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Wafer-scale package including power source

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/12
  • A61N-001/375
출원번호 US-0079957 (2016-03-24)
등록번호 US-9431312 (2016-08-30)
발명자 / 주소
  • O'Brien, Richard J
  • Day, John K
  • Gerrish, Paul F
  • Mattes, Michael F
  • Ruben, David A
  • Grief, Malcolm K
출원인 / 주소
  • Medtronic, Inc.
대리인 / 주소
    Mburu, Evans M.
인용정보 피인용 횟수 : 0  인용 특허 : 120

초록

A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material

대표청구항

1. A method comprising: connecting a control module to one of a first substrate and a second substrate, wherein the first substrate includes at least one of a first semiconductor material and a first insulating material, wherein the second substrate includes at least one of a second semiconductor ma

이 특허에 인용된 특허 (120)

  1. Enquist,Paul M.; Fountain, Jr.,Gaius Gillman; Tong,Qin Yi, 3D IC method and device.
  2. Tongbi Jiang ; Chad A. Cobbley, Apparatus and method of stacking die on a substrate.
  3. DuBrucq Denyse (West Allis WI), Application of sheet batteries as support base for electronic circuits.
  4. Vendramin Giuseppe,ITX, Ball grid array module.
  5. Levy Didya D. (Brooklyn NY), Bone generating method and device.
  6. Beristain Charles D. (West Hartford CT), Capacitive pressure sensor with low parasitic capacitance.
  7. Ikeda Masaharu,JPX ; Esashi Masayoshi,JPX, Capacitive transducer having guard electrode and buffer amlifying means.
  8. Hembree David R. ; Akram Salman, Circuit and method for heating an adhesive to package or rework a semiconductor die.
  9. Weinberg Alvin H. (Moorpark CA) Maston Robert E. (Aptos CA), Combined pacemaker substrate and electrical interconnect and method of assembly.
  10. Grebe Robert K. (Scottsdale AZ) Lucius John E. (Glendale AZ) Szczesny David S. (Glendale AZ), Component-carrying adapter for chip carrier socket.
  11. Jenson,Mark Lynn; Klaassen,Jody Jon; Weiss,Victor Henry; Yan,Jenn Feng, Device enclosures and devices with integrated battery.
  12. Ogawa, Hiroyuki; Wu, Yider; Sun, Yu, Die seal for semiconductor device moisture protection.
  13. Devlin Philip H. ; Cordero Rafael M. ; Chamoun Nassib G. ; Shambroom John R. ; Fendrock Charles ; McDaniel Terrie L., Electrode array system for measuring electrophysiological signals.
  14. Philip H. Devlin ; Rafael M. Cordero ; Nassib G. Chamoun ; John R. Shambroom ; Charles Fendrock ; Terrie L. McDaniel, Electrode array system for measuring electrophysiological signals.
  15. Muyshondt Jorge E. (Austin TX) Parker Gary A. (Round Rock TX) Wilkie Bruce J. (Georgetown TX), Faraday cage for a printed circuit card.
  16. Schroen Walter H. ; Archer Judith S. ; Terrill Robert E., Fully hermetic semiconductor chip, including sealed edge sides.
  17. Bates, John B., Getters for thin film battery hermetic package.
  18. O'Brien, David; Courcimault, Christophe; You, Liang; Allen, Mark; Fonseca, Michael; Cros, Florent, Hermetic chamber with electrical feedthroughs.
  19. O'Brien, David; Courcimault, Christophe; You, Liang; Joung, Yeun-Ho; Allen, Mark, Hermetic chamber with electrical feedthroughs.
  20. Farnworth Warren M. (Nampa ID) Akram Salman (Boise ID) Wood Alan G. (Boise ID), Hermetic chip and method of manufacture.
  21. Bartlett, James L.; Wooldridge, James R.; Olson, Christopher G., Hermetic chip scale packaging means and method including self test.
  22. Schulman, Joseph H., Hermetic feedthrough for an implantable device.
  23. Wong, Marvin Glenn, Hermetic seals for electronic components.
  24. Morrison Paul-David (Round Rock TX), Hermetic semiconductor device having jumper leads.
  25. Fillion Raymond A. (Niskayuna NY) Kornrumpf William P. (Albany NY) Bernard Edward S. (Manlius NY), Hermetically packaged HDI electronic system.
  26. Burns Carmen D. (Austin TX), Hermetically sealed ceramic integrated circuit heat dissipating package.
  27. Fenner, Andreas Armin; Batchelder, Geoffrey; Gerrish, Paul F.; Larson, Lary R.; Malin, Anna J.; Marrott, Trevor D.; Mueller, Tyler; Ruben, David A., Hermeticity testing.
  28. Allen,Mark; Fonseca,Michael; White,Jason; Kroh,Jason; Stern,David, High Q factor sensor.
  29. LaFond,Peter H.; Yu,Lianzhong, High performance MEMS packaging architecture.
  30. Mikkor Mati (Ann Arbor MI), High temperature pressure sensor with low parasitic capacitance.
  31. Gonzalez,Carlos A.; Ofman,Leo, I/C package/thermal-solution retention mechanism with spring effect.
  32. Miesel Keith A., Implantable pressure sensor and method of fabrication.
  33. Rich, Collin A.; Zhang, Yafan; Najafi, Nader, Implantable sensing device for physiologic parameter measurement.
  34. Fonseca, Michael; Allen, Mark; Stern, David; White, Jason; Kroh, Jason, Implantable wireless sensor for pressure measurement within the heart.
  35. Annamalai Nagappan K. (Nashua NH), In-line determination of presence of liquid phase moisture in sealed IC packages.
  36. Guruswami M. Sridharan ; Kartik M. Sridharan, Integrated circuit die having an interference shield.
  37. Campbell William (Oldham GB2), Integrated circuit package.
  38. Smith William D. (Fremont CA) Dennis Richard (Ettons PA) Brathwaite Nicholas (Sunnyvale CA) Blish ; II Richard C. (Saratoga CA), Integrated circuit package for surface mount technology.
  39. Hundt, Michael J.; Du, Haibin; Kelappan, Krishnan; Sigmund, Frank, Integrated circuit package including embedded thin-film battery.
  40. McCain,Joseph, Integrated circuit package with laminated power cell having coplanar electrode.
  41. Hundt Michael J. (Double Oak TX) Kelappan Krishnan (Carrollton TX), Integrated circuit package with molded cell.
  42. Dudderar Thomas Dixon ; Kossives Dean Paul ; Low Yee Leng, Integrated circuit packages with improved EMI characteristics.
  43. Danzl, Ralph B.; Ruben, David A.; Sandlin, Michael S., Laser assisted direct bonding.
  44. Guziak,Robert; Tory,David, Lead embedded pressure sensor.
  45. McLellan Neil (Garland TX) Strittmatter Mike (Carrollton TX) Hundt Joseph P. (Corinth TX) Sells Christopher M. (Carrollton TX) Scherpenberg Francis A. (Carrollton TX), Low profile sockets and modules for surface mountable applications.
  46. Rybnicek,Kimon, MEMS device trench plating process and apparatus for through hole vias.
  47. Askew, Ray, Magnetic and electric shielding of on-board devices.
  48. Pastel, Michelle Nicole Haase; Strines, Brian Paul, Mask and method for sealing a glass envelope.
  49. Rumer,Christopher L.; Singh,Kuljeet, Method and apparatus for a dual substrate package.
  50. Hofmann, Alexander; Hierl, Stefan; Brunnecker, Frank, Method and apparatus for irradiation welding of two thermoplastic components.
  51. You, Liang, Method and apparatus for microjoining dissimilar materials.
  52. Mattes, Michael F.; Danzl, Ralph B., Method for forming suspended microstructures.
  53. Tong, Qin-Yi; Fountain, Jr., Gaius Gillman; Enquist, Paul M., Method for low temperature bonding and bonded structure.
  54. Tong,Qin Yi; Fountain, Jr.,Gaius Gillman; Enquist,Paul M., Method for low temperature bonding and bonded structure.
  55. Tong, Qin-Yi; Enquist, Paul M.; Rose, Anthony Scot, Method for room temperature metal direct bonding.
  56. Kadowaki Akira (Mobara JPX) Itoh Shigeo (Mobara JPX) Kogure Youich (Mobara JPX) Tonegawa Takeshi (Mobara JPX), Method for sealedly forming envelope.
  57. Haisma Jan (Eindhoven NLX) Spierings Gijsbertus (Eindhoven NLX) Van Lierop Joseph G. (Eindhoven NLX) Van Den Berg Hendrik F. (Eindhoven NLX), Method of bonding together two bodies with silicon oxide and practically pure boron.
  58. Haisma Jan (Eindhoven NLX) Adema Cornelis L. (Eindhoven NLX) Alting Cornelis L. (Eindhoven NLX) Brehm Rudolf (Eindhoven NLX), Method of bonding two parts together.
  59. Fraser, David; Doyle, Brian, Method of creating shielded structures to protect semiconductor devices.
  60. Tong,Qin Yi; Fountain, Jr.,Gaius Gillman, Method of detachable direct bonding at low temperatures.
  61. Tong, Qin-Yi, Method of epitaxial-like wafer bonding at low temperature and bonded structure.
  62. Tilmans Hendrikus A. C.,NLX ; Beyne Eric,BEX ; Van de Peer Myriam,BEX, Method of fabrication of a microstructure having an internal cavity.
  63. MacIntyre,Donald M., Method of forming hermetic wafer scale integrated circuit structure.
  64. Ma Manny K. F., Method of making a structure for providing signal isolation and decoupling in an integrated circuit device.
  65. Mikkor Mati (Ann Arbor MI), Method of making silicon capacitive pressure sensor with glass layer between silicon wafers.
  66. Bond Robert H. ; Siegel Harry M., Method of mounting an integrated circuit to a mounting surface.
  67. Taguchi Yutaka (Osaka JPX) Eda Kazuo (Nara JPX) Kanaboshi Akihiro (Osaka JPX) Ogura Tetsuyoshi (Osaka JPX) Tomita Yoshihiro (Osaka JPX), Method of processing a piezoelectric device.
  68. Tong,Qin Yi, Method of room temperature covalent bonding.
  69. Hua,Yaping; Li,Zongya; Zhao,Yang, Method of wafer-level packaging using low-aspect ratio through-wafer holes.
  70. Horning,Robert D.; Ridley,Jeffrey A., Methods and systems for providing MEMS devices with a top cap and upper sense plate.
  71. Fortin, Jeffrey Bernard; Wu, Guanghua (George); Subramanian, Kanakasabapathi, Microelectromechanical system pressure sensor and method for making and using.
  72. Fortin,Jeffrey; Kishore,Kuna; Subramanian,Kanakasabapathi, Microelectromechanical system pressure sensor and method for making and using.
  73. Srinivas Tadigadapa ; Chialun Tsai ; Yafan Zhang ; Nader Najafi, Micromachined fluidic apparatus.
  74. Sosniak Jacob (Millburn NJ) Unger Burton A. (Berkeley Heights NJ), Moisture level determination in sealed packages.
  75. Licari James J. (15711 Arbela Dr. Whittier CA 90803) Tanielian Aram (7013 Cherty Dr. Rancho Palos Verdes CA 92075), Moisture sensor for electronic modules.
  76. Shambroom John R. (Arlington MA), Monitor and method for acquiring and processing electrical signals relating to bodily functions.
  77. Schugt,Michael A., Monolithic integrated circuit/pressure sensor on pacing lead.
  78. Miesel Keith A. ; Roberts Jonathan P. ; Olson John C. ; LaFond Roger ; Chatelle Brenda ; Stetz Eric M., Multiple sensor assembly for medical electric lead.
  79. Park, Jin Woo, Organic light emitting display having a second frit portion configured to melt more easily than a frit portion.
  80. Martin John R. ; Roberts ; Jr. Carl M., Package for sealing an integrated circuit die.
  81. Skinner, Harry G.; Calvin, Sam E., Package integrated faraday cage to reduce electromagnetic emissions from an integrated circuit.
  82. Casavant, David A., Permanent atrial-his-ventricular sequential pacing.
  83. Jakobsen, Henrik, Pressure sensor.
  84. Mothilal, Kamal Deep; Schugt, Michael A.; Ruben, David A.; Roberts, Jonathan P.; Norgaard, Clark B.; Larson, Lary R., Pressure sensor configurations for implantable medical electrical leads.
  85. Roberts Jonathan P., Pressure sensor with increased sensitivity for use with an implantable medical device.
  86. Wiese, Lynn Karl; Jensen, Earl M., Process condition measuring device with shielding.
  87. Cho Steve T., Process for bonding a shell to a substrate for packaging a semiconductor.
  88. Staller Steven Edward, Process for verifying a hermetic seal and semiconductor device therefor.
  89. Moriyasu Miyazaki JP; Hidenori Yukawa JP; Hideyuki Oh-Hashi JP; Masatoshi Nii JP, RF circuit module.
  90. Gerber Mark A. ; Strittmatter Michael K. ; McLellan Neil ; Hundt Joseph P., Replaceable power module.
  91. Lutz, Markus, SI wafer-cap wafer bonding method using local laser energy, device produced by the method, and system used in the method.
  92. Jacobsen,Henrik; Kvisteroy,Terje, Sealed capacitive sensor for physical measurements.
  93. Park Eun-Chul,KRX ; Yoon Jun-Bo,KRX ; Yoon Euisik,KRX, Sealed-type remote pressure-monitoring device and method for fabricating the same.
  94. Pichler,Karl; Frischknecht,Kyle D., Sealing of electronic device using absorbing layer for glue line.
  95. Staller, Steven Edward, Semiconductor device with means for verifying a hermetic seal therefor.
  96. Farnworth Warren D. (Boise ID) Duesman Kevin (Boise ID) Heitzeberg Ed (Boise ID), Semiconductor dies and wafers and methods for making.
  97. Frazee Lawrence E. (Huntington NY) Fraioli Anthony V. (Essex Fells NJ), Semiconductor package with integral hermeticity detector.
  98. Brennan, Kenneth D., Shielded planar capacitor.
  99. Fraser, David; Doyle, Brian, Shielded structures to protect semiconductor devices.
  100. Enquist, Paul M., Single mask via method and device.
  101. Cordero Rafael M. ; Devlin Philip H. ; Chamoun Nassib G. ; Shambroom John R. ; Merrick Edwin B. ; Melo Joao, Smart electrophysiological sensor system with automatic authentication and validation and an interface for a smart electrophysiological sensor system.
  102. Smith ; Jr. John W. (Dallas TX) Scherpenberg Francis A. (Carrollton TX) Jiang Ching-Lin (Dallas TX) Bolan Michael L. (Dallas TX), Space-saving back-up power supply.
  103. Van Heerden, Clive R.; Marmaropoulos, George, Squeezable electrode assembly.
  104. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.
  105. Dixon D. Craig (Lewisville TX) Hundt Michael J. (Double Oak TX), Surface mountable integrated circuit package with integrated battery mount.
  106. Kramer,Andrew P.; Stahmann,Jeffrey E., System and method for cardiac rhythm management with synchronized pacing protection period.
  107. Haluzak,Charles C; Piehl,Arthur; Chen,Chien Hua; Shih,Jennifer, System and method for direct-bonding of substrates.
  108. Allen Mark G. ; English Jennifer M., System, method, and sensors for sensing physical properties.
  109. Ruben, David A.; Sandlin, Michael S., Techniques for bonding substrates using an intermediate layer.
  110. Enquist,Paul M.; Fountain,Gaius, Three dimensional device integration method and integrated device.
  111. Paul M. Enquist, Three dimensional device integration method and integrated device.
  112. Woodman John K. (601 Mystic La. Foster City CA 94404), Three dimensional integrated circuit package.
  113. Krupetsky, Dmitriy; Schmid, Anthony P.; Ludwig, Paul N., Tuned sealing material for sealing of a flat panel display.
  114. Soderlund Ernest E. (Hoffman Estates IL), Universal test circuit for integrated circuit packages.
  115. Enquist, Paul M.; Tong, Qin Yi; Fountain, Jr., Gaius Gillman; Markunas, Robert, Wafer bonding hermetic encapsulation.
  116. Enquist, Paul M.; Tong, Qin-Yi; Fountain, Jr., Gaius Gillman; Markunas, Robert, Wafer bonding hermetic encapsulation.
  117. Wang, Zhiqi; Yu, Guoqing; Xu, Qinqin; Wang, Wei, Wafer level chip size package for MEMS devices and method for fabricating the same.
  118. O'Brien, Richard J.; Day, John K.; Gerrish, Paul F.; Mattes, Michael F.; Ruben, David A.; Grief, Malcolm K., Wafer-scale package including power source.
  119. Tracy C. Edwin (Golden CO) Benson David K. (Golden CO), Welding/sealing glass-enclosed space in a vacuum.
  120. Queyssac Daniel (Dallas TX), Zero power IC module.
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