Method of replacing an existing contact of a wafer probing assembly
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01R-043/20
G01R-035/00
G01R-001/067
B32B-038/10
G01R-001/073
출원번호
US-0854725
(2013-04-01)
등록번호
US-9429638
(2016-08-30)
발명자
/ 주소
Smith, Kenneth R.
출원인 / 주소
Cascade Microtech, Inc.
대리인 / 주소
Dascenzo Intellectual Property Law, P.C.
인용정보
피인용 횟수 :
0인용 특허 :
828
초록
The contacts of a probing apparatus are elastically supported on a replaceable coupon and electrically interconnected with conductors on a membrane or a space transformer.
대표청구항▼
1. A method of replacing an existing contact of a wafer probing assembly, the method comprising: separating an existing coupon from a support surface of the wafer probing assembly, wherein the existing coupon includes an existing elastomeric layer and an existing contact, wherein the support surface
1. A method of replacing an existing contact of a wafer probing assembly, the method comprising: separating an existing coupon from a support surface of the wafer probing assembly, wherein the existing coupon includes an existing elastomeric layer and an existing contact, wherein the support surface is defined by a dielectric support and a support conductor, wherein the existing coupon is detachably affixed to the support surface by an existing adhesive bond, and further wherein the separating includes breaking the existing adhesive bond; anddetachably affixing a replacement coupon to the support surface of the wafer probing assembly with a replacement adhesive to form a replacement adhesive bond, wherein the replacement coupon includes a replacement elastomeric layer and a replacement contact, and further wherein the detachably affixing further includes establishing electrical communication between the replacement contact and the support conductor. 2. The method of claim 1, wherein the dielectric support and the support conductor form a portion of a flexible membrane assembly, and further wherein the separating includes separating the existing coupon from the flexible membrane assembly. 3. The method of claim 1, wherein the dielectric support and the support conductor form a portion of a space transformer, and further wherein the separating includes separating the existing contact from the space transformer. 4. The method of claim 1, wherein the method includes separating the existing contact from the support surface without separating the dielectric support from the wafer probing assembly. 5. The method of claim 1, wherein the separating and the detachably adhering include re-using the dielectric support. 6. The method of claim 1, wherein, subsequent to the separating and prior to the detachably adhering, the method further includes aligning the replacement coupon with the support surface. 7. The method of claim 6, wherein the aligning includes aligning the replacement contact with the support conductor to permit the electrical communication between the replacement contact and the support conductor subsequent to the detachably affixing. 8. The method of claim 1, wherein the method includes initiating the method responsive to wear of the existing contact. 9. The method of claim 1, wherein the existing contact is configured to engage a first selected location of a first device surface that is defined by a first device, wherein the replacement contact is configured to engage a second selected location of a second device surface that is defined by a second device, wherein the first selected location is different from the second selected location, and further wherein the method includes initiating the method subsequent to probing the first device with the wafer probing assembly and prior to probing the second device with the wafer probing assembly. 10. The method of claim 1, wherein the replacement contact includes a rigid, elongate contact beam, a contact tip, and a post, wherein the contact tip extends from a first end of the contact beam, wherein the post extends from a second end of the contact beam, and further wherein the detachably affixing includes establishing electrical communication between the post and the support conductor. 11. The method of claim 1, wherein the method further includes testing a device with the wafer probing assembly, wherein the testing includes engaging a contact tip of the replacement coupon with a selected location on a device surface that is defined by the device. 12. The method of claim 11, wherein the replacement coupon is a first replacement coupon, wherein, subsequent to the testing, the method further includes repeating the separating to separate the first replacement coupon from the support surface, and further wherein, subsequent to the repeating the separating, the method further includes repeating the detachably affixing to detachably affix a second replacement coupon, which includes a second replacement elastomeric layer and a second replacement contact, to the support surface.
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이 특허에 인용된 특허 (828)
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Woollam, John A.; Pfeiffer, Galen L.; Thompson, Daniel W.; Johs, Blaine D.; Herzinger, Craig M., System and method enabling simultaneous investigation of sample with two beams of electromagnetic radiation.
Piety Richard W. ; Bowers ; III Stewart V. ; Gaddis David Q., System and method for measuring and analyzing electrical signals on the shaft of a machine.
Johnsgard Kristian E. ; Mattson Brad S. ; McDiarmid James ; Zeitlin Vladimir J., System and method for thermal processing of a semiconductor substrate.
Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Test assembly including a test die for testing a semiconductor product die.
Swart Mark A. (Upland CA) Johnston Charles J. (Walnut CA) Van Loan David R. (Diamond Bar CA), Test fixture alignment system for printed circuit boards.
Evans Arthur (Brookfield Center CT) Baker Joseph R. (New Milford CT) Rising Robert P. (Trumbull CT), Test probe assembly for testing integrated circuit devices.
Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan ; Walker George Frederick, Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof.
Beaman Brian S. (Hyde Park NY) Fogel Keith E. (Bardonia NY) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Shih Da-Yuan (Poughkeepsie NY) Walker George F. (New York NY), Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer.
Carrieri, Arthur H.; Roese, Erik S.; Colclough, Stephen J.; Schlitzkus, Peter J.; Younger, V. Kenneth; Orndoff, James R., Thermal luminescence liquid monitoring system and method.
Byrnes Herbert P. (Poughkeepsie NY) Halbout Jean-Marc (Larchmont NY) Scheuermann Michael R. (Katonah NY) Shapiro Eugene (Stamford CT), Thin interface pellicle for dense arrays of electrical interconnects.
Beaman Brian S. (Hyde Park NY) Doany Fuad E. (Katonah NY) Fogel Keith E. (Bardonia NY) Hedrick ; Jr. James L. (Oakland CA) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Ritsko John, Three dimensional high performance interconnection package.
Iwakura Kenichi (Kawasaki JPX) Ohtsuka Tetsuo (Kawasaki JPX), Touch sensor unit of prober for testing electric circuit and electric circuit testing apparatus using the touch sensor u.
Sleva Michael Z. (Atlanta GA) Hunt William D. (Decatur GA) Connuck David M. (Augusta GA) Briggs Ronald D. (Duluth GA), Ultrasonic transducer and method for using same.
Mizuta Masaharu,JPX, Vertical needle type probe card, method of manufacturing thereof, method of replacing defective probe needle and test method of wafer using the probe card.
Harwood Warren K. (Vancouver WA) Koxxy Martin J. (Hillsboro OR) Tervo Paul A. (Vancouver WA), Wafer probe station with integrated environment control enclosure.
Mallory Roy E. (Bedford MA) Domenicali Peter (Montepelier VT) Poduje Noel S. (Needham Heights MA) Belyaev Alexander (Wayland MA) Harvey Peter A. (Wilmington MA) Smith Richard S. (Harvard MA), Wafer testing and self-calibration system.
Kleinberg Robert L. (Ridgefield CT) Clark Brian (Missouri City TX) Chew Weng C. (Champaign IL) Mariani David (Darien CT), Well logging apparatus for determining dip, azimuth, and invaded zone conductivity.
Howland, Jr.,William H.; Hillard,Robert J.; Hung,Steven Chi Shin, Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof.
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