IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0600480
(2015-01-20)
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등록번호 |
US-9439327
(2016-09-06)
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발명자
/ 주소 |
- Sheng, Honggang
- Kim, Sangsun
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출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
0 인용 특허 :
11 |
초록
▼
Systems and methods are provided for cooling electronic equipment in a data center. Ambient air is vertically circulated from a workspace across a plurality of rack-mounted electronic devices. The electronic devices are located in a plurality of trays such that each tray has a major plane that is su
Systems and methods are provided for cooling electronic equipment in a data center. Ambient air is vertically circulated from a workspace across a plurality of rack-mounted electronic devices. The electronic devices are located in a plurality of trays such that each tray has a major plane that is substantially parallel to a side plane of the rack. The circulated air is cooled with a heat exchanger that is connected to a vertical end of the rack via a sealed interface. Multiple racks can be arrayed in a distributed cooling arrangement, which increases reliability and scalability of the data center.
대표청구항
▼
1. A data center cooling system, comprising: a plurality of racks, each rack comprising: an air circulation fan positioned to vertically circulate ambient air from a workspace across a plurality of rack-mounted electronic devices located in a plurality of trays in the rack;a respective heat exchange
1. A data center cooling system, comprising: a plurality of racks, each rack comprising: an air circulation fan positioned to vertically circulate ambient air from a workspace across a plurality of rack-mounted electronic devices located in a plurality of trays in the rack;a respective heat exchanger, mounted to an end of the rack, and in fluid communication with the plurality of rack-mounted electronic devices through an airflow path that is positioned between the rack and the heat exchanger and is thermally sealed to the workspace, to receive and cool heated air from the rack; anda hot air plenum, local to the rack, for capturing the air heated by the plurality of rack-mounted the electronic devices, wherein the hot air plenum is thermally isolated from the workspace; andcooling equipment for cooling the captured air. 2. The data center cooling system of claim 1, further comprising a control terminal for controlling the plurality of racks, wherein each rack further comprises a respective control assembly for locally regulating operation of at least one of the heat exchanger or the air circulation fan, and the control terminal communicates with respective control assemblies of the plurality of racks for regulating the operations. 3. The data center cooling system of claim 1, wherein the air circulation fan is located in a respective plenum that is local to each rack, and the plenum is mounted between the end of the rack and the heat exchanger and is thermally isolated from the workspace. 4. The data center cooling system of claim 1, wherein each rack further comprises an additional air circulation fan located in a respective plenum that is located at another end of the rack. 5. The data center cooling system of claim 1, wherein the heat exchanger is configured to re-circulate the cooled air to the workspace, and wherein the re-circulated cooled air has a temperature that is substantially equal to a target temperature of the ambient air in the workspace. 6. The data center cooling system of claim 1, wherein each rack has a major plane and is arranged so that its major plane is substantially parallel to a side plane of the rack and substantially perpendicular to a vertical end plane of the rack and to a front plane of the rack. 7. The data center cooling system of claim 1, wherein each device has a width dimension, a depth dimension, and a height dimension, wherein the height dimension is longer than the width dimension, and wherein the device is mounted to a corresponding tray having the major plane substantially parallel to the height dimension. 8. The data center cooling system of claim 1, wherein the rack-mounted electronic devices are open to the workspace from at least one of a front side or a back side of the rack during operation. 9. The data center cooling system of claim 1, further comprising processing circuitry located at least in part on the rack, the processing circuitry configured to: monitor an ambient temperature of the workspace;determine if the monitored ambient temperature exceeds a threshold; andin response to determining that the monitored ambient temperature exceeds the threshold, perform at least one of: increasing a flow of the circulated air across the plurality of rack-mounted electronic devices, ordecreasing a cooling temperature in the heat exchanger. 10. A method of cooling electronic equipment in a data center, comprising: vertically circulating ambient air from a workspace across a plurality of rack-mounted electronic devices to heat the ambient air, the plurality of rack-mounted electronic devices located in a plurality of trays in a rack of a plurality of racks in the data center;cooling the heated air that is circulated from the rack with a respective heat exchanger, wherein the heat exchanger is mounted to an end of the rack and in fluid communication with the plurality of rack-mounted electronic devices through an airflow path that is positioned between the rack and the heat exchanger and is thermally sealed to the workspace, the cooling comprising: capturing the air heated by the electronic devices in a hot air plenum local to the rack, wherein the hot air plenum is thermally isolated from the workspace; andcooling the captured air using cooling equipment; andre-circulating the cooled air to the workspace. 11. The method of claim 10, wherein each rack comprises a respective air circulation fan positioned to vertically circulate the ambient air from the workspace. 12. The method of claim 11, wherein each rack comprises a respective control assembly for locally regulating operation of at least one of the heat exchanger or the air circulation fan, and the data center includes a control terminal configured to control the plurality of racks and communicate with respective control assemblies of the plurality of racks for regulating the operations. 13. The method of claim 11, wherein the air circulation fan is located in a respective plenum that is local to each rack, and the plenum is mounted between the end of the rack and the heat exchanger and is thermally isolated from the workspace. 14. The method of claim 11, wherein each rack further comprises an additional air circulation fan located in a respective plenum that is located at another end of the rack. 15. The method of claim 10, wherein the re-circulated cooled air has a temperature that is substantially equal to a target temperature of the ambient air in the workspace. 16. The method of claim 10, wherein the rack-mounted electronic devices are open to the workspace from at least one of a front side or a back side of the rack during operation. 17. The method of claim 10, wherein each rack has a major plane and is arranged so that its major plane is substantially parallel to a side plane of the rack and is substantially perpendicular to a vertical end plane of the rack and to a front plane of the rack. 18. The method of claim 10, further comprising: monitoring an ambient temperature of the workspace;determining if the monitored ambient temperature exceeds a threshold; andin response to determining that the monitored ambient temperature exceeds the threshold, performing at least one of: increasing a flow of the circulated air across the plurality of rack-mounted electronic devices, ordecreasing a cooling temperature in the heat exchanger.
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