Imploding barrel initiator and related methods
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F42C-019/12
F42B-003/12
F42B-003/195
F42C-019/08
출원번호
US-0822032
(2015-08-10)
등록번호
US-9423229
(2016-08-23)
발명자
/ 주소
Rice, Brett A.
출원인 / 주소
The United States of America as represented by the Secretary of the Navy
대리인 / 주소
Monsey, Christopher A.
인용정보
피인용 횟수 :
0인용 특허 :
6
초록▼
Apparatuses and methods are provided including electrically fired detonator are provided using, e.g., secondary explosives (SE), that have increased safety and reliability relative to primary explosives (PE). PEs require a lower amount of energy or shock to detonate than SEs thus are more difficult
Apparatuses and methods are provided including electrically fired detonator are provided using, e.g., secondary explosives (SE), that have increased safety and reliability relative to primary explosives (PE). PEs require a lower amount of energy or shock to detonate than SEs thus are more difficult to initiate than PEs; SEs are less sensitive to shock or energy than PEs. SEs increase safety but suffer design difficulties in using such SEs in place of PEs that are more susceptible to undesired detonation. Various embodiments are provided including a metalized barrel with a specific thickness that is filled with a SE having a required diameter that has structures that provide efficient transfer/conversion of electrical energy into a detonation of the SE by, among other things, reducing electrical and mechanical/chemical losses. Embodiments of the invention also include various methods of design, use, and manufacturing.
대표청구항▼
1. An explosive device comprising: a first substrate formed with a non-electrically conductive material formed with a first and second side as well as a first, second, and third aperture through said substrate from said first to said second side, wherein said second aperture is formed in a tapering
1. An explosive device comprising: a first substrate formed with a non-electrically conductive material formed with a first and second side as well as a first, second, and third aperture through said substrate from said first to said second side, wherein said second aperture is formed in a tapering shape where one end is larger than another end;a first metallization layer formed between said first and second apertures on said first side;a second metallization layer formed between said second and third apertures on said second side;an adhesion layer formed on a wall section defined by said second aperture from said first to said second side,a third metallization layer formed on said adhesion layer, wherein a portion of said third metallization layer is electrically coupled with said first and second metallization layers at, within and adjacent to said second aperture;a first explosive disposed within said second aperture from said first side to said second side, wherein said first explosive is any explosive having an equal or lower sensitivity to shock than PETN;a second explosive positioned on said first side and positioned over said second aperture;wherein said second explosive positioned in proximity or contact with said first explosive;a second substrate formed, coupled with, and disposed on said second side of said first substrate, said second substrate is formed with a material and coupled with said first substrate that is configured to confine a detonation of said first explosive within said second aperture no less than a first force produced from said first explosive, said second substrate is further formed with a fourth and fifth aperture that align with said first and third apertures;wherein said first and second apertures are formed with a conductive section operable to receive an electric current up to a first predetermined level and also to mechanically couple said first substrate to another structure;wherein said second aperture is formed with a diameter no smaller than a critical diameter of said first explosive required to sustain detonation of said first explosive;wherein said third metallization layer is formed with a width determined based on energy required to turn said third metallization layer into a plasma sufficient to create said first shock or energy level;wherein said first and second metallization layers are at least one hundred times thicker than said third metallization layer. 2. A device as in claim 1, wherein said second metallization layer comprises gold. 3. A device as in claim 1, wherein said first explosive comprises one of a group having said first force or shock of at least one of a group comprising RSI007, EDF11, CL-20, and HNSIV based explosives. 4. A device as in claim 1, further comprising an aperture formed between and into the first and second substrates passing outside of said first and second substrates operable to vent gasses from said first explosive below said first force. 5. A device as in claim 1, wherein said second explosive comprises a material having a second force or shock of at least one of a group comprising lead azide and lead styphnate. 6. A device as in claim 1, further comprising a third substrate disposed between said second explosive and said first substrate on said first side, said third substrate is formed with a sixth aperture or sleeve through said third substrate said sixth aperture or sleeve is perpendicular to said first side and is formed to align its sides coaxially with and over said second aperture's wall, said device further comprises a flyer disposed in releasable fixed contact with said first explosive on one end of said sixth aperture facing said first side of said first substrate, said flyer is configured to be driven through an inner channel by said first force or shock to impact and detonate said second explosive. 7. A method of designing and manufacturing an explosive device comprising: providing a first substrate formed with a non-electrically conductive material formed with a first and second side as well as a first, second, and third aperture through said substrate from said first to said second side, wherein said second aperture is formed in a tapering shape where one end is larger than another end;providing a first metallization layer formed between said first and second apertures on said first side;providing a second metallization layer formed between said second and third apertures on said second side;providing and forming an adhesion layer formed on a wall section defined by said second aperture from said first to said second side;providing and forming a third metallization layer formed on said adhesion layer, wherein said third metallization is electrically coupled with said first and second metallization layers;providing and forming a first explosive disposed within said second aperture from said first side to said second side, wherein said first explosive is any explosive having an equal or lower sensitivity to shock than PETN;providing and forming a second explosive positioned on said first side and positioned over said second aperture, wherein said second explosive is formed with a position in proximity or contact with said first explosive; andproviding a second substrate formed, coupled with, and disposed on said second side of said first substrate, said second substrate is formed with a material and coupled with said first substrate that is configured to confine a detonation of said first explosive within said second aperture no less than a first force produced by detonation of said first explosive, said second substrate is further formed with a fourth and fifth aperture that align with said first and third apertures;wherein said first and second apertures are formed with a conductive section operable to receive an electric current up to a first predetermined level and also to mechanically coupled said first substrate to another structure;wherein said second aperture is formed with a diameter no smaller than a critical diameter of said first explosive required to sustain detonation of said first explosive;wherein said third metallization layer is formed with a width determined based on energy required to turn said third metallization layer into a plasma sufficient to create said first shock or energy level;wherein said first and second metallization layers are at least one hundred times thicker than said third metallization layer. 8. A device as in claim 7, wherein said second metallization layer comprises gold. 9. A device as in claim 7, wherein said first explosive comprises one of a group having said first force or shock sensitivity of at least one of a group comprising RSI007, EDF11, CL-20, and HNSIV based explosives. 10. A device as in claim 7, wherein said second explosive comprises a material having a second force or shock of at least one of a group comprising lead azide and lead styphnate. 11. A device as in claim 7, further comprising providing an aperture formed between and into the first and second substrates passing outside of said first and second substrates operable to vent gasses from said first explosive below said first force. 12. A device as in claim 7, further comprising a third substrate disposed between said second explosive and said first substrate on said first side, said third substrate is formed with a sixth aperture or sleeve through said third substrate said sixth aperture or sleeve is perpendicular to said first side and is formed to align its sides coaxially with and over said second aperture's wall, said device further comprises a flyer disposed in releasable fixed contact with said first explosive on one end of said sixth aperture facing said first side of said first substrate, said flyer is configured to be driven through an inner channel by said first force or shock to impact and detonate said second explosive.
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이 특허에 인용된 특허 (6)
Nance, Christopher J.; Yelverton, John; Hart, Charles; Meadows, Michael, Apparatus for detonating a triaminotrinitrobenzene charge.
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