초록 ▼

A heat removal system for use in optical and optoelectronic devices and subassemblies is provided. The heat removal system lowers the power consumption of one or more active cooling components within the device or subassembly, such as a TEC, which is used to remove heat from heat generating componen

A heat removal system for use in optical and optoelectronic devices and subassemblies is provided. The heat removal system lowers the power consumption of one or more active cooling components within the device or subassembly, such as a TEC, which is used to remove heat from heat generating components within the device or subassembly. For any particular application, the heat removal system more efficiently removes the heat from the active cooling component, by using a heat transfer assembly, such as a planar heat pipe type assembly. The heat transfer assembly employs properties like, but not limited to, phase transition change and thermal conductivity to move heat without external power. In some embodiments, the heat transfer assembly can be used to allow the active cooling component, such as a TEC to be removed, leaving the heat transfer assembly to remove the heat from the device or subassembly.

대표청구항 ▼

1. A heat control system for use in an optical or optoelectronic device or subassembly, the heat control system comprising: a housing for containing the optical or optoelectronic device or subassembly;one or more heat generating components;an active cooling component for removing heat from at least

1. A heat control system for use in an optical or optoelectronic device or subassembly, the heat control system comprising: a housing for containing the optical or optoelectronic device or subassembly;one or more heat generating components;an active cooling component for removing heat from at least one of the one or more heat generating components, the active cooling component including a first direct thermal connection and a direct mechanical connection with the at least one of the one or more heat generating components; anda heat transfer assembly comprising a substantially planar two dimensional vessel which combines both thermal conductivity and phase transition, the heat transfer assembly having a second direct thermal connection with the active cooling component, the second direct thermal connection comprising a conductive platform, wherein the heat transfer assembly provides a mechanical supporting structure for one or more of the heat generating components. 2. The heat control system according to claim 1 wherein the second direct thermal connection comprises a conductive platform which serves as a base of the housing. 3. The heat control system according to claim 1 wherein the optical or optoelectronic device or subassembly is a laser, a laser transmitter, an optical receiver, a transmitter optical subassembly or a receiver optical subassembly. 4. The heat control system according to claim 1 wherein the heat generating component is a laser or a laser transmitter or a non-heat generating element that requires temperature stabilization. 5. The heat control system according to claim 1 wherein the heat generating component comprises a photonic integrated circuit or an optoelectronic circuit, and the active cooling component is in thermal connectivity with the photonic integrated circuit or an optoelectronic circuit, and the heat transfer assembly is in thermal connection with the active cooling component. 6. The heat control system according to claim 1 wherein the optical or optoelectronic device or subassembly comprises at least two heat generating components, each heat generating component comprising an active cooling component in direct thermal and mechanical connection with each heat generating component, and wherein the heat transfer assembly is in thermal connection with both active cooling components. 7. The heat control system according to claim 1 wherein the conductive platform is disposed in between the heat transfer assembly and the active cooling component, and the heat transfer assembly is exposed at least in part external to the housing. 8. The heat control system according to claim 1 wherein the heat transfer assembly extends substantially along a width of the housing and a length of the heat transfer assembly is exposed at least in part externally to the housing. 9. The heat control system according to claim 1 wherein the heat transfer assembly is less than 1 mm in height, and extends substantially over an area of the active cooling component. 10. The heat control system according to claim 1 wherein the heat transfer assembly is a substantially planar heat pipe type assembly comprising a two-dimensional vessel having interior nano-structures or micro structures. 11. The heat control system according to claim 1 wherein the heat transfer assembly is a substantially planar heat pipe type assembly comprising nano-structured titanium. 12. The heat control system according to claim 1 wherein the heat transfer assembly is a substantially planar heat pipe type assembly comprising nano-structured titanium which extends substantially along a width of the housing. 13. The heat control system according to claim 1 wherein the one or more heat generating components and active cooling components are configured to stack vertically on top of the heat transfer assembly. 14. The heat control system according to claim 1 wherein the heat transfer assembly is in direct thermal connection and direct mechanical connection with an active heat removal element. 15. The heat control system according to claim 1 wherein the heat transfer assembly is in direct thermal connection and direct mechanical connection with the active cooling component, and the active cooling component is in direct thermal connection and direct mechanical connection with at least one of the heat generating components. 16. The heat control system according to claim 1 further comprising a heat dissipating apparatus in thermal connection with the heat transfer assembly. 17. A heat control system for use in an optical or optoelectronic device or subassembly, the heat control system comprising: a housing for containing the optical or optoelectronic device or subassembly;a first heat generating component;a heat transfer assembly comprising a substantially planar two dimensional vessel which combines both thermal conductivity and phase transition, the heat transfer assembly having a first thermal connection with the first heat generating component;a conductive platform which serves as a base of the housing, the heat transfer assembly having a second thermal connection with the conductive platform;a second heat generating component; andan active cooling component for removing heat from the second heat generating component, the active cooling component having a third thermal connection with the second heat generating component, and the active cooling component having a fourth thermal connection with the conductive platform,wherein the heat transfer assembly dissipates heat from the first heat generating component through the direct thermal connection with the first heat generating component, and the heat transfer assembly dissipates heat from the second heat generating component through the thermal connectivity of the heat transfer assembly with the conductive platform. 18. A heat control system for use in heat control of a photonic or optoelectronic circuit, the heat control system comprising: a photonic integrated circuit or optoelectronic circuit;an active cooling component for removing heat from the photonic integrated circuit or optoelectronic circuit, the active cooling component in direct thermal connection and direct mechanical connection with the photonic integrated circuit or optoelectronic circuit;a heat transfer assembly comprising a substantially planar two dimensional vessel which combines both thermal conductivity and phase transition, the heat transfer assembly in direct thermal connection with the active cooling component; anda heat dissipating apparatus in thermal connection with the heat transfer assembly. 19. A heat control system for use in heat control of an optical or optoelectronic device or subassembly comprising a transmitter optical subassembly, the transmitter optical subassembly comprising: a transmitter optical subassembly housing;a circuit comprising a photonic integrated circuit or optoelectronic circuit disposed within the transmitter optical subassembly housing;a thermoelectric cooler for removing heat from the circuit, the thermoelectric cooler having a first direct thermal connection with the circuit and a direct mechanical connection with the circuit; anda heat transfer assembly comprising a substantially planar two dimensional vessel which combines both thermal conductivity and phase transition, the heat transfer assembly having a second direct thermal connection with the thermoelectric cooler. 20. The heat control system according to claim 19 wherein the transmitter optical subassembly comprises a pluggable transceiver or transceiver circuit embedded onto an electronic line card, daughter card or other portion of a system communicating with a fiber optic transmission channel or subsystem. 21. The heat control system according to claim 19 wherein the second thermal connection comprises a conductive platform which is disposed in between the heat transfer assembly and the thermoelectric cooler, and wherein the heat transfer assembly is exposed at least in part externally to the transmitter optical subassembly housing. 22. The heat control system according to claim 19 wherein the heat transfer assembly extends substantially along a width of the transmitter optical subassembly housing, and a length of the heat transfer assembly is exposed at least in part externally to the transmitter optical subassembly housing. 23. The heat control system according to claim 19 wherein the circuit and thermoelectric cooler are configured to stack vertically on top of the heat transfer assembly and to fit within the transmitter optical subassembly housing. 24. The heat control system according to claim 19 wherein the second direct thermal connection comprises a conductive platform which serves as a base of the transmitter optical subassembly housing.