초록 ▼

Integrated circuits and processes for manufacturing integrated circuits are described that use printed wiring board substrates having a core layer that is part of the circuit of the printed wiring board. In a number of embodiments, the core layer is constructed from a carbon composite. In several em

Integrated circuits and processes for manufacturing integrated circuits are described that use printed wiring board substrates having a core layer that is part of the circuit of the printed wiring board. In a number of embodiments, the core layer is constructed from a carbon composite. In several embodiments, techniques are described for increasing the integrity of core layers in designs calling for high density clearance hole drilling. One embodiment of the invention includes a core layer that includes electrically conductive material and at least one build-up wiring portion formed on an outer surface of the core layer. In addition, the build-up portion comprises at least one micro wiring layer including a circuit that is electrically connected to the electrically conductive material in the core layer via a plated through hole.

대표청구항 ▼

1. A printed wiring board substrate, comprising: a core layer that includes a carbon plate;a layer of metal that is clad by resin to one side of the carbon plate and thereby defines the outer surface of the core layer; wherein the layer of metal includes an interior surface from which protrusions (d

1. A printed wiring board substrate, comprising: a core layer that includes a carbon plate;a layer of metal that is clad by resin to one side of the carbon plate and thereby defines the outer surface of the core layer; wherein the layer of metal includes an interior surface from which protrusions (dendrites) extend, and a plurality of the protrusions (dendrites) contact the carbon plate; andat least one build-up wiring portion formed on the layer of metal;wherein the build-up portion includes a dielectric layer comprising non-reinforced dielectric formed on the layer of metal; andwherein the build-up portion comprises at least one micro wiring layer including a circuit that is electrically connected to the carbon plate in the core layer via a plated through hole. 2. The printed wiring board substrate of claim 1, wherein the coefficient of thermal expansion of the core layer is lower than the coefficient of thermal expansion of the at least one build-up portion. 3. The printed wiring board substrate of claim 1, wherein the core layer is configured to act as a ground plane. 4. The printed wiring board substrate of claim 1, wherein the core layer is configured to act as a power plane. 5. The printed wiring board substrate of claim 1, wherein the core layer is configured to act as a split power and ground plane. 6. The printed wiring board substrate of claim 1, wherein the core layer comprises a first electrically conductive layer that is bonded to a second electrically conductive layer by a dielectric layer that electrically isolates the first layer from the second layer. 7. The printed wiring board substrate of claim 1, wherein: a second layer of metal is clad onto a second side of the carbon plate;a second build-up wiring portion is formed on the second layer of metal;a plated through hole connects a circuit on a micro wiring layer in the first build up wiring portion with a circuit on a micro wiring layer in the second build up wiring portion; andthe plated through hole is electrically isolated form the electrically conductive material in the core layer by a resin filled clearance hole. 8. The printed wiring board substrate of claim 1, wherein the core layer has a coefficient of thermal expansion of between 0 ppm/° C. and 12 ppm/° C. in the surface spreading direction. 9. The printed wiring board substrate of claim 8, wherein the core layer has a coefficient of thermal expansion of between 0 ppm/° C. and 9 ppm/° C. in the surface spreading direction. 10. The printed wiring board substrate of claim 1, wherein the core layer has a thermal conductivity of between 2 W/m·K and 500 W/m·K in the surface spreading direction. 11. The printed wiring board substrate of claim 1, wherein the core layer has a thermal conductivity of between 50 W/m·K and 1000 W/m·K in the surface spreading direction. 12. The printed wiring board substrate of claim 1, wherein the core layer has a tensile modulus of between 5 msi and 35 msi in the surface spreading direction. 13. The printed wiring board substrate of claim 1, wherein the core layer has a tensile modulus of between 10 msi and 40 msi in the surface spreading direction. 14. The printed wiring board substrate of claim 1, wherein the core layer has a dielectric constant that is greater than 6.0 at 1 MHz. 15. The printed wiring board of claim 1, wherein the core layer has a thickness that is at least 30% of the thickness of the printed wiring board substrate. 16. The printed wiring board of claim 1, wherein the layer of metal includes an exterior surface that is planar.