Pb-free copper-alloy sliding material, and plain bearing
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B22F-007/08
C22C-001/04
C22C-009/00
C22C-009/02
F16C-033/12
C22C-009/04
C22C-009/08
출원번호
US-0493617
(2012-06-11)
등록번호
US-9434005
(2016-09-06)
우선권정보
JP-2007-129615 (2007-05-15)
발명자
/ 주소
Yokota, Hiromi
Mukai, Ryo
Kato, Shinichi
Hamaguchi, Nahomi
출원인 / 주소
Taiho Kogyo Co., Ltd.
대리인 / 주소
Birch, Stewart, Kolasch & Birch, LLP
인용정보
피인용 횟수 :
0인용 특허 :
5
초록▼
A method of producing a Pb-free copper-alloy sliding material containing 1.0 to 15.0% of Sn, 0.5 to 15.0% of Bi and 0.05 to 5.0% of Ag, and Ag and Bi from an Ag—Bi eutectic. If necessary, at least one of 0.1 to 5.0% of Ni, 0.02 to 0.2% P, 0.5 to 30.0% of Zn, and 1.0 to 10.0 mass % of at least one of
A method of producing a Pb-free copper-alloy sliding material containing 1.0 to 15.0% of Sn, 0.5 to 15.0% of Bi and 0.05 to 5.0% of Ag, and Ag and Bi from an Ag—Bi eutectic. If necessary, at least one of 0.1 to 5.0% of Ni, 0.02 to 0.2% P, 0.5 to 30.0% of Zn, and 1.0 to 10.0 mass % of at least one of a group consisting of Fe3P, Fe2P, FeB, NiB and AlN may be added.
대표청구항▼
1. A method for producing a Pb-free sintered copper-alloy sliding material, comprising: preparing a copper alloy powder consisting of, by mass percentage, 1.0 to 15.0% of Sn, 2 to 10% of Bi and 0.05 to 5.0% of Ag, with the balance being Cu and unavoidable impurities;heating said copper alloy powder
1. A method for producing a Pb-free sintered copper-alloy sliding material, comprising: preparing a copper alloy powder consisting of, by mass percentage, 1.0 to 15.0% of Sn, 2 to 10% of Bi and 0.05 to 5.0% of Ag, with the balance being Cu and unavoidable impurities;heating said copper alloy powder to a temperature in a range of 700 to 900 degrees C.; and,cooling said copper alloy, in which said Sn, Bi and Ag are dissolved in solid copper alloy, under a condition that said Ag and Bi form an Ag—Bi eutectic, and neither Ag nor Bi are essentially dissolved in a Cu matrix, and Ag and Bi are not precipitated in a morphology except for said Ag—Bi eutectic. 2. The method according to claim 1, wherein a cooling speed at an Ag—Bi eutectic temperature is 200 degrees per minute. 3. A method for producing a Pb-free sintered copper-alloy sliding material comprising: preparing a copper alloy powder consisting of, by mass percentage, 1.0 to 15.0% of Sn, 2 to 10% of Bi, 0.05 to 5.0% of Ag, at least one of 0.1 to 5.0% of Ni, 0.02 to 0.2% P, and 0.5 to 30.0% of Zn, with the balance being Cu and unavoidable impurities;heating said copper alloy powder to a temperature in a range of 700 to 900 degrees C.; and,cooling said copper alloy, in which said Sn, Bi and Ag are dissolved in solid copper alloy, under a condition that said Ag and Bi form an Ag—Bi eutectic, neither Ag nor Bi are essentially dissolved in a Cu matrix, and Ag and Bi are not precipitated in a morphology except for said Ag—Bi eutectic. 4. The method according to claim 3, wherein a cooling speed at an Ag—Bi eutectic temperature is 200 degrees per minute. 5. The method for producing a Pb-free sintered copper-alloy sliding material according to claim 1, further comprising the steps of preparing an at least one hard-particle powder selected from the group consisting of Fe3P, Fe2P, FeB, NiB and AlN, having an average particle diameter of 1.5 to 70 μm, in an amount of 1.0 to 10.0% by mass relative to total of said copper alloy powder and hard-particle powder; and mixing said copper alloy powder and said hard particle powder prior to heating to a temperature in a range of 700 to 900 degrees C. 6. The method for producing a Pb-free sintered copper-alloy sliding material according to claim 2, further comprising the steps of preparing an at least one hard-particle powder selected from the group consisting of Fe3P, Fe2P, FeB, NiB and AlN, having an average particle diameter of 1.5 to 70 μm, in an amount of 1.0 to 10.0% by mass relative to total of said copper alloy powder and hard-particle powder; and mixing said copper alloy powder and said hard particle powder prior to heating to a temperature in a range of 700 to 900 degrees C. 7. The method according to claim 1, wherein the heating is carried out on a backing metal. 8. The method according to claim 5, wherein the heating is carried out on a backing metal. 9. The method according to claim 6, wherein the heating is carried out on a backing metal.
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