[특허]Thermal module accounting for increased board/die size in a portable computer

Apple Inc.

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Thermal module accounting for increased board/die size in a portable computer

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-007/20 H01L-023/40 H05K-001/02 H05K-001/18 F28D-015/02 F28D-015/04
출원번호	US-0214315 (2014-03-14)
등록번호	US-9379037 (2016-06-28)
발명자 / 주소	Degner, Brett W. Reid, Gavin J. Smith, Brandon S. Shan, Raymond S.
출원인 / 주소	Apple Inc.
대리인 / 주소	Downey Brand LLP
인용정보	피인용 횟수 : 0 인용 특허 : 61

초록
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This application relates to a low profile, small footprint cooling stack that does not extend substantially beyond a footprint of an integrated circuit to which it is affixed. The cooling stack utilizes a number of beam springs that supply a seating force to the integrated circuit by way of a metal slug. In some embodiments, a bottom surface of the metal slug can be contoured in accordance with a top surface of the integrated circuit and/or socket. In other embodiments a gap between peripheral portion of a bottom surface of the metal slug and an associat...

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1. A cooling stack for removing heat from an integrated circuit mounted on a printed circuit board (PCB), the cooling stack comprising: a metal slug comprising a top surface and a channel arranged along the top surface;a heat pipe disposed within and coupled to the channel of the metal slug;a beam spring exerting more than one force to the metal slug by way of respective more than one stress concentrator features formed in and that protrude from the beam spring and directly contacting the top surface of the metal slug; andfasteners configured to fasten an end of the beam spring to a fastening feature disposed proximate to a periphery of the integrated circuitwherein the beam spring compresses the metal slug against the integrated circuit. 2. The cooling stack as recited in claim 1, wherein the beam spring is oriented substantially parallel to the heat pipe. 3. The cooling stack as recited in claim 1, wherein the heat pipe is welded to the metal slug and wherein weld joints are positioned between lateral surfaces of the heat pipe and sidewalls of the channel. 4. The cooling stack as recited in claim 3, wherein the weld joints between the heat pipe and metal slug are formed at least in part by solder solids. 5. The cooling stack as recited in claim 1, wherein a peripheral portion of a bottom surface of the slug is coupled with a layer of foam that substantially prevents noise emitted from the integrated circuit from leaving the cooling stack. 6. The cooling stack as recited in claim 1, wherein a top surface of the beam spring does not extend above a top surface of the heat pipe. 7. The cooling stack as recited in claim 1, wherein the beam spring comprises a first beam spring, wherein a second beam spring exerts forces directly to the top surface of the metal slug by way of respective stress concentrator features formed in and that protrude from the second beam spring, and wherein the first beam spring and the second beam spring are disposed on opposite sides of the top surface of the metal slug. 8. The cooling stack as recited in claim 1, wherein a bottom surface of the slug is in direct contact with a top surface of the integrated circuit. 9. The cooling stack as recited in claim 8, wherein the bottom surface of the slug includes cavities having a size and shape in accordance with the top surface of the integrated circuit, and wherein the cavities cooperates with a protrusion of the integrated circuit to align the slug with the integrated circuit. 10. A heat removal system configured to transfer heat generated by an operating component to the external environment, the heat removal system comprising: a slug having a bottom surface in contact with a top surface of the operating component, the slug comprising a channel disposed along a top surface of the slug and extending from a first side of the slug to a second side of the slug, the second side opposite the first side;a heat pipe disposed within the channel, the heat pipe comprising lateral surfaces coupled to sidewalls defining the channel; andbeam springs each configured to exert a force on the operating component byway of the slug, each of the beam springs comprising: a first end and a second end, the first end coupled to a securing feature disposed proximate the first side of the slug and the second end coupled to a securing feature disposed proximate the second side of the slug; andmore than one stress concentrators formed in and that protrude from the beam spring configured to directly contact the slug and for applying more than one respective forces to the slug to restrain the slug against the operating component. 11. The heat removal system as recited in claim 10, wherein the slug is formed of a copper alloy. 12. The heat removal system as recited in claim 10, wherein each of the stress concentrators extends towards the slug. 13. The heat removal system as recited in claim 10, wherein a thickness of the slug within the channel is less than half a thickness of a remaining portion of the slug, wherein the lateral surfaces are coupled to the sidewalls of the channel by solder joints and wherein the coupling provided by the solder joints helps provide structural reinforcement to the portion of the slug associated with the channel. 14. The heat removal system as recited in claim 10, wherein the beam springs exert a force to the operating component by way of the metal slug to seat the operating component in a socket. 15. A portable computing device, comprising: a printed circuit board (PCB);a plurality of fastening features coupled to a top surface of the PCB;an integrated circuit electrically coupled to the top surface of the PCB by a socket;a metal slug in direct contact with a top surface of the integrated circuit;a beam spring coupled to the top surface of the PCB by fasteners that engage corresponding fastening features and exerting a seating force on the integrated circuit by way of the metal slug; anda heat pipe disposed within a channel disposed along a top surface of the metal slug, the heat pipe comprising lateral surfaces soldered to sidewalls defining the channelwherein the beam spring exerts forces to the slug by way of a respective more than one stress concentrator features formed in and that protrude from the beam spring, the beam spring compressing the metal slug against the integrated circuit. 16. The portable computing device as recited in claim 15, wherein a bottom surface of the metal slug is complementary to a geometry of both a top surface of the integrated circuit and a top surface of the socket. 17. The portable computing device as recited in claim 15, wherein the bottom surface of the slug comprises a cavity that engages a protrusion of the integrated circuit, and wherein interaction between the protrusion of the integrated circuit and the cavity cause the metal slug to align with the integrated circuit. 18. The portable computing device as recited in claim 15, further comprising a first heat sink disposed at a first end of the heat pipe and a second heat sink disposed at a second end of the heat pipe. 19. The portable computing device as recited in claim 15, wherein the beam spring comprises two stress concentrators that transmit the forces exerted by the beam spring to the metal slug.

이 특허에 인용된 특허 (61)

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Thermal module accounting for increased board/die size in a portable computer

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Thermal module accounting for increased board/die size in a portable computer

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이 특허에 인용된 특허 (61)

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