outside air through the second intake opening; andan electronic device provided in the casing, and configured to be exposed to a mixed airflow of the first airflow and the second airflow and release an exhaust airflow containing the mixed airflow to the exhaust opening, whereinthe first intake opening and the second intake opening are provided on different surfaces of the casing. 2. The module-type data center according to claim 1, wherein the air conditioner includes a fan operating independently from the fan unit, andthe fan generates the first airflow. 3. The module-type data center according to claim 2, wherein the fan of the air conditioner is stopped when the outside air has a temperature within a temperature range in which operation of the electronic device is guaranteed. 4. The module-type data center according to claim 2, wherein the fan of the air conditioner is stopped when the outside air has a humidity within a humidity range in which operation of the electronic device is guaranteed. 5. The module-type data center according to claim 2, wherein the fan of the air conditioner is operated when the outside air has a temperature exceeding a temperature at which operation of the electronic device is guaranteed. 6. The module-type data center according to claim 5, the data center further comprising: a controller configured to control a rotation speed of the fan so that a humidity of the mixed airflow becomes a target humidity. 7. The module-type data center according to claim 1, wherein the air conditioner includesan element impregnated with the refrigerant and exposed to the outside air, anda valve configured to supply the refrigerant to the element, andthe valve is closed when the outside air has a humidity exceeding a prescribed value. 8. The module-type data center according to claim 1, the data center further comprising: a first flow channel which communicates with the first intake opening and through which the exhaust airflow flows to the first intake opening; anda first opening-closing portion provided in the first flow channel and configured to open or close the first flow channel. 9. The module-type data center according to claim 8, wherein the first flow channel is a duct, andthe first opening-closing portion is a first damper. 10. The module-type data center according to claim 8, the data center further comprising: a second flow channel separated from the first flow channel and configured to lead the exhaust airflow to an upstream of the fan unit; anda second opening-closing portion provided in the second flow channel and configured to open or close the second flow channel. 11. The module-type data center according to claim 10, wherein the second opening-closing portion adjusts a flow rate of the exhaust airflow flowing through the second flow channel continuously or in stepwise manner. 12. The module-type data center according to claim 10, wherein the second opening-closing portion is a second damper. 13. The module-type data center according to claim 10, wherein the first opening-closing portion and the second opening-closing portion are closed when the outside air has a temperature within a temperature range in which operation of the electronic device is guaranteed. 14. The module-type data center according to claim 10, wherein the second opening-closing portion is opened when the outside air has a temperature below a temperature at which operation of the electronic device is guaranteed. 15. The module-type data center according to claim 14, the data center further comprising: a controller configured to control an opening degree of the second opening-closing portion so that a temperature of the mixed airflow becomes a target temperature. 16. The module-type data center according to claim 8, wherein the first opening-closing portion is opened when the outside air has a temperature below a temperature at which operation of the electronic device is guaranteed, and when the outside air has a humidity below a humidity at which operation of the electronic device is guaranteed. 17. The module-type data center according to claim 1, wherein an outer shape of the casing is a cuboid,the first intake opening is provided on a side surface of the cuboid, andthe second intake opening is provided on a front surface of the cuboid. 18. The module-type data center according to claim 17, wherein the exhaust opening is provided on the front surface of the cuboid. 19. The module-type data center according to claim 1, wherein at least one of the first intake opening and the second intake opening is provided with a filter. 20. A method of controlling a module-type data center, the method comprising: generating a first airflow by taking in outside air through a first intake opening provided on a casing and bringing the outside air into direct contact with a refrigerant;generating a second airflow by taking in outside air through a second intake opening provided on a surface of the casing different from a surface having the first intake opening; andexposing an electronic device provided in the casing to a mixed airflow of the first airflow and the second airflow.
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이 특허에 인용된 특허 (10)
Koblenz, Brian D.; Simon, Carol; Hilliard, Milton P., Environmental control for module housing electronic equipment racks.
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