This chassis (2) is made of a clad material in which a first layer (21) made of austenite stainless steel, a second layer (22) made of Cu or a Cu alloy, stacked on the first layer, and a third layer (23) made of austenite stainless steel, stacked on the side of the second layer opposite to the first
This chassis (2) is made of a clad material in which a first layer (21) made of austenite stainless steel, a second layer (22) made of Cu or a Cu alloy, stacked on the first layer, and a third layer (23) made of austenite stainless steel, stacked on the side of the second layer opposite to the first layer are roll-bonded to each other, and the thickness of the second layer is at least 15% of the thickness of the clad material.
대표청구항▼
1. A chassis made of a clad material in which a first layer made of austenite stainless steel, a second layer made of Cu or a Cu alloy, stacked on the first layer, and a third layer made of austenite stainless steel, stacked on a side of the second layer opposite to the first layer are roll-bonded t
1. A chassis made of a clad material in which a first layer made of austenite stainless steel, a second layer made of Cu or a Cu alloy, stacked on the first layer, and a third layer made of austenite stainless steel, stacked on a side of the second layer opposite to the first layer are roll-bonded to each other, wherein a thickness of the second layer is at least 15% and not more than 60% of a thickness of the clad material, andthe chassis is employed as the chassis of a device containing an electronic component radiating heat. 2. The chassis according to claim 1, wherein the thickness of the second layer is at least 20% of the thickness of the clad material. 3. The chassis according to claim 2, wherein the thickness of the second layer is at least 30% of the thickness of the clad material. 4. The chassis according to claim 1, wherein the thickness of the second layer is not more than 50% of the thickness of the clad material. 5. The chassis according to claim 1, wherein the first layer and the third layer are made of austenite stainless steel, and an average value of a thickness of the third layer is at least 95% and not more than 105% of an average value of a thickness of the first layer. 6. The chassis according to claim 1, wherein the thickness of the clad material is not more than 0.3 mm. 7. The chassis according to claim 1, wherein the first layer and the third layer are made of austenite stainless steel, and the second layer is made of Cu. 8. The chassis according to claim 7, wherein the first layer and the third layer are made of SUS 304. 9. The chassis according to claim 7, wherein the first layer and the third layer are made of SUS 301. 10. The chassis according to claim 1, employed as the chassis of a portable device intrinsically containing an electronic component radiating heat. 11. The chassis according to claim 10, with which the electronic component radiating heat is in contact. 12. The chassis according to claim 1, having a surface metal layer on at least a part of the chassis. 13. The chassis according to claim 12, having the surface metal layer on a substantially entire surface of the chassis. 14. The chassis according to claim 12, having the surface metal layer formed by plating on at least the part of the chassis. 15. The chassis according to claim 12, having the surface metal layer formed by roll-bonding on at least the part of the chassis. 16. The chassis according to claim 12, wherein the surface metal layer is made of Sn or a Sn alloy. 17. The chassis according to claim 12, wherein the surface metal layer is made of Ni or a Ni alloy. 18. A method for manufacturing a chassis, comprising: roll-bonding a first layer made of austenite stainless steel, a second layer made of Cu or a Cu alloy, and a third layer made of austenite stainless steel to each other in a state where the first layer, the second layer, and the third layer are stacked in this order to form a clad material such that a thickness of the second layer is at least 15% and not more than 60% of a thickness of the clad material, anddiffusion-annealing the clad material,wherein the chassis is employed as the chassis of a device containing an electronic component radiating heat. 19. The method for manufacturing a chassis according to claim 18, wherein the step of roll-bonding the first layer, the second layer, and the third layer in the stacked state and the step of diffusion-annealing the clad material are alternately performed a plurality of times.
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이 특허에 인용된 특허 (7)
Kinoshita,Kyoichi; Yoshida,Takashi; Sugiyama,Tomohei; Kudo,Hidehiro; Kono,Eiji; Tanaka,Katsufumi, Composite material and method for manufacturing the same.
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