A server includes a tray that has a front portion and a back portion. A motherboard is disposed in the front portion of the tray and the motherboard is coupled to a heat sink. A fan is disposed in the back portion of the tray. A hard drive is disposed between the motherboard and the fan and the hard
A server includes a tray that has a front portion and a back portion. A motherboard is disposed in the front portion of the tray and the motherboard is coupled to a heat sink. A fan is disposed in the back portion of the tray. A hard drive is disposed between the motherboard and the fan and the hard drive is operatively connected to the motherboard. The server also includes a heat pipe that has a body longitudinally bounded by an inlet and an outlet. The inlet is coupled to the heat sink, while the outlet is coupled to the fan. The body of the heat pipe extends past the hard drive. A power supply is also disposed in the tray and is operatively connected to the motherboard, the fan, and the hard drive.
대표청구항▼
1. A server, comprising: a tray having a front portion and a back portion;a motherboard disposed in the front portion of the tray, the motherboard coupled to a heat sink;a fan disposed in the back portion of the tray;a hard drive disposed between the motherboard and the fan, the hard drive operative
1. A server, comprising: a tray having a front portion and a back portion;a motherboard disposed in the front portion of the tray, the motherboard coupled to a heat sink;a fan disposed in the back portion of the tray;a hard drive disposed between the motherboard and the fan, the hard drive operatively connected to the motherboard;a heat pipe having a body longitudinally bounded by an inlet and an outlet, wherein: the body of the heat pipe does not touch the hard drive and is fabricated from heat conducting materials,the inlet is coupled to the heat sink,the outlet is coupled to the fan,the body of the heat pipe extending past the hard drive, andthe body of the heat pipe conducts heat from the heat sink past the hard drive and toward the fan;an insulator that insulates the hard drive from heat contained within the heat pipe and from heat contained in the heat conducting materials of the body of the heat pipe; anda power supply disposed in the tray, the power supply operatively connected to the motherboard, the fan, and the hard drive. 2. The server of claim 1, further comprising an input/output (I/O) terminal disposed in the front portion of the tray, the I/O terminal operatively connected to the motherboard. 3. The server of claim 1, wherein the heat pipe includes copper. 4. The server of claim 1, wherein the tray is installed in a rack having a plurality of trays, each tray having multiple hard drives for storing data. 5. The server of claim 1, wherein the body of the heat pipe extends past the hard drive while being disposed beneath the hard drive. 6. The server of claim 1, wherein the body of the heat pipe extends past the hard drive while being disposed above the hard drive. 7. The server of claim 1, wherein the body of the heat pipe extends past the hard drive while being disposed adjacent to hard drive. 8. A method for cooling a server component with a heat pipe, comprising: coupling a first end of the heat pipe in a server to a heat sink, wherein a body of the heat pipe is fabricated from heat conducting materials;coupling a second end of the heat pipe to a fan;routing the body of the heat pipe to direct heat away from a hard drive, wherein the body of the heat pipe does not touch the hard drive;transferring heat from the heat sink towards the fan through the heat pipe, wherein the body of the heat pipe conducts heat from the heat sink toward the fan, and the heat pipe is positioned to prevent exposing the hard drive to heat which affects the hard drive performance; andinsulating the hard drive from heat contained within the heat pipe and from heat contained in the heat conducting materials of the body of the heat pipe by an insulator at the heat pipe. 9. The method of claim 8, wherein the body of the heat pipe extends past the hard drive while being disposed beneath the hard drive. 10. The method of claim 8, wherein the body of the heat pipe extends past the hard drive while being disposed above the hard drive. 11. The method of claim 8, wherein the body of the heat pipe extends past the hard drive while being disposed adjacent to hard drive. 12. The method of claim 8, where the heat pipe includes copper.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (148)
Barker ; III Charles R. (Harvard MA) Olson Richard E. (Rindge NH), Adaptive cooling system.
Bhargava Vikram (Alpharetta GA) Muntner Donald A. (Stone Mountain GA) Cone Ronald H. (Jefferson GA) Heberling James R. (Lawrenceville GA) Hicks Mark E. (Norcross GA) Harris Samuel W. (Norcross GA) Ku, Apparatus for rack mounting multiple circuit boards.
Mondor Robert M. (Sutton MA) Howards Mark (Belmont MA) Barker ; III Charles R. (Harvard MA) Selling Alan R. (Franklin MA), Cabinet for a computer assembly.
Antonuccio Robert S. ; Stewart Thomas E. ; Spano Joseph M. ; Palazola Mathew J. ; Izzicupo William A. ; Carney James M. ; Gonsalves Daniel D. ; Pugliese Mark R., Computer with high airflow and low acoustic noise.
Niklos John R. (Worthington OH), Cooling device for electronic components arranged in a vertical series and vertical series of electronic devices contain.
Miller David Jonathan,GBX ; Sams Ian James,GBX ; Holland Michael James,GBX ; Fields Simon David,GBX, Cooling system for use in cooling electronic equipment.
Casanova Wayne J. (Rochester MN) Corfits William D. (Rochester MN) Dimmick Roger F. (Rochester MN) Thompson Gary A. (Pine Island MN) Thorpe James R. (Stewartville MN) Wheeler Stephen E. (Rochester MN, Double-sided logic cage.
Strickler Mike, Electromagnetic interference (EMI) shield for electrical components, an internal EMI barrier, and a storage enclosure for electrical/electronic components.
Hasegawa Hiroshi,JPX ; Tochiyama Kazunori,JPX, Electromagnetic shielding apparatus for a memory storage disk module which permits air flow for cooling.
Kobayashi, Takashi; Ogushi, Tetsuro; Tsujimori, Atsushi; Kamoya, Yoshihiro, Evaporator, a heat absorber, a thermal transport system and a thermal transport method.
Slade Boyd (Austin TX) Carver Walter R. (Round Rock TX) Caramagno Brad D. (Austin TX) Coleman Henry S. (Austin TX), Expandable modular computer system.
Varaiya Rooshabh (Cupertino CA) Ng David S. (Saratoga CA) Pauker Armando (Sunnyvale CA) Ferchau Joerg U. (Morgan Hill CA), Fault tolerant modular subsystems for computers.
Eberhardt Anthony N. ; Dailey William L. ; Harada John A., Hard disk drive assembly which has a plenum chamber and a fan assembly that is perpendicular to a rack chamber.
Bodette Edward James ; Bulluck John Gary ; Durham Christopher Lee ; Miles Anthony Wayne ; Oakley Brian Scott, Low profile computer or communications network interconnecting device and housing therefor.
Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Method and system for cooling electronics racks using pre-cooled air.
Rosecan Albert F. ; Geanakos James J. ; Grajewski Joseph S. ; Hernandez Juan J. ; Morales Juan L. ; Reich James F. ; Williams Michael S. ; Yore Everett L., Modular computer tower assembly.
Cutts Stanley J. (Winchester GB2) Gaunt David (Southampton GB2) Golledge Ian (Romsey GB2) Hamper Albert (Fareham NY GB2) Johnson Eric (Greene NY) Newmarch David (Romsey GB2) Veal John (Southampton GB, Modular housing.
Hobbs Forrest B. (Eau Claire WI) Blewett Richard G. (Altoona WI) Wentzka Scott A. (Eau Claire WI) Chen Steve S. (Eau Claire WI) Sheets Kitrick B. (Eau Claire WI) Stevens Sheldon D. (Eau Claire WI), Packaging architecture for a data server.
Basara Michael (Milan NC ITX) Kneale Collan B. (Ashville NC) Lucente Samuel A. (Stamford CT) Natoli John (Woodstock NY), Rack based packaging system for computers with cable, cooling and power management module.
Good Lowell M. (Cypress TX) Varghese Paily T. (Tomball TX) Villanueva Joseph A. (Spring TX), Server drawer slide mount apparatus for a rack-mounted computer system.
Wyler Gregory T. (Winchester MA), Silent air cooled computer having a hard disk drive with an acoustic shield and a heat sink arranged exterior to the dri.
Roy Christopher E. (Plymouth MA), Telecommunications switch chassis having housing with front and rear compartments divided by interior partition and remo.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.