A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished
A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features. Wide cuts may be made in the molds after encapsulation reducing thermal stresses. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations.
대표청구항▼
1. An apparatus comprising: a modular package having a first external surface, a second external surface opposite the first external surface, and an external side wall extending along the perimeter of and connecting with the first and second external surfaces, the first and second external surfaces
1. An apparatus comprising: a modular package having a first external surface, a second external surface opposite the first external surface, and an external side wall extending along the perimeter of and connecting with the first and second external surfaces, the first and second external surfaces each being defined at least in part by a respective layer of cured mold compound; andan electrical circuit for converting power, including a printed circuit board (“PCB”), a plurality of components including semiconductors mounted to the PCB and a plurality of interconnects electrically connected to the components, the electrical circuit being located within the cured mold compound;the external side wall comprising a strip formed by the PCB between strips formed by the layers of cured mold compound defining the first and second external surfaces, in which the strip formed by the PCB is coplanar with at least a portion of the strips formed by the layers of cured mold compound;the interconnects being disposed within the side wall. 2. The apparatus of claim 1 wherein the electrical circuit further comprises a magnetic core, and at least one of the first and second external surfaces is also defined by a surface of the magnetic core. 3. The apparatus of claim 2 further comprising: an adapter for providing mechanical and electrical connections between the modular package and an external mounting substrate, the adapter having a body and a plurality of electrical terminals; andelectrical connections formed between the adapter terminals and respective interconnects on the modular package,the adapter body being mechanically secured to the modular package and covering the electrical connections;the adapter terminals being arranged to mate with the external mounting substrate. 4. The apparatus of claim 1, comprising a portion of a mold panel, in which a surface of the portion of the mold panel forms at least a portion of the first external surface. 5. The apparatus of claim 1 in which the modular package comprises a power converter including: the PCB, in which the PCB comprises a plurality of conductive layers and having a top surface and a bottom surface; anda magnetic core structure magnetically coupled to a winding formed by traces in one or more of the conductive layers in the PCB;wherein the components comprise power semiconductor devices, a first set of the power semiconductor devices being mounted on the top surface and electrically connected to dissipate power at a level, Pt, during operation of the converter, a second set of the power semiconductor devices being mounted on the bottom surface and electrically connected to dissipate power at a level, Pb, during operation of the converter,wherein the power semiconductor devices are distributed between the first and second sets to distribute heat generation during operation of the converter such that each level Pt, Pb is less than 150% of the other level Pb, Pt. 6. The apparatus of claim 1 in which the external side wall comprises a planar external side wall, and the strip formed by the PCB and the strips formed by the layers of cured mold compound lie on a same plane. 7. An apparatus comprising: a modular package having a first external surface, a second external surface opposite the first external surface, and a side wall extending along the perimeter of and connecting with the first and second external surfaces, the first and second external surfaces each being defined at least in part by a respective layer of cured mold compound; andan electrical circuit for converting power, including a printed circuit board (“PCB”), a plurality of components including semiconductors mounted to the PCB and a plurality of interconnects electrically connected to the components, the electrical circuit being located within the cured mold compound;the side wall comprising a strip formed by the PCB between strips formed by the layers of cured mold compound defining the first and second external surfaces;the interconnects being disposed within the side wall;wherein the modular package comprises a power converter including: the PCB, in which the PCB comprises a plurality of conductive layers and having a top surface and a bottom surface; anda magnetic core structure magnetically coupled to a winding formed by traces in one or more of the conductive layers in the PCB;wherein the components comprise power semiconductor devices, a first set of the power semiconductor devices being mounted on the top surface and electrically connected to dissipate power at a level, Pt, during operation of the converter, a second set of the power semiconductor devices being mounted on the bottom surface and electrically connected to dissipate power at a level, Pb, during operation of the converter,wherein the power semiconductor devices are distributed between the first and second sets to distribute heat generation during operation of the converter such that each level Pt, Pb is less than 150% of the other level Pb, Pt. 8. The apparatus of claim 7 wherein the electrical circuit further comprises a magnetic core, and at least one of the first and second external surfaces is also defined by a surface of the magnetic core. 9. The apparatus of claim 8 further comprising: an adapter for providing mechanical and electrical connections between the modular package and an external mounting substrate, the adapter having a body and a plurality of electrical terminals; andelectrical connections formed between the adapter terminals and respective interconnects on the modular package,the adapter body being mechanically secured to the modular package and covering the electrical connections;the adapter terminals being arranged to mate with the external mounting substrate. 10. The apparatus of claim 7, comprising a portion of a mold panel, in which a surface of the portion of the mold panel forms at least a portion of the first external surface. 11. An electrical apparatus comprising: a first body having a generally rectangular shape, including a first surface having a generally rectangular shape, a second surface having a generally rectangular shape, and four sidewalls each having a generally rectangular shape and extending between the first and second surfaces, each sidewall comprising at least one planar segment;a first cured-encapsulant layer forming at least a portion of the first surface;a second cured-encapsulant layer forming at least a portion of the second surface;a printed circuit board (“PCB”) sandwiched between the first and second cured-encapsulant layers;a plurality of electrical components mounted to the PCB and electrically interconnected by conductive traces formed in or on the PCB, the electrical components being embedded in at least one of the cured-encapsulant layers;a plurality of electrical contacts, each embedded within a respective planar segment of a respective sidewall, and electrically connected to the PCB, the planar segment comprises at least a portion of the first and second cured-encapsulant layers;wherein each electrical contact is essentially coplanar with a respective surface of the respective planar segment;wherein each sidewall comprises a strip of PCB sandwiched between the first and second cured-encapsulant layers. 12. The electrical apparatus of claim 11, further comprising a magnetic core mounted on the PCB, and at least one of the first and second surfaces is also defined by a surface of the magnetic core. 13. The electrical apparatus of claim 12 further comprising: an adapter for providing mechanical and electrical connections between the first body and an external mounting substrate, the adapter having a second body and a plurality of electrical terminals; andelectrical connections formed between the adapter terminals and respective electrical contacts on the first body,the adapter body being mechanically secured to the first body and covering the electrical connections;the adapter terminals being arranged to mate with the external mounting substrate. 14. The electrical apparatus of claim 11 in which the first body comprises a power converter including: the PCB, in which the PCB comprises a plurality of conductive layers and having a top surface and a bottom surface; anda magnetic core structure magnetically coupled to a winding formed by traces in one or more of the conductive layers in the PCB;wherein the components comprise power semiconductor devices, a first set of the power semiconductor devices being mounted on the top surface and electrically connected to dissipate power at a level, Pt, during operation of the converter, a second set of the power semiconductor devices being mounted on the bottom surface and electrically connected to dissipate power at a level, Pb, during operation of the converter,wherein the power semiconductor devices are distributed between the first and second sets to distribute heat generation during operation of the converter such that each level Pt, Pb is less than 150% of the other level Pb, Pt.
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이 특허에 인용된 특허 (30)
John R. Saxelby, Jr. ; Walter R. Hedlund, III, Circuit encapsulation.
Combs, Edward G.; Sheppard, Robert P.; Pun, Tai Wai; Ng, Hau Wan; Fan, Chun Ho; McLellen, Neil Robert, Enhanced thermal dissipation integrated circuit package.
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