Clamping mechanism for processing of a substrate within a substrate carrier
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-023/00
H01L-027/146
출원번호
US-0179779
(2014-02-13)
등록번호
US-9443819
(2016-09-13)
발명자
/ 주소
Afable, Gerard Anthony C.
Toc, Howell John Chua
Venkatesappa, Prakash
Teo, Kok Peng
Yang, Annabelle Q.
출원인 / 주소
Apple Inc.
대리인 / 주소
Blakely, Sokoloff, Taylor & Zafman LLP
인용정보
피인용 횟수 :
0인용 특허 :
20
초록▼
A method and clamping apparatus for securing a substrate within a substrate carrier during an ultrasonic mounting process. The clamping apparatus may include a substrate carrier having a top plate and a bottom plate, the top plate and the bottom plate forming a cavity dimensioned to hold a substrate
A method and clamping apparatus for securing a substrate within a substrate carrier during an ultrasonic mounting process. The clamping apparatus may include a substrate carrier having a top plate and a bottom plate, the top plate and the bottom plate forming a cavity dimensioned to hold a substrate. A clamping plate is positioned on a side of the top plate opposite the bottom plate, the clamping plate having an opening aligned with the cavity and a pair of clamping members, each of the pair of clamping members extending toward a center of the opening and through the cavity such that the clamping member presses portions of the substrate exposed through the opening against the bottom plate. The method may include providing a clamping plate having an opening configured for alignment with a cavity formed in a substrate carrier and mounting a pair of resilient arms to the clamping plate.
대표청구항▼
1. A clamping apparatus for securing a substrate within a substrate carrier during an ultrasonic mounting process, the apparatus comprising: a substrate carrier having a top plate and a bottom plate, the top plate having a first side and a second side, the first side faces a direction opposite to th
1. A clamping apparatus for securing a substrate within a substrate carrier during an ultrasonic mounting process, the apparatus comprising: a substrate carrier having a top plate and a bottom plate, the top plate having a first side and a second side, the first side faces a direction opposite to that of the second side, and wherein when the first side of the top plate is positioned on the bottom plate, the top plate and the bottom plate form a cavity dimensioned to hold a substrate within the cavity; anda clamping plate dimensioned to be positioned on the second side of the top plate, the clamping plate having an opening that aligns with the cavity and a pair of clamping members, each of the pair of clamping members dimensioned to extend toward a center of the opening and through the cavity such that when a substrate is positioned within the cavity, the clamping member presses portions of the substrate exposed through the opening against the bottom plate. 2. The apparatus of claim 1 wherein each of the pair of clamping members have a resilient arm individually attached to the clamping plate. 3. The apparatus of claim 1 wherein the clamping plate comprises a different material than the pair of clamping members. 4. The apparatus of claim 1 wherein the clamping members are made of copper beryllium. 5. The apparatus of claim 1 wherein each of the pair of clamping members have a first portion mounted to a bottom side of the clamping plate, a second portion positioned within the cavity and a bent portion between the first portion and the second portion. 6. The apparatus of claim 1 wherein each of the pair of clamping members are mounted to portions of the clamping plate along opposite sides of the opening. 7. The apparatus of claim 1 wherein the cavity comprises a substrate opening positioned between a first clamping member opening and a second clamping member opening, the substrate opening dimensioned to expose opposing sides of a substrate positioned therein, and the first and second clamping member openings dimensioned to receive portions of the pair of clamping members. 8. A clamping apparatus for securing a substrate within a substrate carrier during an ultrasonic mounting process, the apparatus comprising: a substrate carrier having a top plate and a bottom plate, the top plate and the bottom plate forming a cavity dimensioned to hold a substrate within the cavity; anda clamping plate having a pair of clamping members, the clamping plate having an opening extending entirely through the clamping plate that aligns with the cavity, each of the pair of clamping members extending toward a center of the opening and through the cavity such that when a substrate is positioned within the cavity and the clamping plate is positioned on the top plate, the clamping member presses portions of the substrate exposed through the opening against the bottom plate. 9. The apparatus of claim 8 wherein the top plate comprises a first side and a second side, the first side faces a direction opposite to that of the second side, and wherein the first side of the top plate is positioned on the bottom plate to form the cavity dimensioned to hold the substrate within the cavity. 10. The apparatus of claim 8 wherein the top plate comprises a first side and a second side, and wherein the first side of the top plate is positioned on the bottom plate to form the cavity dimensioned to hold the substrate within the cavity and the clamping plate is positioned on, and is in contact with, the second side of the top plate. 11. The apparatus of claim 8 wherein at least one of the clamping members forming the pair of clamping members comprises an integrally formed resilient member having a mounting portion, a clamping portion, and a bent portion connecting the mounting portion and the clamping portion. 12. The apparatus of claim 8 wherein at least one of the clamping members forming the pair of clamping members comprises a mounting portion mounted to a bottom side of the clamping plate and a clamping portion that bends over a top side of the substrate exposed through the opening in the clamping plate. 13. The apparatus of claim 8 wherein at least one of the clamping members forming the pair of clamping members comprises a planar mounting portion and a planar clamping portion, the planar mounting portion is mounted to the clamping plate and the planar clamping portion extends from the planar mounting portion in a direction away from the clamping plate. 14. A clamping apparatus for securing a substrate within a substrate carrier during an ultrasonic mounting process, the apparatus comprising: a substrate carrier having a top plate and a bottom plate, the top plate having a first side and a second side, the first side faces a direction opposite to that of the second side, and wherein when the first side of the top plate is positioned on the bottom plate, the top plate and the bottom plate form a cavity dimensioned to hold a substrate within the cavity; anda clamping plate dimensioned to be positioned on the second side of the top plate, the clamping plate having an opening extending entirely through the clamping plate that aligns with the cavity and a pair of clamping members, each of the pair of clamping members dimensioned to extend toward a center of the opening and through the cavity such that when a substrate is positioned within the cavity, the clamping member presses portions of the substrate exposed through the opening against the bottom plate.
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이 특허에 인용된 특허 (20)
Ziegler Hans J. (Milwaukee WI), Cable bonding clamp.
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