A system for processing surfaces of substrates having a process module having a process module frame and a plurality of process elements to process the substrate surfaces without contacting the substrate surfaces. A plurality of substrate holder assemblies, each having a number of substrate holders,
A system for processing surfaces of substrates having a process module having a process module frame and a plurality of process elements to process the substrate surfaces without contacting the substrate surfaces. A plurality of substrate holder assemblies, each having a number of substrate holders, each of which is removably coupled to the process module frame, each substrate holder configured to hold a substrate. The process module frame has alignment features aligning the substrate holders in the substrate holder assembly in repeatable alignment with respect to each of the process elements with each of the process elements located between the substrates. A loader module is configured to unload processed substrates from each of the substrate holder assemblies and load unprocessed substrates to each of the substrate holder assemblies. A transporter is configured to transport the substrate holder assemblies to and from the process module and the loader module.
대표청구항▼
1. A system for processing surfaces of a plurality of substrates, the system comprising: a process module having a process module frame and having a plurality of process elements to fluid process substrate surfaces of the plurality of substrates without contacting the substrate surfaces;a plurality
1. A system for processing surfaces of a plurality of substrates, the system comprising: a process module having a process module frame and having a plurality of process elements to fluid process substrate surfaces of the plurality of substrates without contacting the substrate surfaces;a plurality of substrate holder assemblies, each having a plurality of separable substrate holders, each of which is removably coupled to the process module frame, each substrate holder in the substrate holder assembly configured to hold a substrate so that each substrate holder holds a different substrate in the substrate holder assembly for transport as a unit with the substrate holder assembly;the process module frame having alignment features individually aligning each of the substrate holders in the substrate holder assembly in repeatable alignment with respect to each of the process elements in the plurality of process elements with each of the process elements in the plurality of process elements being located and projecting at least in part in between the substrate holders in the substrate holder assembly;a loader module configured to unload the plurality of processed substrates from each of the substrate holder assemblies and load a plurality of unprocessed substrates to each of the substrate holder assemblies; anda transporter configured to transport each of the substrate holder assemblies to and from the process module and the loader module. 2. The system of claim 1 further comprising a second process module, wherein the transporter is configured to transport each of the substrate holder assemblies to and from the process module, the second process module and the loader module. 3. The system of claim 1 further comprising a substrate transport front end configured to transport the unprocessed substrates from substrate carriers to the loader module and further configured to transport processed substrates from the loader module to the substrate carriers. 4. The system of claim 1, wherein the surfaces of the substrates are in a substantially vertical orientation. 5. The system of claim 1, wherein the plurality of process elements comprises an array of agitation members configured to induce fluid motion to agitate a fluid proximate the substrate surfaces without contacting the substrate surfaces. 6. The system of claim 1, wherein the substrate holder assembly is removable from the process module frame as a unit. 7. The system of claim 1, wherein each substrate holder in the substrate holder assembly is removable from the process module frame independent of the other holders in the substrate holder assembly. 8. A system for processing surfaces of a plurality of substrates, the system comprising: a process module frame having a plurality of process elements to fluid process substrate surfaces of the plurality of substrates without contacting the substrate surfaces;a substrate holder assembly having a plurality of separable substrate holders, each of which is removably coupled to the process module frame, each substrate holder in the substrate holder assembly configured to hold a substrate so that each substrate holder holds a different substrate in the substrate holder assembly for transport as a unit with the substrate holder assembly, each substrate holder in the substrate holder assembly being independently moveable and positionable relative to the other substrate holders in the substrate holder assembly;each of the substrate holders in the substrate holder assembly in repeatable individual alignment with respect to each of the process elements in the plurality of process elements with each of the process elements in the plurality of process elements being located and projecting at least in part in between the substrate holders in the substrate holder assembly;a loader module configured to unload a plurality of processed substrates from each of the substrate holder assemblies and load a plurality of unprocessed substrates to each of the substrate holder assemblies; anda transporter configured to transport each of the substrate holder assemblies to and from the process module and the loader module. 9. The system of claim 8 further comprising a second process module, wherein the transporter is configured to transport each of the substrate holder assemblies to and from the process module, the second process module and the loader module. 10. The system of claim 8 further comprising a substrate transport front end configured to transport the unprocessed substrates from substrate carriers to the loader module and further configured to transport processed substrates from the loader module to the substrate carriers. 11. The system of claim 8, wherein the surfaces of the substrates are in a substantially vertical orientation. 12. The system of claim 8, wherein the plurality of process elements comprises an array of agitation members configured to induce fluid motion to agitate a fluid proximate the substrate surfaces without contacting the substrate surfaces. 13. The system of claim 8, wherein the substrate holder assembly is removable from the process module frame as a unit. 14. The system of claim 8, wherein each substrate holder in the substrate holder assembly is removable from the process module frame independent of the other holders in the substrate holder assembly. 15. A system for fluid processing one or more substrate surfaces arrayed in a fluid, the system comprising: a process module frame having a plurality of process elements to fluid process the substrate surfaces without contacting the substrate surfaces;a substrate holder assembly having a plurality of separable substrate holders, each of which is removably coupled to the process module frame, each substrate holder in the substrate holder assembly configured to hold a substrate so that each substrate holder holds a different substrate in the substrate holder assembly for transport as a unit with the substrate holder assembly, each substrate holder in the substrate holder assembly being independently moveable and positionable relative to the other substrate holders in the substrate holder assembly;each of the substrate holders in the substrate holder assembly being positionable in repeatable individual alignment with respect to a corresponding process element of the plurality of process elements and independent of other process elements of the plurality of process elements, each of the process elements in the plurality of process elements being located and projecting at least in part in between the substrate holders in the substrate holder assembly, and wherein the substrate surfaces are maintained in substantially parallel alignment and in an upright orientation;a loader module configured to unload a plurality of processed substrates from each of the substrate holder assemblies and load a plurality of unprocessed substrates to each of the substrate holder assemblies; anda transporter configured to transport each of the substrate holder assemblies to and from the process module and the loader module. 16. The system of claim 15 further comprising a second process module, wherein the transporter is configured to transport each of the substrate holder assemblies to and from the process module, the second process module and the loader module. 17. The system of claim 15 further comprising a substrate transport front end configured to transport the unprocessed substrates from substrate carriers to the loader module and further configured to transport processed substrates from the loader module to the substrate carriers. 18. The system of claim 15, wherein the plurality of process elements comprises an array of agitation members configured to induce fluid motion to agitate a fluid proximate the substrate surfaces without contacting the substrate surfaces. 19. The system of claim 15, wherein the substrate holder assembly is removable from the process module frame as a unit. 20. The system of claim 15, wherein each substrate holder in the substrate holder assembly is removable from the process module frame independent of the other holders in the substrate holder assembly.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (132)
Nichols, Ernest C.; Malmin, Jr., Leo L., Adjustable wafer transfer machine.
Dexter Jeffrey L. (North Dartmouth MA) Fairweather William E. (Mattapoisett MA) Shurtleff Harold R. (Buzzards Bay MA), Apparatus and method for cleaning wafers.
Nanbu Mitsuhiro (Kumamoto-ken JPX) Iida Naruaki (Kumamoto JPX) Gotou Hideaki (Kumamoto-ken JPX) Tateyama Masanori (Kumamoto JPX) Yoshimoto Yuji (Kumamoto-ken JPX) Ishimoto Tomoko (Kumamoto JPX) Yaega, Apparatus for processing substrates having a film formed on a surface of the substrate.
Jang, Taek Young; Lee, Byoung Il, Holder manufacturing method for loading substrate of semiconductor manufacturing device, batch type boat having holder, loading/unloading method of semiconductor substrate using the same, and semiconductor manufacturing device having the same.
Matsunaga, Tatsuhisa; Teramoto, Masahiro; Akutsu, Norio; Noto, Kouichi, Method and apparatus for processing substrates and method for manufacturing a semiconductor device.
Matsunaga, Tatsuhisa; Teramoto, Masahiro; Akutsu, Norio; Noto, Kouichi, Method and apparatus for processing substrates and method for manufacturing a semiconductor device.
Larson, Robert E.; Simondet, Sean D.; Zimmerman, David C.; Maciej, Todd K.; Matthys, Quirin W., Reduced footprint tool for automated processing of microelectronic substrates.
Aichert Hans (Hanau am Main DEX) Dietrich Walter (Hanau am Main DEX) Hauff Alfred (Bruchkobel DEX) Stephan Herbert (Bruchkobel DEX) Stark Friedrich (Langenselbold DEX), Vacuum coating apparatus having a plurality of lock chambers.
Balg Christian,CHX ; Strasser Bernhard,CHX ; Blattner Jakob,CHX, Wafer gripping device adapted to swivel wafers taken from a horizontal position in a storage container.
Flegal ; deceased Christopher (late of New City NY by Gisela H. Flegal ; legal representative), Wafer processing machine vacuum front end method and apparatus.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.