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Moisture resistant polyimide compositions

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08L-071/00
  • C08L-079/08
  • F21V-007/22
  • C08G-079/00
  • C08J-005/22
  • C08L-071/10
  • F21V-007/00
  • G02B-001/10
  • G02B-027/00
  • C08L-079/04
출원번호 US-0568615 (2014-12-12)
등록번호 US-9400091 (2016-07-26)
발명자 / 주소
  • Donovan, Michael Stephen
  • Haralur, Gurulingamurthy M.
출원인 / 주소
  • SABIC GLOBAL TECHNOLOGIES B.V.
대리인 / 주소
    Cantor Colburn LLP
인용정보 피인용 횟수 : 0  인용 특허 : 93

초록

The invention relates to a moisture resistant composition comprising: a) from 20 to 80 weight percent based on the total weight of the composition of a polyetherimide copolymer made from a monomer mixture comprising 3,3′ bisphenol-A dianhydride (BPADA), and 4,4′-diaminodiphenyl sulfone (DDS); b) fro

대표청구항

1. A composite article comprising a moisture resistant polymeric substrate layer; said polymeric substrate layer being directly bonded to a metal layer in the absence of a primer between the polymeric substrate layer and the metal layer, wherein the moisture resistant polymeric substrate layer consi

이 특허에 인용된 특허 (93)

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