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특허 상세정보

Thermal module accounting for increased board/die size in a portable computer

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-007/20    H01L-023/40    H05K-001/02    H05K-001/18    F28D-015/02    F28D-015/04   
출원번호 US-0214315 (2014-03-14)
등록번호 US-9379037 (2016-06-28)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Downey Brand LLP
인용정보 피인용 횟수 : 0  인용 특허 : 61
초록

This application relates to a low profile, small footprint cooling stack that does not extend substantially beyond a footprint of an integrated circuit to which it is affixed. The cooling stack utilizes a number of beam springs that supply a seating force to the integrated circuit by way of a metal slug. In some embodiments, a bottom surface of the metal slug can be contoured in accordance with a top surface of the integrated circuit and/or socket. In other embodiments a gap between peripheral portion of a bottom surface of the metal slug and an associat...

대표
청구항

1. A cooling stack for removing heat from an integrated circuit mounted on a printed circuit board (PCB), the cooling stack comprising: a metal slug comprising a top surface and a channel arranged along the top surface;a heat pipe disposed within and coupled to the channel of the metal slug;a beam spring exerting more than one force to the metal slug by way of respective more than one stress concentrator features formed in and that protrude from the beam spring and directly contacting the top surface of the metal slug; andfasteners configured to fasten a...

이 특허에 인용된 특허 (61)

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