COMMISSARIAT À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
대리인 / 주소
Oliff PLC
인용정보
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2
초록▼
The device includes a thermoelectric module provided with a thermocouple. Said thermocouple includes a first and second leg which are made of different thermoelectric materials, electrically connected by a connecting element configured to deform according to the temperature thereof so as to assume:
The device includes a thermoelectric module provided with a thermocouple. Said thermocouple includes a first and second leg which are made of different thermoelectric materials, electrically connected by a connecting element configured to deform according to the temperature thereof so as to assume: a first deformation position in which the first and second legs are electrically connected in series solely by means of the connecting element; and a second deformation position in which the connecting element is in electrical contact with a shunt contact pad of the device, said shunt contact pad being made of a material, the electrical conductivity of which is greater than the electric conductivity of the connecting element and of the first and second legs. The device also includes a load, the electrical resistance of which is lower than the electrical resistance of the thermoelectric module, said load being electrically connected to the shunt contact pad.
대표청구항▼
1. A device comprising a thermoelectric module provided with a first leg and a second leg made of different thermoelectric materials electrically connected by a connecting element that deforms according to its temperature so as to assume: a first deformation position where the first and second legs
1. A device comprising a thermoelectric module provided with a first leg and a second leg made of different thermoelectric materials electrically connected by a connecting element that deforms according to its temperature so as to assume: a first deformation position where the first and second legs are electrically series-connected solely by the connecting element;a second deformation position where the connecting element is in electric contact with a shunt contact pad of said device, said shunt contact pad being made of a material having a greater electric conductivity than the connecting element and the first and second legs;wherein the device comprises a load having a smaller electric resistance than the thermoelectric module, said load being electrically connected to the shunt contact pad. 2. The device according to claim 1, wherein the shunt contact pad is made of a material selected from among metals, electrically-conductive polymers, electrically-conductive oxides, graphene, and carbon nanotubes. 3. The device according to claim 1, wherein the connecting element is reversibly deformable to switch from the first position to the second deformation position when its temperature becomes greater than a first temperature T1, and to switch back from the second position to the first deformation position when its temperature becomes lower than a second temperature T2 smaller than or equal to first temperature T1. 4. The device according to claim 1, wherein the connecting element is a bistrip. 5. The device according to claim 4, wherein the connecting element comprises an alloy of Fe and Ni. 6. The device according to claim 4, wherein the connecting element comprises an alloy of Fe, of Ni, and of an element selected from among Cr, Co, or Mn. 7. The device according to claim 4, wherein the connecting element comprises a silicon or silicon oxide layer. 8. The device according to claim 7, wherein the connecting element comprises a layer of a material selected from among Al, Au, Pb. 9. The device according to claim 4, wherein the bistrip is of blistering type. 10. The device according to claim 9, wherein the connecting element comprises a cavity having a bottom separated from the shunt contact pad when the connecting element assumes the first deformation position, the bottom being in contact with the shunt contact pad when the connecting element is in the second deformation position. 11. The device according to claim 9, wherein the connecting element comprises a cavity, and wherein the cavity reverses so that the connecting element is in contact with the shunt contact pad. 12. The device according to claim 1, wherein the connecting element is based on a shape-memory alloy. 13. The device according to claim 1, wherein: the thermoelectric module comprises a plurality of thermocouples electrically series-connected and each comprising first and second legs and made of different thermoelectric materials electrically connected by a connecting element;each thermocouple is associated with a shunt contact pad;each connecting element deforms according to its temperature to assume one of the first and second deformation positions; andeach shunt contact pad is connected to the load.
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이 특허에 인용된 특허 (2)
Qiu, Jin; Slocum, Alexander H.; Lang, Jeffrey H.; Struempler, Ralf; Brenner, Michael P.; Li, Jian, Bistable actuation techniques, mechanisms, and applications.
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